Thermal Interface Silicone Rubber

Thermal Interface Silicone Rubber High-hardness Thermal Interface Silicone Rubber Thermal Interface Silicone Soft Pads Double Sided Thermal Interface Silicone Tapes Thermal Interface Silicone Ultra Soft Pads Thermal Interface Phase Change Materials Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheets

Shin-Etsu products Effective tools in the quest for cool. products lineup High-hardness Thermal Interface Silicone Rubber P4-9 Thermal Interface Silicone Soft Pads P1-15 Thermal Interface Silicone Ultra Soft Pads P16-2 Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheets P21 Double Sided Thermal Interface Silicone Tapes P22-23 Thermal Interface Phase Change Materials P24-25 How to Read Model Numbers of TC Series Thickness The thickness of the TC Series product is specified by a two digit code corresponding to the thickness in millimeters muliplied by 1. Example Thickness.5mm Thickness 1mm Thickness Grade Form Grade The grade of the TC Series product is classified according to the physical properties of the silicone rubber. Form The form of the TC Series product is shown at the end. High-hardness Thermal Interface Silicone Rubber Example A type EG type Thermal Interface Silicone Soft Pads/Ultra Soft Pads Example HS-1.4 type TXS type Cut sheet models Cap type molded models Tube type molded models For custom-order models, the customer's order number and dimensions can be added. 2

Features High-hardness Thermal Interface Silicone Rubber These products have fine electrical properties (electric non-conductivity, etc.) There is a reinforcement type with the Fiberglass or Polyimide film. Not only sheet, but also Cap or Tube shapes. These products can even meet the needs for reduction of the creeping distance of transistors. Nearly all products are UL-certified for flame-retardancy. Can be used in a wide temperature (-4 C to +18 C). Thermal Interface Silicone Soft Pads These products are pliable and capable of close conformity to irregular or complex surfaces. They are easy to apply and remove, and can be used for temporary attachment. Nearly all products are UL-certified for flame-retardancy. Can be used in a wide temperature (-4 C to +18 C). Silicone oil contained in the sheet may come to the surface when the sheet is used. Thermal Interface Silicone Ultra Soft Pads Excellent cost performance and high thermal conductivity. Ultra soft-hardness that makes for good compressibility and a stress-relaxation property that can reduce stress to heat moules. Nearly all products are UL-certified for flame-retardancy. Low specific gravity. Can be used in a wide temperature (TC-SP-1.7, TC-SPA-3., TC-CAS/CAB series: -4 C to +15 C. TC-CAD/CAT-2 series: -4 C to +18 C). Silicone oil contained in the sheet may come to the surface when the sheet is used. Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheets Thermal interface sheets which also shield high frequency noise. Excellent heat resistance and flame retardancy. Excellent workability. The sheets are flexible and easy to cut to shape. Halogen-free, making these sheets eco-friendly. Can be used in a wide temperature range-4 C to +15 C. Silicone oil contained in the sheet may come to the surface when the sheet is used. Double Sided Thermal Interface Silicone Tapes Strong and stable adhesive strength without screws. Thermal resistance is stable across a wide temperature range. Can be applied to wide areas using automated equipment. Thermal Interface Phase Change Materials Phase change materials are high-performance thermal interface sheets that soften with heat. Heat softens the sheet for a better conforming fit, which reduces thermal resistance. The result is superior dissipation of heat. Made of silicone, so they provide long-lasting, dependable performance. Sheets are easy to handle. Reworkable. 3

