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1 (a) (b) (c) (d) (e) (f) (g) (f) (a), (b) 1
2 He Gleiter 1) 5-25 nm 1/2 Hall-Petch 10 nm Hall-Petch 2) 3) 4) 2 mm 5000% 5) 1(e) 20 µm Pd, Zr 1(f) Fe 6) 10 nm 2
3 8) Al-- 1,500 MPa 9) 2 Fe 73.5 Si 13.5 B 9 Nb 3 Cu 1 TEM 11) GPa % 12) Cu Nb, Cr, Ag Equal Angular Channel Extrusion (ECAE) 12) 90 1 TEM (b) 6.8 ARB Ag-39.9Cu ARB Cu-Ag 3
4 Hall-Petch torsion straining 13) Accumulative roll-bonding (ARB) 14) (a) (b) ARB Ag-39.9at.%Cu TEM 15) ARB Ag-Cu Ag Cu Ag Cu 16) P/M Mg Mg 17) Mg Mg Co-Al Co-Si Co 1(g) (TMR) 18) 1(f) X 2 mm 1000 MPa 19) 4
5 4 Region I Hall-Petch Region II Hall-Petch Region III Cu 5) Hall-Petch 4 (T. G. Nieh 5(a) 5(b) 1/D l ex =(A/<K>) 1/2 A <K> D 6 5
6 5 (a)(b) (Transmission Electron Microscopy, TEM) 6 (a)(high Resolution Electron Microscopy, HREM) X (Energy Dispersive X-ray Spectroscopy, EDS) (Electron Energy Loss Spectroscopy, EELS) (Scanning Transmission Electron Microscopy, STEM) (High Angle Annular Dark Field, HAADF) 6 (a) 6
7 TEM TEM 6 (b)tem 20 nm EDS EELS TEM (3DAP) 20) 7 3DAP 100 nm (5-15 kv) 20% 10 nm m/n=2e(v dc +αv p )t 2 /l 2 m n e V dc V p αt l ev 7 (position sensitive detector) (x,y) CCD 3DAP 3DAP n d nm i (x i, y i )(x i, y i, di/n) 100 nm 3DAP 20 nm 20 nm 200 nm 3DAP C, B, N, O 3DAP 7 7
8 3DAP 8 21) TEM Nd 4.5 Fe 76.8 B 18.5 Cu 0.2 Fe 3 B/Nd 2 Fe 14 B Cu TEM Fe 3 B Nd Nd Fe 3 B 3DAP nm3 Nd Cu Fe 3 B Nd Cu Cu Fe 3 B Cu Fe 3 B 3DAP 8 Nd 4.5 Fe 76.8 B 18.5 Cu 0.2 Fe 3 B Nd Cu Cu Nd 21) 60 9 Al-2.5Cu-0.5Si-0.5Ge (at.%) Cu Cu 22) 8
9 9 Al-Cu-Ge-Si Cu GP 3DAP Cu 20) (011){001} Cu GP GP 5(b) 23,24) PH Cu Al Cu Cu Al Ni B2 NiAl 10 13Cr-8Ni-2.5Mo-1Al PH 510 C 1 h TEM B2 TEM B C Al Al 0.5 h Al 4 h Al 4 h 2 nm Al (NiAl) /m h 11 (b) Al Al NiAl 50at.% C 4 h 13Cr-8Ni-2.5Mo-1Al B2 25) 9
10 C 13Cr-8Ni-2.5Mo-1Al Al Al NiAl Al 25) NiAl Mo NiAl/matrix 25) Mo NiAl/matrix / NiAl 3DAP (FIB) FIM 3DAP 26) 1) H. Gleiter, Prog. Mater. Sci. 33, 223 (1989). 2) A. H. Chokshi, A. Rosen, J. Karch, and H. Gleiter, Scripta Metall. 23, 1679 (1989). 3) R. Birringer, Mater. Sci. Eng. A117, 33 (1989). 4) G. Palumbo, S. J. Thorpe, and K. T. Aust, Scripta Metall. Mater. 24, 1347 (1990). 5) L. Lu, M. L. Sui, and K. Lu, Science 287, 1463 (2000). 6) Y. Yoshizawa, S. Oguma, and K. Yamauchi, J. Appl. Phys. 64, 6044 (1988). 7) K. Hono, K. Hiraga, Q. Wang, A. Inoue, and T. Sakurai, Acta metall. mater. 40, 2137 (1992). 8) H. A. Davis, J. Magn. Magn. Mater. 157/158, 11 (1996). 10
11 9) Y. H. Kim, A. Inoue, and T. Masumoto, Mater. Trans. JIM, 32, 599 (1991). 10) A. Inoue, H. Kimura, K. Sasamori, T. Masumoto, Mater. Trans. JIM 36, 1219 (1995). 11) 39, 235 (2000). 12) 39, 230 (2000). 13) R. Z. Valiev, R. K. Islamgaliev and I. V. Alexandrov, Prog. Mater. Sci. 45, 103 (2000). 14) Y. Saito, H. Utsunomiya, N. Tsuji, and T. Sakai, Acta mater. 47, 579 (1999). 15) (2002) 16) C. C. Koch, Nanostruct. Mater. 2, 109 (1993). 17) 71, 497 (2001). 18) K. Hono and M. Ohnuma, in "Magnetic Nanostructures" edited by H. S. Nalwa, American Scientific Publishers, 2002, pp ) H. Sasaki, K. Kita, J. Nagahora, A. Inoue, Mater. Trans. 42, 1561 (2001). 20) M. K. Miller, Atom probe tomography: analysis at the atomic level, Kluwer Academic, New York, ) D. H. Ping, K. Hono, H. Kanekiyo, and S. Hirosawa, J. Appl. Phys. 85, 2448 (1999). 22) (2002) 23) 38, 563 (1999). 24) 73, 201 (2003). 25) D. H. Ping, M. Ohnuma, K. Hono, Y. Hirakawa, and Y. Kadoya, 2004 Spring Meeting of Iron and Steel Institute of Japan. 26) 11
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Terahertz Color Scanner Takeshi YASUI Terahertz THz spectroscopic imaging is an interesting new tool for nondestructive testing, security screening, b
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