日立化成 テクニカルレポート

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1 ISSN

2 Photec RY-3200 / Photec RY-3219 /20/20µm /8/8µm /10/10µm

3 RY

4 Contents Commentary 5 Kazuyoshi Tanaka Trend in Pressure Sensitive Adhesive Film for Surface Protection 7 Hiroshi Matsuoka Undercoat Film for Reflective LCDs 15 Yasuo TsuruokaToshikatsu ShimazakiTakeshi Yoshida Discrete and Flexible Optical-Fiber-Wiring Board for Backplane 19 Shigeharu ArikeHiroshi KawazoeAtsusi Takahashi Photosensitive Dry FilmPhoTec RY-3200 Seriesfor Semiconductor Package Boards 23 Tatsuya IchikawaNoriyo KimuraKyouko OzawaShinji Takano Low Wafer Stress i-line Definable Polyimide 27 Akihiro SasakiMasahiro MiyasakaMasahiko Hiro Products Guide

5 µm 1,0001,000 /cm 2 DNASTM

6 well known 6

7 U.D.C / : Trend in Pressure Sensitive Adhesive Film for Surface Protection Hiroshi Matsuoka Pressure Sensitive Adhesive (PSA) film is attached on various industrial products to protect their surfaces from injury derived possible during their production, handling, storage, and transportation. It is an important subsidiary material for improving the processability and yield. Hitachi Chemical's PSA film series, HITALEX, have been on the market since 1972, and have been used in a variety of application fields. In this paper, we will introduce our new PSA films which meet the recent and future needs for the PSA films used in the ever developing display field

8 van der Waals dyne/cm 2 Cathode Ray Tube CRTLiquid Crystal Display LCD Plasma Display PanelPDP ELElectroluminescenceFEDField Emission Display Flat Panel DisplayFPDLCDPDP 20 FPD CRT CRT L-5000 LCD LCD LCD 8

9 LCD1960 PCPC TV LCD DSMDynamic Scattering ModeTN Twisted NematicSTNSuper Twisted Nematic TSTNTriple Super Twisted Nematic LCD L-7300 Ra50µm 9

10 10 L L-7300 L-8000 L-8000 Tg

11 11

12 12 L-8000 L-8000 DA-1000

13 µ DA-1000X DVD PDP 200cd/m PDP PDP VCCI 13

14 PDP PDP PDP IVH IVHRS FPC PVCFP QFNCSP RM 1 JIS Z G.M.Barrow BP 7 P.J.Flory ,086, ,197, 408B1 11 6,207, 266B

15 U.D.C :[678.6/.7-419:535:361.2]: Undercoat Film for Reflective LCDs Yasuo Tsuruoka Toshikatsu Shimazaki Takeshi Yoshida LCD Reflective color LCDs have a built-in diffuse reflecting substrate with a fine rugged surface to randomly reflect and scatter the incident light in order to produce a clear picture. The main challenges in designing for such LCDs reflectors are how to improve light reflecting efficiency and prevent light interference. We investigated these problems from the material and manufacturing-process point of view and developed new undercoat film for reflectors. This film has an optimally designed and controlled uneven surface that provides seamless and stable reflectors with excellent reflection properties. Reflectors can be easily produced by mounting the film on LCD substrates and evaporating the metal layer on the film. LCD LCD LCD 1 10 LCDLCD

16 LCD 2 2 LCD LCD LCD LCD LCD 3.5µm

17 µ µ LCD nm LCD LCD 4 26µm0.10.5µm LCD LCD LCD 17

18 m/min mJ/cm m/min 10N/m SEM µ 370mm470mm SEM µ LCD 1 2 3LCD 20 4 LCD K.Tsuda, et al :Design of reflector with rough surface for High Reflective TFT-LCD (HR-TFT)AM-LCD'98, pp pp

19 U.D.C. [ : ]: : Discrete and Flexible Optical-Fiber-Wiring Board for Backplane Shigeharu Arike Hiroshi Kawazoe Atsusi Takahashi MWB 0.23dB0.58dB 1mm/600mm In recent years, to cope with the increasing demand for high speed and large volume data transfer in the communications system, the optical signal capable of transferring a much greater volume of data has begun to prevail in place of the electrical signal. In particular, discrete and flexible optical-fiber-wiring boards are now being introduced in North America to the backplane which connects between optical devices or daughter boards. To meet such demand, Hitachi Chemical has been studying the design and production of such optical-fiber-wiring boards on the basis of our production technology of the MultiWire Board (MWB). This discrete wiring board enables cross-wiring since optical fibers are laid separately on the surface of an adhesive sheet with a special wiring machine. Using quartz fibers of lower attenuation, the transmission loss including the optical connector, is as small as 0.23 db on the average and 0.58 db at the maximum. The difference in the wiring length can be controlled within 1 mm / 600 mm by using equal-length wiring patterns, which is the same level as that of the commercial multifiber codes with connectors. 10cm 19

