MULTILAYE FEITE CHIP BEADS BK SEIES OPEATING TEMP. 12 BK63, BK1 Except for BK63, BK1 FEATUES Ag GND HSL HM 2MHz1MHz3MHz LL 2MHzMHz LM2MHz HW L TS LSI

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1 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. EMINDES Product information in this catalog is as of October 28. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. 1 INFOMATION ON THE GENEAL CATALOG Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDENs official sales channel). It is only applicable to the products purchased from any of TAIYO YUDENs official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Lawof Japan, U.S. Export Administration egulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. Should you have any question or inquiry on this matter, please contact our sales staff. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 3

2 MULTILAYE FEITE CHIP BEADS BK SEIES OPEATING TEMP. 12 BK63, BK1 Except for BK63, BK1 FEATUES Ag GND HSL HM 2MHz1MHz3MHz LL 2MHzMHz LM2MHz HW L TS LSI APPLICATIONS AV PDCPHS LSI TS Internal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. No need for grounding provides greater circuit design flexibility. Several material types and a broad range of impedance values provide noise countermeasures for various applications. HS : Suppresses the L component. Helps stop the reduction of the waveform integritydigital wave-form overshoot, etc. HM : Increases the characteristic sharply above 2MHz and is applicable for radiated noise in the 1MHz3MHz range. Especially effective on video signal lines. LL : Designed as a noise countermeasure for the 2MHzMHz range where the rise of the component is in the high frequency area. LM : Intended for noise suppression around 2MHz. Effectively increases attenuation. HW : The best material in the BK Series to suppress the L component and stop the reduction of the wave-form integrity while maintaining attenuation in the high frequency area. TS : educed DC resistance version for noise countermeasures around LSI power supplies. High frequency noise countermeasure in personal computers, digital cameras and other information system products. For use on digital product clock lines and general signal lines. adiated noise suppression in computer or printer interfaces and harness connectors. Noise suppression in video and other AV products. Prevents interference between circuits in cellular phonesphs, PDC, etc. Due to the closed internal circuit which acts as a magnetic shield, the TS material is extremely effective as a noise filter on LSI power supply lines where downsizing of components is needed. ODEING CODE 1 3 BK HW HS HM LM 2 LL TS LWmm B K H S _ T T Type Material Characteristics Internal code BK Multilayer Ferrite Chip Beads HW example Standard Products Standard Products HS 1 1 Blank Space efer to impedance HM 11 1 curves for material LM 12 1 differences LL 2 6 TS External DimensionsLWmm Packaging T Tape & eel 218 Please read the "Notice for TAIYO YUDEN products" before using this catalog.

3 ETENAL DIMENSIONS Type L W T e BK BK BK BK Unitmminch AVAILABLE MATEIALS BK63 II HS type HM type Frequency [MHz] II Frequency [MHz] II LL type Frequency [MHz] FEITE PODUCTS I max=2ma I max=2ma I max=12ma BK1 HW type HS type HM type LL type LM type LL241 2 LL181 3 LL121 4 LL68 LL47 6 LL33 7 LL22 8 LL I max=3ma I max=31ma I max=13ma I max=2ma H type BK168 HW type HS type HM type LL type I max=1ma LL type LL241 2 LL181 3 LL121 4 LL68 LL6 6 LL47 7 LL I max=36ma I max=31ma I max=23ma I max=1ma I max=1ma Selection Guide Part Numbers Electrical Characteristics Packaging eliability Data Precautions P.14 P.221 P.223 P.244 P.246 P.24 etc Please read the "Notice for TAIYO YUDEN products" before using this catalog. 219

4 AVAILABLE MATEIALS BK168 LM type TS type I max=2 3mA I max=3 4mA BK212 HS type HM type LL type LM type I max=3 12mA I max=4 8mA I max=3 6mA I max=2 4mA 22 Please read the "Notice for TAIYO YUDEN products" before using this catalog.

