錫-亜鉛-アルミニウム系鉛フリーはんだの実用化

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1 - Practical Use of Lead-Free Tin-Zinc-Aluminum (Sn-Zn-Al) Solder Abstract Fujitsu has implemented a company-wide effort to progressively reduce the use of lead and eventually eliminate this environmental pollutant from its products. As part of this effort, it has developed a new lead-free solder that consists of tin, zinc, and aluminum and yet offers superior productivity and joint reliability. The new lead-free solder has a melting point equivalent to that of a tin-lead eutectic solder, and enables devices to be packaged at a lower temperature than with the increasingly popular tin-silver-copper solder. The new lead-free solder ensures highly reliable soldering both for existing component pins that contain lead, as well as lead-free component pins which will be widely used in the future. Thus, the new lead-free solder accelerates the elimination of lead from products. Fujitsu has already used PC boards containing the new lead-free solder in some products, and plans to extend its use to other products. This paper describes the characteristics of the new leadfree solder and the results of a study on its practical use. 154 FUJITSU.54, 2, p (03,2003)

2 - - Pb EU RHS Restriction of Hazardous Substances in Electrical and Electronic Equipment Sn - Ag - Cu -1 (1) Zn - Al Sn-Zn-Bi Sn-Zn Al Sn-Zn-Bi Sn-Zn 200 Zn Bi Cu Zn Sn-Zn Cu Cu Cu Cu Sn-Zn-Bi Sn-8Zn-3Bi wt Cu Cu Au Cu Au Ni -Zn Cu-Zn SMD Surface Mount Device 2 Sn-10Pb wt Cu LQFP Low Profile Quad Flat Package 208 pincu mm 1.5 mm Sn-8Zn-3Bi wt 10 N/ Sn-Zn - Sn-Ag - Sn-Pb EU FUJITSU.54, 2, (03,2003) 155

3 (2) Bi Sn-Zn Pb Pd Sn-Zn-Bi EPMA Electron Probe Micro Analyzer Cu 6 m Cu-Zn Bi Pb Cu-Zn 8 m Pb Bi -1 Cu2 m Cu-Zn Bi Pb BiSn-Zn-Bi Sn-Pb Cu Pb Bi Sn 99.5 Sn- Pb-Bi Sn-Pb-Bi -2 Al Zn Pb Bi Sn-Zn Cu Bi Sn-Zn Zn Bi Al Sn-Zn a Cu b -1 Sn-Zn-Bi Fig.1-Rupture side at junction by Sn-Zn-Bi solder after high temperature leaving. Sn-Pb-Bi 三元共晶層 高温放置後に界面はく離が発生する層 Sn-Pbはんだめっきリード Pb Bi Zn Cuめっき基板パッド部分 Pb の接合界面への移動 Cu-Zn 金属間化合物層 -2 Sn-Zn-BiCu Fig.2-Mechanism of occurrence of interfacial separation between Sn-Zn-Bi solder and Copper pad. 156 FUJITSU.54, 2, (03,2003)

4 - - Zn Al Zn Zn Zn Zn Al Al Al Al-2 ZnAl Zn Al Al Al ZnAl Al Zn Zn Al Zn Zn-8Al wt Zn Al Al Al Zn Al Zn Al Zn Sn-Zn-Al EPMA /10 nm Al Al Sn-Zn-Al Sn-Zn Al Al Al 40 m Sn-Zn- Al Al AES Auger Electron Spectroscopy -3 Al Sn-Zn Al AES Al 60 ppm 1/4 AlAl (3) Sn-Zn-Al 5 mm 40 mm 0.1 mm RMA Rosin Mildly Activated Zn Al Cu Zn Al Cu kcal/j Al Fig.3-Amount of Al addition of solder powder and oxidized film thickness. FUJITSU.54, 2, (03,2003) 157

5 mm/s 5 mm 8 Sn-Zn Sn-8Zn Al wt 2-4 Sn-Zn Al wt Zn wt Sn-Zn-Al Sn-Zn-AlSn-Pb Cu LQFP Cu Sn-Zn 6 m Sn-Zn-Al 1 m 2 m Al Zn 150 1, N/ LQFP 85 /85 RH 600 Sn-Zn-AlAl Sn-Zn-Al Cu 40 m Sn-Zn-Al mm 24-6 BGA BGA Ball Grid Array Sn-Ag-CuSn- Ag-Cu Sn-Ag-Cu Sn-Zn-Al 760 m Sn-Zn-Al 接合初期 h 放置後 a Sn-Zn 8 ~ ~ ~ 測定不能 濡れ時間 (s) Al 添加量 (wt%) -4 Sn-8Zn-AlAl Fig.4-Wetting time of Sn-8Zn-Al (wt%) solder. 接合初期 h 放置後 b Sn-Zn-Al -5 Sn-Zn-AlCu Fig.5-Cu plating circuit board jointed interface with Sn-Zn-Al solder. 158 FUJITSU.54, 2, (03,2003)

6 Sn-Zn-Al VL-151VAW Fig.6-Photograph of Fujitsu product. -3 MIL MIL-STD-202F / 80 RH , Hz/1.5 mm 200 ppm / 90 RH 1, ボールシェア強度 (N) Sn-Zn-Al Sn-Ag-Cu Sn-Pb , 高温放置時間 (h) -7 Au 760 m Fig m Sn-Zn-Al solder ball share strength on Au electrode pad m -8 CuCu m Sn-Zn-Al Cu Fig.8-90 m Sn-Zn-Al solder ball joint on Cu electrode pad. Zn1 m 500 mn/sn-zn-albga FUJITSU.54, 2, (03,2003) 159

7 FUJITSU Vol.51 No.5 p Sn-Zn-Al p Sn-Zn-Al p FUJITSU.54, 2, (03,2003)

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