20 µ µ IT 20 NC µ µ µµ µ µ µ µ CAD 1mm/600mm 250µm 250µ PET 20

21 µ µ 10mm 15mm 0.1dB MT250µm dB40.16dB 0.58dB 20mm0.1dB µµµµ µ µ µ 21

22 0.7dB µ NC Jeff Montgomery : Optical backplanes show dynamic growth potential, Integrated Communications Design, Vol.1, pp Jennifer Sorosiak : Flexible Optical Circuits, Fiberoptic Product News,10, pp pp Vol. 4No.6pp PWBEXPO PWB-9pp

23 U.D.C : Photosensitive Dry FilmPhoTec RY-3200 Seriesfor Semiconductor Package Boards Tatsuya Ichikawa Noriyo Kimura Kyouko Ozawa Shinji Takano (PKG )PKG (D/F) RY-3200RY-3200 PKG The circuits of semiconductor package boards (SCPB) are becoming finer and denser as electronic devices are required to be smaller, lighter, and more multifunctional. We have developed the RY-3200 series which can be applied to the formation of SCPB circuits. The RY-3200 series consist of seven types classified by the photosensitive layer thickness to meet any possible requirement. They feature: (1) less indentation at the resist sidewall edge by using a special two layer support film, (2) high adhesion with less stripping residue by using a new binder polymer, and (3) less inclusion of voids during lamination by using a smoother cover film. The RY-3200 series will be very useful for the formation of SCPB circuits. IT BGABall Grid ArrayCSPChip Size PackagePKG /L/S15/15µm PKG SA Et RY-3000 RY-3025RY-3030RY SA. L/S30/30µm. 2Et Et EtL/S=30/30µm 20µm RY-3200 µ µ µ µ 23

24 D/F 50 D/F D/F PKGD/F Tg Tg Tg 24

25 25 SAEt29µm 15µmD/F Hi-RCD/F RY-3206RY- 3210RY-3215 µ µ µ µ µµ µµ

26 RY-3200 RY-3000 µ RY-3200RY- 3200RY-3000 RY-3219 RY-3200 Tg µ µ, Vol.4, No.3, , , , JEITA ,, No.33, µ µ 26

27 U.D.C : '74'5 Low Wafer Stress i-line Definable Polyimide Akihiro Sasaki Masahiro Miyasaka Masahiko Hiro PKG In order to cope with the recent technical trend; larger size wafer production and thinnner packaging, a new photodefinable polyimide is demanded that can produce smaller wafer curvature (wafer stress) after curing and also can attain higher pattern accuracy and finer pattern performance. For this purpose, we have designed a new base polyimide with high i-line transparency as a precursor and a low coefficient of thermal expansion after curing. After introducing of a photosensitive group into this polymer, we evaluated the patterning performance and cured film properties of the polyimide. We found that this material has the advantages of high sensitivity, high resolution, high heat resistance, and low thermal expansion, which resulting in low wafer stress. This paper describes the material design and the typical characteristics of this newly developed material. PKG nm 27

28 1 t F S T f TE f 1 t F S T f T E f HDMS PIX-L110SX HD-LSXB HD-LSXBHDMS PL-3708 KLA-Tencor FLX-2320 MPa HD-LSXB400 10MPa GPa

29 BTDADDE HD-LSXB0.160 HD-LSXB HD-LSXB HDMSPL-3708 HD-LSXB5µ10µ 10MPa MPa HD-LSXBHD-LSXB PIX-3400 µ µ MPa µ µ 5µ10µ 2,000r/min µ J/cm µ SEM4µ Photo DSC, SSC/5200-PDC121 HD- LSXB µµ µ 29

30 µ µ µ µ µ µ µ µ HD-LSXB 300mm M. Ree et al.j. Appl. Phys. 75 (3), 1 February, , Vol.8, No.4, PL-3708,, 27, N. N. Rukhiyada et al.vysokomol. Soedin. Ser. A34 (3), µµ µµ 30

31 CDDVDLBP OZ-1310OZ-1330 LBP DVD LBP LCDPDP DA-1000 DA DA

32 nmµm

33 33 µ

34 34 LCD TAB COFCOF SN-9000 COF SN-9000 SN-9000 µ µ BGA Ball Grid Array BGA SR7101G 1 2HASTHigh Accelerated Stress Test 3 4 µ µ µ µ µ µ

35 by Hitachi Chemical Co., Ltd. Printed in Japan

36