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1 Vacuum Process Tools Vacuum Process Tools Outlines ULVAC provides robots and platforms for handling substrates such as Si wafers in vacuum. There are options, for example vacuum pumping system and tool control software. Features The robot can convey by the vacuum to use a linkage. Surface treatment for UHV. Suitable for ultra clean environment. Wafer is transported with stabilkity. Applications s and vacuum systems for OEM. Handling over 2m glass substrates. Robots and platforms for machines handling various substrate in vacuum. Transfer module for tool in the clean environment.
2 ROBOTS KEYTRAN-Z for UHV 200mm 300mm Substrate size 200mm 300mm Outline Drawing KEYTRAN is the very best solution for UHV and cleanness. R /1.4s -axis endless /2.2s Z 28mm /1.4s AC Vacuum motor is bakeable. AC servomotor (3-axis) 0.05mm 0.1mm 0.05mm The arm shape is collected according to each usage. COVOT 200mm 300mm Substrate size 200mm 300mm Outline Drawing Direct-Drive-Actuator realizes precise handling. Max.speed R / 1.4 s 0.1mm endless / 2.2s 0.2mm Z 50mm Fulll stroke /2.3s 0.2mm RS232CDI/O Installation direction is free. Being equipped with RS232C and DI/O connectors. Actuator includes controler. Function of Auto Wafer centering and Sensing (AWS). Optional. The arm shape is collected according to each usage.
3 COVOT-LC ROBOTS 300mm Substrate size 300mm Outline Drawing Handling tool Robot having simple structure. R -axis Z 30kg The Z axis operation pear. Weight : About 30[kg] /2.5s /2.5s 0.2mm 0.2mm The arm shape is collected according to each usage. COVOT mm Substrate size 300mm Outline Drawing 4 COVOT-6 realizes a high throughput for its purpose which has the arm of four pieces of independence. R 860mm /2.5s 0.5mm -axis endless /3.0s 0.5mm Z 90mm 20mm/2.0s 0.5mm AWS Available for synchronously Load/Unload 2 wafers. Function of Independent Hand-off. Function of Auto Wafer centering and Sensing (AWS). Optional.
4 ROBOTS ULSTA SERIES FPD for FPD LCD G6, G7, G8 For LCD manufacturing equipment Substrate size Glass Substrate G6, G7, G8 Outline Drawing 2m Handling over 2m glass substrates with double arm. R /4s 0.5mm -axis 330 /4s 0.5mm Z / G6 G7 : 3s G8 : 6s 0.2mm G6,G7,G8 180 It provides the robot to have supported each glass size. It is possible to replace substrates without turning over 180 degree. A B C D E Z The size measurement table ULSTA-1800(G6) ULSTA-2000(G7) ULSTA-2400(G8) Pressure Area 1e+2Pa 1e-1Pa 1e-5Pa 1e-9Pa /LV /MV /HV /UHV KEYTRAN-Z COVOT COVOT-LC COVOT-6 ULSTA SERIES The pressure area was supposed from design of the robot. When selecting please consult.
5 Base system NCH-4000 Vacuum cluster tool integration platform 200mm 300mm The semiconductor manufacturing equipment Substrate size 200mm 300mm Outline Drawing 300mm Needs the least space in machines handling 300mm. Substrate Facets Robot Standard Max. 300mm wafer 4 COVOT Optional Glass substrate KEYTRAN-Z 200mm 25 Max. 200mm wafers are handled by dual E-E type robot. An elevator for 25 wafers is in a load lock. NCH Vacuum cluster tool integration platform Conpositon FS This unit is composed to the necessary minimum as the platfome. Stand COVOT-LC Substrate Facets Standard 300mm wafer 4 COVOT-LC Equip a COVOT-LC Robot COVOT-LC The vacuum gauge and the pump are necessary separately.
6 Vacuum Process Tools ULVAC CS SOLUTIONS PACKAGE 11 Service Packages to meet evolving market demands A local communication based system Field Service Worldwide service for upgrading existing equipmentglobal CIP A reliable system that delivers equipment parts promptly Parts A wide-ranging product line upmaterials for Thin film /Bonding Service Ultra fine (UF) cleaning that pursues longevity and particle reductionrecycling and UF Cleaning Surface treatments for vacuum equipment parts that meet high performance demandssurface Treatment Evaluation and analysis by experts to accomplish true qualityanalysis Services Effective recycling of idle equipment from a single component to total line equipmentused Equipment/Refurbishing A lease program that helps you draw up an affordable investment plan Operating Lease A service for supporting factory operations to achieve manufacturing and developmental goals Factory Outsourcing Wafer / display and various other processing services such as MEMSWafer/Device processing service Selection guide for vacuum process tools Level 3 option Level 2 option Level 1 option Base system Only robots Tool control software for handling substrates, vacuum, etc Vacuum gauge, mass spectrometers, analyzer and so on TMP Vacuum pumps such as TMP, cryo pump and dry pump Chamber with supports The partner declaration We propose a robot according to the specifications such as reach, payload capacity and so on. Maintenance When Substrate are handled robots are recommended overhaul. The default value is written the specification of each robot Training A short course for robot maintenance will be held by the demands of customers. Standard value is written while the catalog. ULVAC, Inc. Control Solutions Division Sales Section TEL: FAX: control@ml.ulvac.com URL: Specifications may be changed without a notice. NE7803/ UYO
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