AND9137JP - SO8FLパッケージ用ユニバーサル・フットプリント

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1 DC DC DFN QFN LFPAK 5 6mm SO8Fl QFN Power-SO8 DPAK SO8IC Figure 1 Figure 1. The Underside of an SO8FL Package APPLICATION NOTE PCB PCB Figure 2 LFPAK PCB SO8IC DPAK Figure 2 Semiconductor Components Industries, LLC, 2015 February, 2015 Rev. 1 1 Publication Order Number: AND9137JP/D

2 Figure 2. Al Wire, Ribbon & Wire, Cu Clip & Au Bump, Cu Wire, Cu Clip & Wire and LFPAK [1] Table 1. DIFFERENT VENDORS OFFERING THIS POWER PACKAGE WITH THEIR RESPECTIVE PACKAGE NAMES Vishay International Rectifier Texas Instrument PowerPAK SO 8 PQFN SON 5 6 mm (Q5A) Alpha and Omega DFN 5 6 ST Microelectronics PowerFLAT 5 6 Toshiba Infineon NXP Renesas SOP Advance Super SO8 LFPAK (SOT669) WPAK(3F) / LFPAK Fairchild Power 56 APEC PMPAK 5 6 MagnaChip ROHM UBIQ PowerDFN56 HSOP8 PRPAK56 NIKO SEM PDFN 5 6 NEC 8-pin HVSON 2

3 Power SO8 MOSFET (Figure 3) PCB Power-SO8 JEDEC Figure 3. Several Power SO8 Package Styles Available on the Market NXP [1] LFPAK 6% 22% (Figure 4 ) 2% 7% 3

4 Figure 4. Universal Footprint Showing Solder Mask and Optimized Solder Stencil Details 4

5 8 4 2 Figure 5 Original Solder Stencil Design Optimized Solder Stencil Design Figure 5. Universal Footprint with Solder Paste Figure 6 Figure 6. Universal Footprint Optimized Stencil Board Array 5

6 Figure 7 AND9137/D Figure 7. X-Ray Images Showing LFPAK and SO8FL Packages after Solder Reflow using Optimized Solder Stencil Pattern 6

7 Figure 8 Figure 9 Figure 8. Cross Sections of Board Mount. Solder Thickness Variation across Package Figure 9. Detail on Solder Thickness Variation Across Package Power SO8 NXP 7

8 IPC Solder Products Value Council (IPC ) 96.5 Sn/3.0 Ag/0.5 Cu SAC (SnAgCu / / ) Cookson Electronics P/N WS3060 Type 3 WS3060 Cookson Electronics P/N C0106A PCB 60% mm (0.005 ) 5 PCB PCB PCB PCB Figure 10 Figure 10. Solder Stencil Design Illustrating how Stencil Openings are Divided into an Array for Large Device Areas 8

9 PCB ±0.05 mm PCB Figure 11 Figure 11. Typical Reflow Profile for Standard Pb-Free Solder 2 C/sec 150 C C X X Figure 12 Figure 12. Side View of DFN 8 Attachment Illustrating Preferred and Undesirable Solder Joint Shapes 9

10 [1] LFPAK The toughest Power SO8. NXP BV publication sot669_fr.pdf [2] AND8195/D Board Mounting Notes for SO8 Flat Lead. ON Semiconductor April 2007 [3] NXP Universal Footprint Evaluations done by Phil Celaya and Stephen StGermann. ON Semiconductor 8/2010 and 9/2010 ON Semiconductor ON Semiconductor Components Industries, LLC (SCILLC) SCILLC ( ) SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC SCILLC PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative AND9137JP/D

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