5 PAT NUMBES BK63 Ordering code B K 6 3 H S 2 2 B K 6 3 H S 3 3 B K 6 3 H S 8 B K 6 3 H S B K 6 3 H S B K 6 3 H S 6 1 B K 6 3 H M 6 B K 6 3 H M B K 6 3 H M B K 6 3 H M B K 6 3 L L 1 B K 6 3 L L 2 2 B K 6 3 L L 3 3 B K 6 3 L L 4 7 B K 6 3 L L 6 B K 6 3 L L 8 B K 6 3 L L EHS Environmental Hazardous Substances Impedance 2 Measuring frequency MHz DC resistance ated current ma Thickness mm inch ohs 22.6 ohs 33.7 ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs FEITE PODUCTS BK1 Ordering code B K 1 H W 6 8 B K 1 H W B K 1 H W B K 1 H W B K 1 H W 6 1 B K 1 H S 1 B K 1 H S 3 3 B K 1 H S 6 8 B K 1 H S 8 B K 1 H S B K 1 H S B K 1 H S B K 1 H S 6 1 B K 1 H S 1 2 B K 1 H 6 1 B K 1 H M B K 1 H M B K 1 H M B K 1 H M 6 1 B K 1 H M 1 2 B K 1 L L B K 1 L L 1 B K 1 L L 2 2 B K 1 L L 3 3 B K 1 L L 4 7 B K 1 L L 6 8 B K 1 L L B K 1 L L B K 1 L L B K 1 L M EHS Environmental Hazardous Substances Impedance 2 Measuring frequency MHz DC resistance ated current ma Thickness mm inch ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs 12.2 ohs ohs ohs 6. 3 ohs ohs ohs ohs ohs ohs 6. 2 ohs ohs.8 6 ohs 1.11 ohs ohs ohs ohs ohs ohs ohs ohs Please read the "Notice for TAIYO YUDEN products" before using this catalog. 221

6 PAT NUMBES BK168 Ordering code B K H W B K H W B K H W B K H W 6 1 B K H S 2 2 B K H S 3 3 B K H S 4 7 B K H S 6 B K H S 8 B K H S B K H S B K H S 6 1 B K H S 1 2 B K H M B K H M B K H M B K H M 6 1 B K H M 1 2 B K L L 3 B K L L 4 7 B K L L 6 B K L L 6 8 B K L L B K L L B K L L B K L L B K L L B K L L 1 1 B K L L B K L M 7 1 B K L M 1 2 B K L M B K L M 2 2 B K T S B K T S 6 1 B K T S 1 2 EHS Environmental Hazardous Substances Impedance 2 Measuring frequency MHz DC resistance ated current ma Thickness mm inch ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs 3.2 ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs ohs % 4 ohs % 3 ohs 1.3 3% 3 BK212 Ordering code B K H S 1 B K H S 2 2 B K H S 3 3 B K H S 4 7 B K H S 7 B K H S 1 1 B K H S B K H S B K H S B K H S 6 1 B K H S 1 2 B K H M B K H M B K H M B K H M 6 1 B K H M 1 2 B K L L 6 B K L L B K L L B K L M 7 1 B K L M 1 2 B K L M B K L M 2 2 EHS Environmental Hazardous Substances Impedance 2 Measuring frequency MHz DC resistance ated current ma Thickness mm inch ohs ohs ohs ohs ohs ohs ohs ohs ohs 43.2 ohs 6.3 ohs ohs ohs ohs 47.2 ohs 6.2 ohs ohs ohs ohs ohs ohs ohs ohs Please read the "Notice for TAIYO YUDEN products" before using this catalog.

7 ELECTICAL CHAACTEISTICS BK63 1 BK63 HS22 1 BK63 HS BK63 HS FEITE PODUCTS BK63 HM241 8 BK63 HM471 1 BK63 LL1 2 BK63 LL BK63 LL33 BK63 LL47 BK63 LL6 1 BK63 LL BK63 LL Please read the "Notice for TAIYO YUDEN products" before using this catalog. 223

8 ELECTICAL CHAACTEISTICS BK1 1 BK1 HW68 BK1 HW121 BK1 HW BK1 HW431 1 BK1 HW61 1 BK1 HS BK1 HS33 1 BK1 HS68 2 BK1 HS BK1 HS BK1 HS12 1 BK1 H Please read the "Notice for TAIYO YUDEN products" before using this catalog.

