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1 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 1 Jisso STRJ WG-7 ()
2 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 2 (
3 JEITA Chairman: () Chairman: () : NECICT WG1 : Chairman: () WG3 : PKG 9 10 STRJ WG7 Chairman () : WG4 : Leader (TDK) : :() WG5 : Leader (ICT) :SLC WG6 : 6 7 Leader:() JPCA : () Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 3
4 Jisso QFP ITRS, STRJ BGA PGA Jisso Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 4
5 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 5 Jisso IRC ITRS/ STRJ JEITA SIRIJ Selete STARC ASET JSPMI M&S TEST ES&H SEAJ JPCA JIEP EDA MET &DR (Jisso) PWB JJTR
6 Jisso Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 6 R&DR&D Jisso : Jisso Jisso ()
7 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 7 Jisso (inemi)
8 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 8 JEITA 2007 /
9 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 9
10 JJTRC Casio Computer Co., LTD. Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 10
11 Jisso AV TV- AV Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 11
12 PC / PDA Desktop PC Desktop PC TV-Note PC A4 B5 Note PC Note PC A5 B6 A6 B7 A7 B8 A8 B9 Pocket Calculator Pocket PC Desktop PDA Handheld PC Palm Top PC Wearable PC Handheld PC Palm Top PC Wearable PC (Wrist type) Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 12
13 $3040 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 13
14 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P FOMA PDC 55H H 500H 250H 400~500H 500H
15 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 15
16 Inside of Panasonic s s P701iD Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 16 Phone front-view Main LCD(Front) LCD support LCD board(front/rear) Phone rear-view Sub-LCD(Front) Jisso Stacked Main camera CSP Main board(front/rear) Main board support(front/rear) Sub-(Front/Rear) The source; SemiConsult
17 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 17 Chip stacked CSP The source; SemiConsult
18 WG3() Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 18
19 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 19 Horizontal Placement Wire Bonding Type Flip Chip Type Stacked Structure Interposer Type Wire Bonding Type Wire Bonding + Flip Chip Type Flip Chip Type Interposer-less Type Terminal Through Via Type Embedded Structure Chip (WLP) Embedded + Chip on Surface Type 3D Chip Embedded Type WLP Embedded + Chip on Surface Type Source: K. Nishi, Hitachi, JEITA, Revised by H. Utsunomiya
20 m SiP/MCP Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 20
21 KGD MCP/SiP Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 21
22 (%) QFP/SOP DVC WW AV DSC FPD D-TV Note-PC NAVI Engine compartment Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 22
23 (%) FBGA DVC WW AV DSC FPD D-TV Note-PC NAVI Engine compartment PKG PKG Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 23
24 (%) BGA DVC WW AV DSC FPD D-TV Note-PC NAVI Engine compartment PKG PKG Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 24
25 BGA DVC WW AV DSC FPD D-TV Note-PC NAVI Engine compartment N/A PKG PKG Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 25
26 FBGA DVC WW AV DSC FPD D-TV Note-PC NAVI Engine compartment FBGA FBGABGA Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 26
27 LSI Note-PC LSI LSIEngine compartment Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 27
28 (%) Note-PC Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 28
29 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 29
30 (2005) HONDA VICS VICS ETC 5.1ch TV LAN 1 (ITS) Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 30 ( ) 2
31 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 31 TDK NEC The source; TOYOTA home page add to K.Takahashi
32 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 32, ECU on engine Vibration10G Impact load30g Sensor on engine Vibration40G Impact load50g ECU in engine-room Vibration3G Impact load20g The source; NEMI Technology Roadmaps 2002 add to K.Takahashi
33 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 33 ECU / (60) ECU ( : : JasPar?)?) /
34 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P () : ACF/NCF/NCP km2030km 30% %
35 Work in Progress - Do not publish STRJ WS: March 10, 2006, WG7 A&P 35 Jisso Difficult Challenges 2014
設計現場からの課題抽出と提言 なぜ開発は遅れるか？その解決策は？
Work in Progress - Do not publish STRJ WS: March 4, 2004, WG1 1 WG1: NEC STARC STARC Work in Progress - Do not publish STRJ WS: March 4, 2004, WG1 2 WG1 ITRS Design System Drivers SoC EDA Work in Progress
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B 02 Pocket Page Weekly 13 March 2015 No. 478
INDEX B 02 Pocket Page Weekly 13 March 2015 No. 478 Exhibition B 04 Pocket Page Weekly 13 March 2015 No. 478 06 Pocket Page Weekly 13 March 2015 No. 478 B Pocket Page Weekly 13 March 2015 No. 478 B 07
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1 4 4 6 8 10 30 13 14 16 16 17 18 19 19 96 21 23 24 3 27 27 4 27 128 24 4 1 50 by ( 30 30 200 30 30 24 4 TOP 10 2012 8 22 3 1 7 1,000 100 30 26 3 140 21 60 98 88,000 96 3 5 29 300 21 21 11 21
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小型 低コストパッケージとして実用化が始まる FO-WLP 2016 年 3 月 4 日 WG7 リーダ : 杉崎吉昭 ( 東芝 ) Work in Progress - Do not publish STRJ WS: March 4, 2016, WG7Assembly&Packaging 1 WG7 の活動概要 ファンアウト型パッケージ (FO-WLP) の動向 FO-WLP の概要と課題 各社製造プロセスの動向
J. Jpn. Inst. Electron. Packaging 19(1): (2016)
特特集 / エレクトロニクス実装技術の現状と展望 半導体システムインテグレーション技術における とその将来展望 FO-WLP in Semiconductor System Integration Technology and Its Future Prospects システムインテグレーション実装技術委員会 集 はじめに 1),2) MEMS (Micro Electro-Mechanical System)
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1 2010 エレクトロニクス実装学会年度 STRJワークショップ第 1 回システムインテグレーション実装技術研究会公開研究会 日本の実装技術 世界の実装技術 2011 年 3 月 4 日 ( 社 ) 電子情報技術産業協会半導体技術ロードマップ委員会 STRJ WG7 中島宏文 ( ルネサスエレクトロニクス ) 2 1. 概要 2010 年度 STRJ WG7 メンバー リーダ : 中島宏文 ( ルネサスエレ
B 14 Pocket Page Weekly 04 March 2016 No. 529
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第20期Q3説明会プレゼン（2）事業
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スライド 1
わかりやすい 低消費電力 高速デバイスの 普及を支えるパッケージ開発 2013 年 3 月 8 日中島宏文ルネサスエレクトロニクス STRJ WG7 Work in Progress - Do not publish STRJ WS: March 8, 2013, WG7 実装 1 Work in Progress - Do not publish STRJ WS: March 8, 2013, WG7
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CASSIOPEIA E-3000 ユーザーズガイド
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J. Jpn. Inst. Electron. Packaging 17(4): (2014)
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keep it MINI. MINI CLUBMAN. original MINI accessories. / MINI JOHN COOPER WORKS CLUBMAN MINI COOPER CLUBMAN MINI COOPER S CLUBMAN MINI JOHN COOPER WORKS CLUBMAN 2014 8 1 8% MINI MINI BMW AG BMW MINI 0120-3298-14
