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1 1. 2. ( ) 3. ( ) 4. ( ) 5. ( ) 6. MEMS 20mm 400 (40 )100
2 A-A A 2. ( ) MEMS A (L.M.Roylance et.al., IEEE Trans. on Electron Devices, ED-26 (1979) p.1911) ( (In-Vivo Oximetry)) (J.M.Schmitt,F.G.Mihm and J.D.Meindl, Annals of Biomedical Eng., 14 (1986) 35-52, Frontiers of Engineering and computing in health care-1984, Sixth Annual Conf. (1984) ) (, 110 (1990) )
3 ( ) (Y.Matsumoto et.al.11 th Biotelemetry, 1990)
4 ( 11 (2005) p.37) (S.Suzuki et.al: Sensors and Actuators,A21-23,(1990) ) (K.Jono et.al.: Measurement Science and Technology,6,1 (1995) 11-15)
5 3 (R.Toda (Ball Semiconductor Inc.) et.al., MEMS 02 (2002)) DMD ( ) (Y.Matsumoto, Sensors and Actuators A,39 (1993) p.209) 1mm INDEX (M.Esashi, Transducers'93 p.260) ( )
6 G (VTI ( ) ) F C = 2mv Wii ADXL202/210 2 ( )
7 VSC (Vehicle Stability Control) M.Nagao et.al.,sae World Congress, Detroit, (2004) ( 40 (2001) p.848) ( )() ( p.75) M.Nagao et.al: 2004 SAE World Congress, Detroit, (2004) (M.Nagao et.al.,sae World Congress, Detroit, (2004))
8 ESP (Electric Stability Program) Bosch ) () (R.Neul et.al., 2005 IEEE Sensor, p.527 (2005)) Bosch 2001 ~ () (R.Neul et.al., IEEE Sensors Journal, 7, p.302 (2007)) (J.-J.Choi et.al.,, 118-E (1998), ) 2 IDG-1000 (, , pp.25-45)
9 Deep RIE Si deep RIE (M.Takinami, 11th Sensor Symposium, (1992) p.15)
10 30mm Segway VSG (Vibrating Structure Gyroscope) VSG (Vibrating Structure Gyroscope) (Y.Nonomura et.al. The 16th European Conf. on Solid-State Transducers (2002) p mm ( ) ( , p.119)
11 MEMS ( 8th SEMI Microsystem/MEMS Seminar, (2004) p.25) ibot 3. ( RF ) (IEEE Trans. on Electron Devices, ED-30, 5 (1983) p.122)
12 DMD (Digital Micromirror Device) DLP L.J.Hornbeck : Micromachining and Microfabrication'95(SPIE), Austin, 3 (1995)) Al DMD (Digital Micromirror Device) ( ) Al (Ti) 0.5 m Al 10nm Ti Al3Ti (H.-J.Lee et.al.(stanford Univ.), Applied Physics Letters, 76, p.3415 (2000))
13 Texas Instruments Inc., Larry J.Hornbeck (, /28, 3/14, 3/28, 4/11, 4/25, 5/9) (DLP : Digital Light Processing) 1920 / sec GLV (Grating Light Valve) (R.B.Apte, D.M.Bloom et.al.,solid-state Sensor and Actuator Workshop, Hilton Head (1994) p.1) GLV(Grating Light Valve) HDTV (MEMS & (CQ )p.189 )
14 50m 10m A4 60 / GLV2005 (6) ( )( ) 2005/5/2 Suspended Heater Silverbrook Research ( ) MEMS ( A ) ( ( : RF-MEMS (Realize, 2006))
15 , No.923, () (K.Ikeda, Tech.Digest of the 7th Sensors Symposium (1988) p.55) MEMS (MEMS + ) SiT8002 SiT0100 ( ) SiT8002UT ( 0.38mm) : 1-125MHz : 2.0mm 2.5mm 0.85mm : 5 /8 : 6 3 G Q : 8 : 0.05ppm 0.15ppm/ : 1.8V, 2.5V, 3.3V (+ PLL) (0.3mm ) SiT8102 (5pS rms) (1-200MHz) ( 5-10pS rms 15-25pS rms)
16 4 m (1 m poly Si) ( ) : MEMS (SiP) : MEMS Knowels Acostics MEMS (,248 (2006,2) p.38) MEMS (NHK,) (T.Tajima (NHK ), M.Esashi et.al., Micro and Nanoengineering 2002 Internal. Conf., Lugano Switzerland (2002)) (N.Asada et.al., IEEE Trans. on Magnetics 30 (1994))
17 ( p.24) on <160mW (6V ) <0.3 <3ms V-15mA 20GHz LSI 300 LSIMEMS (Y.Liu et.al., MEMS 01) ( Advantest Technical Report, 22 (2004), 9-16) Vertical spring pin connection Metal Pads Print Circuit Board Metal Stiffner Si Ti Au-Sn Au LTCC Ceramic Space transformer Ni (S.H.Choe et.al., Transducers 2005, 1259) (S.H.Choe,IEEE Interi. Test Conf. 2007, Santa Clara, CA, Oct.21-26, 2007 )