9 ELECTICAL CHAACTEISTICS BK1 HM BK1 HM BK1 LL1 FEITE PODUCTS BK1 LL22 BK1 LL33 BK1 LL BK1 LL BK1 LM Please read the "Notice for TAIYO YUDEN products" before using this catalog. 22

10 ELECTICAL CHAACTEISTICS BK Please read the "Notice for TAIYO YUDEN products" before using this catalog.

11 ELECTICAL CHAACTEISTICS FEITE PODUCTS BK168 LL3 BK168 LL47 BK168 LL BK168 LL68 1 BK168 LL Please read the "Notice for TAIYO YUDEN products" before using this catalog. 227

12 ELECTICAL CHAACTEISTICS Please read the "Notice for TAIYO YUDEN products" before using this catalog.

13 ELECTICAL CHAACTEISTICS BK212 FEITE PODUCTS Please read the "Notice for TAIYO YUDEN products" before using this catalog. 229

14 ELECTICAL CHAACTEISTICS 1 BK212 HM471 Impedance Frequency 1 BK212 LL121 Impedance Frequency 23 Please read the "Notice for TAIYO YUDEN products" before using this catalog.

15 PACKAGING Minimum Quantity Tape & eel Packaging Taping material Type Thickness mm inch pcs Standard Quantity Paper Tape Embossed Tape CK16863 CK2128 CKP2218 LK142 LK16863 LK2128 HK6321 HK142 HK16863 HK2128 HKQ63S21 AQ142 BK6321 BK142 BK16863 BK2128 BK2184 BK BKP6321 BKP142 BKP16863 BKP C K C K L K 1 L K L K H K 6 3 H K 1 H K H K Q 6 3 A Q 1 B K 6 3 B K 1 B K B K B K 2 1 B K P 6 3 B K P 1 B K P B K P CK CKP LK HK BK BK Please read the "Notice for TAIYO YUDEN products" before using this catalog.

16 PACKAGING Taping Dimensions 8mm Type Thickness mm inch.8.31 Paper tape.31 inches wide Chip cavity Unit : mm inch Insertion Pitch 8mm Embossed Tape.312 inches wide Tape Thickness A B F T CK max CK max LK max LK max LK max HK max HK max HK max HKQ63S max AQ max BK max BK max BK max BK max BK max BKP max BKP max BKP max BKP max Type Thickness mm LEADE AND BLANK POTION 16mm 6.3inches or more eel Size Chip cavity Direction of tape feed 1mm 3.94inches or more Insertion Pitch 4mm 1.7inches or more Tape Thickness A B F K T CK CKP LK HK BK BK Top tape strength.1.7n The top tape requires a peel-off force of.1.7n in the direction of the arrow as illustrated below. FEITE PODUCTS Unit : mm inch Please read the "Notice for TAIYO YUDEN products" before using this catalog. 24

17 ELIABILITY DATA 1/4 Multilayer chip inductors and beads Specified Value Item AAY BK63 BK1 BK168 BK212 BKP63 BKP1 BKP168 BKP212 CK168 CK212 CKP22 LK1 LK168 LK212 HK63 HK1 HK168 HK212 HKQ63S AQ1 BK21 BK3216 Test Methods and emarks. Operating Temperature ange Storage Temperature ange. ated Current 1 ma mA 1 1.A 1.A mA 1mA 12mA 2mA A 4.A 6mA ma 1.4 2mA ma 3mA 47mA 3mA 3mA 3mA 6mA 71mA. Impedance DC DC DC DC DC DC DC DC DC DC DC DC % % 2% 2% 2% 2% 2% 2% 2% 2% BK63 Series BKP63Series Measuring frequency11mhz Measuring equipmenthp4291a Measuring jig16193a BK1 Series BKP1 Series Measuring frequency11mhz Measuring equipmenthp4291a Measuring jig16192a, 16193A FEITE PODUCTS BK168, 212 Series BKP168, 212 Series Measuring frequency11mhz Measuring equipmenthp4291a, HP419A Measuring jig1692a or 16192AHW. Impedance BK21, 3216 Series Measuring frequency11mhz Measuring equipmenthp4291a, HP419A Measuring jig16192a CK Series 1.H 1.H 4.7H 2.2H 33.H 33.H 6.2nH 6.2nH.6nH.6nH 6.2nH 6.2nH Measuring frequency2 to 4MHzCK168 2% 2% 2% 1% 2% 2%.3nH.3nH.3nH.3nH.3nH.3nH Measuring frequency2 to 2MHzCK Measuring frequency1mhzckp22 Q.1.1 1nH 27nH 47nH 47nH 22nH 1nH LK Series H 12.H % % % % % % Measuring frequency1 to 2MHzLK1 2.2H 1% 1% Measuring frequency1 to MHzLK168 3% Measuring frequency.4 to MHzLK212 Q Q Measuring equipment, jig HP B Aor its equivalent 2.2H 2.2H HP Aor its equivalent 3% 3% HP A HP4291A+16193ALK1 HP428A+42841A+42842C CKP22 Measuring current 1mA rms.47 to 4.7H.1mA rms.6 to 33H HK, AQ SeriesMeasuring frequency 1MHzHK63HK1AQ1 Measuring frequency /1MHzHK168HK212 Measuring frequencymhzhkq63s Measuring equipment, jig HP4291A AHK63AQ1 HP4291A AHK1 E4991A AHKQ63S HP4291Aor its equivalent A + in-house made jighk168,212 * Definition of rated current : In the CK and BK Series, the rated current is the value of current at which the temperature of the element is increased within 2. In the BK Series P type and CK Series P type, the rated current is the value of current at which the temperature of the element is increased within 4. In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within % with the application of DC bias, or the value of current at which the temperature of the element is increased within 2. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 247

