( ) ( ) 1
MEMS : MEMS ( +13% / ) 2
3
ISFET ph,co 2 (K.Shimada, M.Esashi, Med.& Biol.Eng.& Comp.,18 (1980) p.741) (M.Esashi T.Matsuo, Supplement to the J.J.AP.,44 (1975),339-343) 4
5
(Y.Matsumoto, S.Shoji, M.Esashi, 22nd Conference on Solid State Devices and Materials (1990) 701) 6
(1000V) (DC~10GHz) LSI MEMS (MEMS )( ) 7
(NHK, ) (T.Tajima (NHK), M.Esashi et.al., Microelectronic Engineering, 67-68 (2003) 508) 8
SiO 2 LPCVD (650 ) 125nm Si poly-si (1000 ) (3MPa) (0.4 0.7 m / min) Si (M.Kirsten, B.Wenk (Fraunhofer-Inst.), F.Ericson, J.A.Schweitz (Uppsala Univ.) Thin Solid Films, 259 (1995) pp.181-187) ST Microelectronics 9
(J.C.Eloy, SEMICON Japan 2010)
(M.Nagao et.al.,sae World Congress, Detroit, (2004)) 11
2 (IDG-1000) ( ) (J.Seeger, M.Lim and S.Nasiri : Technical Digest Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, 61 (2010) ) 12
1.5mm 7.4 ( ) ( ) MESAG-100 (Micro Electrostatically Suspended Accelerometer Gyro) ( ) 13 (T.Murakoshi, Jpn. J. Appli. Phys., 42, Part1 No.4B (2003) p.2468)
( ) 14
(T.Katsumata et.al., Optical MEMS 97) (K. Totsu et.al., Transducers 03 (2003) ) 15
/ ~10 18 g 400 m 0.2 m f 0 =669.5Hz Q=1325 NdFeB (10 m ) (Magnetic Resonance Force detective Microscope (MRFM)) (T.Ono and M.Esashi, Rev. of Scientific Instruments, 74 (2003) 5141) 16
MRFM 17
Optical image 10 m (MRFM) (ESR) DPPH (diphenylpicrylhydrazil))( ) 18
640 480 (1 ) (NEC) (S.Tohyama, Optical Engineering, 45 (2006) p.014001) 19
( NEC) 20
64 64 ( ) (T.Shimizu ( ), SEMI Technology Symposium (STS) 2010) 21
4 22 SAW (J.Kuypers, APCOT2006 p.293)
SAW (S.Hashimoto, Proceedings of the 24th Sensor Symposium, (2007), p.267) 23
SAW (A.Randles, 2008 IEEE International Ultrasonic Symposium (2008) p.1124) 24
(N.Asada et.al., IEEE Trans. on Magnetics 30 (1994)) 3 ( 33 1 (2009) 41) 25
Concept PZT CVD 800 600 pixels (SVGA) 40 cm (H.Matsuo, Y.Kawai and M.Esashi : Jap. J. Appl. Phys, 49 (2010) 04DL19 ) (E.Kawasaki, H.Yamada and H.Hamanaka : IDW 09 (2009) 1345 ) 26
( ) 27
(1920 1080 ) 1999 Star Wars : Episode 1 (George Lucas ) DLP DMD (Digital Micromirror Device)( TI ) 28
TiAl 3 DMD TiAl 3 (DLP) DMD TiAl 3 - (J.Tregilgas, Advanced materials and Processes, (2005 Jan.) 45-49) 29
FBAR (Film Balk Acoustic Resonator) LSI LSI (T.Matsumura (NICT), 2009 IEEE Internl. Ultrasonic Symp. (2009) 2141) 30
LSI SAW (502 MHz) (SAW) LSI (K. D. Park, IEEJ The 26th Sensor Symposium, 37 (2009) 31
MEMS SAW (T.Yasue, Transducers 2011) 32
Au 33
Au/Cr Through via hole NPG LTCC Au Photoresist LTCC LTCC h 2 h 2 > h 1 h 1 Si Au-Sn LTCC MEMS components Mechanical sealing frame Pressure, voltage and heat (Sn ) LTCC AuSn LTCC h 1 h 2 NPG Si (NPG) ENAS ) 34 (Y.-C. Lin, W.-S. Wang et.al., Transducers 2011)
6 / ( 1039, 2010/9/20) 35
Beam Blanker Array 1.4mm 1.5mm 10 11 (110 ) 13,000 Y 2 m X 22nm (30nm LS ) (5kV) 0.3nA 10 (300mm ) / Mapper ( http://www.mapperlithography.com/) (EB) ( EB ( ) (2009) p.158) 36
10 mm Si (A Kojima, H. Ohyi and N. Koshida ( ), J. Vac. Sci. Technol., 37 B26, 6 (2008) 2064)
( ) 38
MEMS PC (80 ) MEMS (MEMSPC) MEMS (20mm ) (MNC) (2 LSI )) ( SIC) ( (4/6 )) (4/6 ) U.C.Berkeley MEMS MEMS Industry Group IMEC NICT LETI MEMS 39
2 ( ) (,,,, vol.10, no10, pp.32-35, Oct.1990.) 40
( ) 41
(2007 2016) http://www8.cao.go.jp/cstp/sentan/index.html 42
(MNC) (2 LSI ) ( ) (4/6 MEMS ) MEMS MEMS MEMS (20mm ) (8 ) 43
2010.4 2011.8 ( ) 4 Tr 4/6 MEMS 44
( ) http://www.mems-core.com/ 45
( ) 46
IMEC ) 2010.8 2011.2 2011 IMEC Strategic Partner ( (EPFL)) 47
48
49
) MEMS ( CD) ( ) 2006 8/23-25 280 2007 8/22-24 80 2008 8/20-22 150 2009 8/4-6 100 2010 8/5-7 211 2011 8/9-11 170 MEMS (MEMSPC) MEMS 50
MEMS ican2009 2009 10 13 16 3 4 ican2009 2010 1 LED 2 ican 11 2010 12 6 7 8 2 2 ican 11 2011 6 5-7 ican2009 ican 11 (2010/9/3) ICAN MEMS 51
2007-2008 - 52
53
( ) http://www.mmjp.or.jp/tmc-seminar/column/es-column/es-column.html 54 2009 6 ( )