第1章　溶接法および機器

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とよみかがんじ
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1 670 ) ) ) ) 2.1 ) 42

2 671 Sn T m K. T m. T m. T m 2.2 JIS BAl BPd Al-Si Al-Mn KAlF -K AlF H O Ni 43

3 672 Sn-In Zn EU RoHS ) Pb Cd Hg JIS Z ( ) ) )

4 673. MO HX MX H O M X (d) Young sf lf cos sl sf lf sl cos ( sf sl )/ lf lf ) h cos / gr h g r 3.2 Al-Si Al-Si Al D T B Al n s n s Si ) dc/dt K (A/V ) (C S -C) C t (s) K A V C S n s K A V C S -C C S -C Al Si 45

5 674 Cu Sn A Cu C S Cu Sn Sn-. Cu B ) Ni-P Ni Cu Ag ) C S -C C S -C Si Sn Cu ) Si ) ) ). at% Zr Fe Ni Si Zr Fe Ni Zr < Fe < Ni ) 46

6 rad ) Al- Si Sn- Pb rad 2g rg g Sn-. Ag-. Cu. N/m kg/m. mm Sn-Pb. mm ) ) Mg ) mass% Mg Mg 47

7 676 Mg / O MgO Mg H O MgO H Mg / Al O MgO / Al ) JIS Z EU RoHS ) ) ) ) JIS Z - ) ( ),. ) ( ) ) JIS,, - ( ). ) - ( ),. ), - ( ), -. ) : - ( ),. ) Official Journal of the European Union, Directive / /EC of the Europian parliament and of the Council of Jan. on the restriction of the certain hazardous substances in electrical and electronic equipment, Feb., ( ), L / L /, L / L /. ) T. Takemoto: Introduction of JIS Related to Lead-free Solder and Soldering, Proc. th International Conference on Electronics Packaging Technology, August -September, Shenzhen, China, ( ),. ) E. A. Moelwyn-Hughes, The Kinetics of Reaction in Solution, 48

8 677 nd. Ed., Clarendon Press, Oxford, ( ),. ) Y. Shoji, S. Uchida, and T. Ariga, Dissolution of Solid Copper Cylinder in Molten Tin-Lead Alloys under Dynamic Conditions, Met. Trans. B, Vol. B, ( ),. ) I. Okamoto and T. Yasuda: Selection of Optimum Cu Content in Cu Bearing Tin-Lead Solder, Trans. JWRI, ( ),. ) A. Sharif, Y. C. Chan: Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization, Thin Solid Films,, ( ),. ) M. N. Islam, Y. C. Chan, A. Sharif and M. J. Rizvi: Effect of wt.% In addition to Sn. Ag. Cu solder on the interfacial reaction with the Au/NiP metallization of Cu pads, J. Alloys and Compounds,, ( ),. ) A. Sharif, Y. C. Chan. M. N. Islam and M. J. Rizvi: J. Alloys and Compounds, ( ),. ) Y-W. Yen, W-T. Chou, Y. Tseng, C. Lee and C-L. Hsu: Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders, J. Electronic Materials, ( ),. ) Y. C. Chan, Alex C. K. So and J. K. L. Lai: Growth kinetic studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints, Materials Sci. and Eng., B ( ),. ) ( ),. ) ( ),. ) ( ),. ) J. R. Terill, C. N. Cochran, J. J. Stokes and W. E. Haupin: Understanding the Mechanisms of Aluminum Brazing, Weld. J., ( ),. ) D. M. Jacobson and G. Humpston: Principles of Brazing, ASM International, Ohio, USA, ( ). ) M. Schwarts: Brazing, Second Edition, ASM International, Ohio, USA, ( ). ) G. Humpston and D. M. Jacobson: Principles of Soldering and Brazing, ASM International, Ohio, USA, ( ). ) J. W. Evans: A Guide to Leas-free Solders, Physical Metallurgy and Reliability, Springer, USA, ( ). ) J. Bath: Lead-Free Soldering, Springer, USA, ( ). ) S. Ganesan and M. Pecht: Lead-free Electronics, Wiley- Interscience Publication, USA, ( ). ) G. Humpston and D. M. Jacobson: Principles of Soldering, ASM International, Ohio, USA, ( ). ) Y. Zhou: Microjoining and nanojoining, Woodhead Pub. Ltd., Cambridge, England, ( ). ) Vol. ( ),. ) K-N Tu: Solder Joint Technology, Materials, Properties, and Reliability, Springer, USA, ( ). 49

錫-亜鉛-アルミニウム系鉛フリーはんだの実用化

錫-亜鉛-アルミニウム系鉛フリーはんだの実用化 - Practical Use of Lead-Free Tin-Zinc-Aluminum (Sn-Zn-Al) Solder - - - - - Abstract Fujitsu has implemented a company-wide effort to progressively reduce the use of lead and eventually eliminate this environmental

第1章 溶接法および機器

第1章　溶接法および機器