18 ELIABILITY DATA 2/4 Multilayer chip inductors and beads Specified Value Item AAY BK63 BK1 BK168 BK212 BKP63 BKP1 BKP168 BKP212 CK168 CK212 CKP22 LK1 LK168 LK212 HK63 HK1 HK168 HK212 HKQ63S AQ1 BK21 BK3216 Test Methods and emarks 6Q CK Series Measuring frequency2 to 4MHzCK168 Measuring frequency2 to 2MHzCK212 LK Series Measuring frequency1 to 2MHzLK1 Measuring frequency1 to MHzLK168 Measuring frequency.4 to MHzLK212 Measuring equipment, jig HP B 1692Aor its equivalent HP419A Aor its equivalent HP4294A16192A HP4291A16193ALK1 Measuring current 1mA rms.47 to 4.7H.1mA rms.6 to 33H HK, HKQ, AQ Series FEITE PODUCTS Measuring frequency 1MHHK63HK1AQ1 Measuring frequency/1mhzhk168hk212 Measuring frequencymhzhkq63s Measuring equipment, jig HP4291A16197AHK63AQ1 HP4291A16193AHK1 E4991A 16197AHKQ63S HP4294A1692A in-house made jighk168hk212 7DC esistance Measuring equipment VOAC-7412made by Iwasaki Tsushinki 3% VOAC-712made by Iwasaki Tsushinki 8Self esonance FrequencySF MHz 23MHz MHz 26MHz 32MHz 1MHz 1MHz 1MHz 4MHz LK Series 1MH 1MHz Measuring equipmenthp419a Measuring jig a or its equivalent HK, HKQ, AQ Series Measuring equipmenthp8719c HP873DHK Temperature Characteristic Inductance change 1 HK, HKQ, AQ Series Temperature range3 to 8 eference temperature2 1. esistance to Flexure of Substrate No mechanical damage. Warp2mm Testing boardglass epoxy-resin substrate Thickness.8mm Please read the "Notice for TAIYO YUDEN products" before using this catalog. 249