18 Ag Ag ( ( ) SEMICON Japan STS, 2007/12/5) 4 SAW (J.Kuypers, APCOT2006 p.293) TPMS (Tire Pressure Monitoring System) 2000 Ford Explorer Bridgestone/Firestone TREAD (Transportation Recall Enhancement Accountability and Document Act) TPMS % % % SAW (S.Hashimoto (Nissan motor),, Proceedings of the 24th Sensor Symposium, Tokyo, (2007), )
19 ( ) (S.Tanaka, K.Isomura (IHI), Power MEMS 2007, Freiburg, pp ) 87 rpm ( 470m/s) 2 (S.Tanaka, K.Isomura (IHI), Power MEMS 2007, Freiburg, pp ) DMD ( ) Si
20 50 m 5 m Pyrex glass Temperature( ) 800 Tempeature( ) Pressure(MPa) :00 0:28 0:57 1:26 1:55 2:24 Time(h:m) Pressure(MPa) SiC mold Step 1 Step 2 Step 3 Step 1 Sp 800 Step 2 Tg 528 Step 3 (K.-O.Min, MEMS'2005, 475) 5. ( ) (A.H.Epstein, J.of Eng.for Gas Turbines and Power, 126, (2004) )
21 ph,co 2 ISFET (Supplement to the J.J.AP.,44 (1975), ) (S.Shoji and M.Esashi., Sensors and Actuators, 14 (1988) pp ) CMOS
22 PC (Cr) 4 10 / 4 (T.Katsumata et.al., Optical MEMS 97) (K. Totsu et.al., Transducers 03 (2003) ) (J.-J.Chen, IEEE Sensors 2005, 920)
23 3 mm (J.-J.Chen, IEEE Sensors 2005, 920) 1mm 7. (N.Kikuchi, Transducers'03)
24 ( MEMS + LSI ) LSI MEMS ( ) () 3 m BiCMOS MEMS DMD( ) MEMS AlMEMS MEMS CMOSPoly-SiGe MEMS (W.A.Mehta(IMEC),ISSC 2005, p.88) IMEC SiGe (MEMS2007) CMOS (< 400 )
25 MEMS MEMS LSI NICT MEMS ( ) MEMS A B C D 9 ( ) MEMS 4
26 MEMS (XeF 2 Si HF+CH 3 OH SiO 2 ) ( : : : MEMS ) ( ( ) TV ( (Wii))
27 MEMS (, MEMS,, 2006 Sept.) 3 ( ) Knowles( ) ( ) LSI MEMS MEMS MEMS MEMS (CD) 8/ /
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( ) ( ) 1 MEMS : MEMS ( +13% / ) 2 3 ISFET ph,co 2 (K.Shimada, M.Esashi, Med.& Biol.Eng.& Comp.,18 (1980) p.741) (M.Esashi T.Matsuo, Supplement to the J.J.AP.,44 (1975),339-343) 4 5 (Y.Matsumoto, S.Shoji,
( )
MEMS 4 : ( ) ( ) Pt ITO Si (2 m) Si (0.2 m) (T.Ono et.al., J.Micromech.Microeng.,10 (2000) 445-451) DEMA (Distributed Electrostatic MicroActuator) (XY ) DEMA (Distributed Electrostatic MicroActuator)
) ( ) ( 34,3 (1995))
4. MEMS 2 : MEMS ( ) DMD (Digital Micro mirror Device) FED (Field Emission Display) ( ) ( ) RF ( ) ( ) IC RF ( ) ) ( ) ( 34,3 (1995)) (M.Murata et.al.: IEICE Trans. Electron., E84-c (2001) p.1792) ( )
) ( ) ( 34,3 (1995))
4. MEMS 2 : MEMS ( ) DMD (Digital Micro mirror Device) FED (Field Emission Display) ( ) ( ) RF ( ) ( ) IC RF ( ) ) ( ) ( 34,3 (1995)) (M.Murata et.al.: IEICE Trans. Electron., E84-c (2001) p.1792) ( )
2 ( ) PVD (Physical Vapor Deposition)
2 ( ) PVD (Physical Vapor Deposition) G.Lim et.al., Robotica, 14 (1996) pp.499-506 ( ) ( Ionics, 20, 9 (1994) p.147) MEMS CVD (Chemical Vapor Deposition) CVD MacDonald et.al. MEMS 90 CVD 160-220ºC 1,1,1,5,5,5,5-
IC NMOS ( )
5. MEMS 3 : IC NMOS ( ) (T.Hoshino (Tokyo Electron Ltd.) et.al., 18 th Sensor Symposium late news, 2001) 10000 memory : Probe (pad) Count 4000 Cobra probe cards 2000 ASIC 200 LCD driver IC Epoxy-needle
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1 1-1 p-i-n 1-1 (CIS/CIGS CdTe ) (GaAs) (,,) (, ) (,,) Si Si Si (CIS/CIGS CdTe ) (GaAs) (,,) (, ) (,,) Si Si Si Si 1-2 HITHeterojunction with Intrinsic Thin layer 30 HIT 22.3NIKKEI MICRODEVICES, May,82-86(2008)
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