19 ELIABILITY DATA 3/4 Multilayer chip inductors and beads Specified Value Item AAY BK63 BK1 BK168 BK212 BKP63 BKP1 BKP168 BKP212 CK168 CK212 CKP22 LK1 LK168 LK212 HK63 HK1 HK168 HK212 HKQ63S AQ1 BK21 BK3216 Test Methods and emarks 11Solderability At least 7 of terminal electrode is covered by new solder. At least 7 of terminal electrode is covered by new solder. Solder temperature23 Duration41 sec. 12esistance to Soldering Appearance No significant abnormality. Impedance change 3 No mechanical damage. emaining terminal No No mechanical mechanical damage. No mechanical damage. emaining terminal electrode 7 Solder temperature26 Duration1. sec. 13Thermal Shock Appearance No significant abnormality. Impedance change 3 electrode 7 damage. emaining emaining terminal Inductance change 1471 terminal electrode electrode Inductance Inductance change change No No No mechanical mechanical damage. mechanical damage. damage. Inductance Inductance Induc- change Inductance change No mechanical damage. Inductance change Qchange Preheating temperature1 to 18 Preheating time3 FluxImmersion into methanol solution with colophony for 3 to sec. ecovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 Conditions for 1 cycle Step 1Minimum operating temperature 33 3 Step 2oom temperature 2 to 3 FEITE PODUCTS change Qchange tance 1 change Qchange 3 Step 3Maximum operating temperature 33 3 Step 4oom temperature 2 to 3 3 Number of cycles ecovery2 to 3 hrs of recovery under the standard condition after the test.see Note 1 (Note 1) When there are questions concerning mesurement resultmeasurement shall be made after 48 2 hrs of recovery under the standard condition. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 21

20 ELIABILITY DATA 4/4 Multilayer chip inductors and beads Specified Value Item AAY BK63 BK1 BK168 BK212 BKP63 BKP1 BKP168 BKP212 CK168 CK212 CKP22 LK1 LK168 LK212 HK63 HK1 HK168 HK212 HKQ63S AQ1 BK21 BK3216 Test Methods and emarks 14Damp Heat Steady state Appearance No significant abnormality. Impedance change 3 No mechanical No No mechanical damage. mechanical Inductance change No No mechanical damage. mechanical 1 BBK Series Temperature42 1Loading under Damp Heat Appearance No significant abnormality. Impedance change 3 damage. Inductance change 2 Q change 3 No mechanical damage. Inductance change damage. damage. Q change 2 Inductance Inductance change change Inductance change 3 1 Q change Q change 3 No No No No No mechanical damage. mechanical mechanical mechanical mechanical Inductance change 1 damage. damage. damage. damage. Q change 2 Inductanctanctance Induc- Induc- Inductance Humidity9 to 9H Duration 24 hrs ecovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.see Note 1 LKCKCKPHKHKQAQ Series Temperature42LKCK CKPSeries 62HKHKQAQ Series Humidity9 to 9H Duration12 hrs ecovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.see Note 1 BK Series Temperature42 Humidity9 to 9H Duration 24 hrs ecovery2 to 3 hrs of recovery under the standard condition after the removal from test FEITE PODUCTS 2 change change change change chamber.see Note 1.47 to LKCKCKPHKHKQAQ Series Q change H 2 Temperature42LKCK CKPSeries 3 62HKHKQAQ Series Q 1 Q Humidity9 to 9H change 1. to change Duration12 hrs 33.H ecovery2 to 3 hrs of recovery under the 3 standard condition after the removal from test 1 chamber.see Note 1 Q change 16Loading at High Appearance No significant abnormality. No No No No No No mechanical damage. BK Series Temperature Impedance change 3 mechanical mechanical mechanical mechanical mechanical Inductance change 1 Temperature123 damage. damage. damage. damage. damage. Q change 2 Applied currentated current Inductance change 2 Q change 3 Inductanctanctance Induc- Induc- Inductance change change change change.47 to H 2 Q 1 Q change 1. to change 33.H Duration 24 hrs ecovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber.see Note 1 LKCKCKPHKHKQAQ SeriesBK Series P type Temperature82LKCK CKPSeries 83BK Series P type 82HK168212) 82HK1, AQ1 operating temperature range - to HK63HK1, HKQ63S Q change 3 AQ1 operating temperature range - to +12 Applied currentated current Duration12 hrs ecovery2 to 3 hrs of recovery under the standard condition after the test.see Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: to 3 of temperature, 4 to 8% relative humidity, and 86 to 16kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 2 2 of temperature, 6 to 7% relative humidity, and 86 to 16kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) measurement shall be made after 48 2 hrs of recovery under the standard condition. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 23

21 PECAUTIONS 1/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations 1. Circuit Design Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Operating Current Verification of ated current 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. FEITE PODUCTS 2. PCB Design Pattern configurations Design of Land-patterns 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used size of filletcan directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger fillets which extend above the component end terminations. Examples of improper pattern designs are also shown. 1ecommended land dimensions for a typical chip inductor land patterns for PCBs 1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. 2When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 3The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. ecommended land dimensions for wave-soldering unit: mm Type Size L W A B C ecommended land dimensions for reflow-soldering unit: mm Type Size L W A B C Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. ecommended land dimension for eflow-soldering unit: mm Size L W a b c d.8. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 2

22 PECAUTIONS 2/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations 2.PCB Design 2Examples of good and bad solder application Mixed mounting of SMD and leaded components C o m p o n e n t placement close to the chassis Not recommended ecommended Pattern configurations Inductor layout on panelized breakawaypc boards 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc. For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. Hand-soldering o f l e a d e d c o m p o n e n t s near mounted components Horizontal component placement 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Deflection of the board Not recommended ecommended 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. FEITE PODUCTS 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 27

23 PECAUTIONS 3/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations 3.Considerations for automatic placement Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: 1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. 2The pick-up pressure should be adjusted between 1 and 3 N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Single-sided mounting Double-sided mounting Improper method Proper method FEITE PODUCTS 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Selection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. 1equired adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 29

24 PECAUTIONS 4/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precaution Technical considerations 3.Considerations for automatic placement When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. ecommended conditions Figure a b c 8 case sizes as examples.3mm min 1 12 m Area with no adhesive FEITE PODUCTS 4.Soldering Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; 1Flux used should be with less than or equal to.1 wt% Chlorine conversion methodof halogenated content. Flux having a strong acidity content should not be applied. 2When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. 3When using water-soluble flux, special care should be taken to properly clean the boards When too much halogenated substance Chlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting watersoluble flux. Soldering Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions Preheating when soldering Heating: Chip inductor components should be preheated to within 1 to 13 of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 1. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 261

25 PECAUTIONS /7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations 4.Soldering And please contact us about peak temperature when you use lead-free paste. ecommended conditions for soldering eflow soldering Temperature profile Temperature 3 Peak 26 max 1 sec max Pb free soldering Ceramic chip components should be preheated to within 1 to 13 of the soldering. Assured to be reflow soldering for 2 times. Caution 1. The ideal condition is to have solder mass filletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below: 2 1 Preheating 1 6 sec min Gradually cooling Heating above 23 4 sec max FEITE PODUCTS 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. Wave soldering Temperature profile Temperature Pb free soldering Peak 26 max 1 sec max Preheating 1 Gradually cooling 12 sec min Ceramic chip components should be preheated to within 1 to 13 of the soldering. Assured to be wave soldering for 1 time. Except for reflow soldering type. Caution 1. Make sure the inductors are preheated sufficiently. 2. The temperature difference between the inductor and melted solder should not be greater than 1 to Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the inductors designated as for reflow soldering only. Hand soldering Temperature profile Temperature Pb free soldering 3 max 3 sec max Gradually cooling 1 6 sec min T Type max, Type ming It is recommended to use 2W soldering iron and the tip is 1 or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. Caution 1. Use a 2W soldering iron with a maximum tip diameter of 1. mm. 2. The soldering iron should not directly touch the inductor..cleaning Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning e.g. to remove soldering flux or other materials from the production process. 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties especially insulation resistance. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 263

26 PECAUTIONS 6/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations.cleaning 6. Post cleaning processes 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Application of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. Inappropriate cleaning conditions insufficient or excessive cleaningmay detrimentally affect the performance of the inductors. 1Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 2 w/ Ultrasonic frequency Below 4 khz Ultrasonic washing period or less FEITE PODUCTS 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3. Stress caused by a resins temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. 7. Handling Breakaway PC boards splitting along perforations 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. General handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. 4. Any devices used with the inductors soldering irons, measuring instrumentsshould be properly grounded.. Keep bare hands and metal products i.e., metal desk away from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. Mechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. 1If inductors are dropped on the floor or a hard surface they should not be used. 2When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 26

27 PECAUTIONS 7/7 Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads Stages Precautions Technical considerations 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors ecommended conditions Ambient temperature Humidity Below 4 Below 7% H The ambient temperature must be kept below 3. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *The packaging material should be kept where no chlorine or sulfur exists in the air. FEITE PODUCTS Please read the "Notice for TAIYO YUDEN products" before using this catalog. 267