High-hardness Thermal Interface Silicone Rubber Sheet Type General Properties Parameter Test Method Grade TC-A Series TC-CG Series TC-EG Series TC-2A TC-3A TC-45A TC-8A TC-2CG TC-3CG TC-45CG TC-8CG TC-2EG TC-3EG TC-45EG Color Dark blue Light reddish brown Light blue Thickness mm.2.5.3 +.1 -.45.5.8 +.1 -.2.5.3 +.1 -.45.5.8 +.1 -.2.5.3 +.1 -.45.5 Features General purpose General purpose High thermal conductivity ISO 227-2.8 1.7 3.1 Thermal Conductivity W/m K ASTM E153 1.1 1.9 4.5 Reinforced layer None Fiberglass Fiberglass Density at 23 C g/cm3 JIS K 6249 2.2 2.5 3.1 HardnessDurometer A JIS K 6249 8 9 95 Tensile Strength MPa JIS K 6249 5.7 25.9 24.1 2.4 9.3 22. 16.8 14.9 Tear Strength kn/m JIS K 6249 8. 7 81 7 24 76 53 59 Elongation % 11 1Dielectric Breakdown Voltage1 kv JIS K 6249 9 12 15 2 5 7 1 19 4 7 8 1Dielectric Strength1 kv JIS C 211 5 7 9 13 2 3 5 1 2 5 6 Volume Resistivity TΩ m JIS K 6249 1. 1.8 1.2 1. 25 1 19 Dielectric Constant Dielectric Dissipation Factortan 5Hz 4.8 3.8 4.2 4.3 6.5 1kHz JIS K 6249 4.8 3.8 4.2 4.3 6.5 1MHz 4.7 3.8 4.2 4.3 6.4 5Hz 51-3 71-3 61-3 51-3 41-3 1kHz JIS K 6249 41-3 41-3 31-3 71-3 1MHz 21-3 41-3 31-3 51-3 4 Thermal Resistance TO-3P C/W.75 1.2 1.7 2.6.48.7 1. 1.3.15.3.45 Shin-Etsu Method4 2Flame-Retardance2UL94 V- V- V- 5 Low-molecular-weight siloxane content ppm 1>D3-1 1>D3-1 1>D3-1 Shin-Etsu Method5 Sheet mm 31 321 31 34 Stock Size Roll AV Type with adhesive on single-sided 4 Thermal ResistanceTO-3P C/W Shin-Etsu Method4.93 1.39 1.57 1.92 2Flame-Retardance2UL94 V- Stock Size Sheet mm 2949 Roll 32mm5m 32mm25m Depends on the thickness of each product.approved products for UL94 [ File No.E 48923 ]. Calculation valuetransistor method: (P.28)Acetone extraction method. Form The TC Series are available in four standard models tailored for use with a variety of transistor types. TC series products can be manufactured to custom shapes and forms upon special request. Contact your local sales representative for details. 4

Examples of application TC-BG Series TC-2BG TC-3BG TC-45BG TC-8BG White TC-15CG-5HSV Right reddish brown / Gray TC-15TCI Pink Thermal interface silicone rubber cap.2.5.3 +.1 -.45.5.8 +.1 -.2.15.3 High thermal conductivity 1.5.6 3 5. 1.2 3 Fiberglass High insulation Polyimide film Transistor Substrate Cap Heatsink 1.5 2.6 2.2 9 9 51. 49. 14. 27 46 Thermal interface silicone rubber sheet 197 223 29 54 113 6 5 Transistor Heatsink 7 12 16 21 7 12 2 5 7 12 1 Substrate Sheet 8 1 9 11 3. 3.1 2.9 3. 3.1 2.9 Thermal interface silicone rubber tube 3. 3.1 2.9 31-3 51-3 91-3 Not applicable for thin film. Transistor Heatsink 21-3 51-3 21-3 Substrate Tube.11.26.35.46.37.64 V- V- V- 1>D3-1 1>D3-1 2127 321 31 3mm6m Not specified values.49.73.85.92 1.8 V- 226 3mm5m Not specified values Model TO-22 Model TO-3P Model TO-3PL Model TO-3P2 5

Cap Type General Properties Parameter Test Method Grade TC-A-CP Series TC-C-CP Series TC-S2-CP Series TC-3A TC-45A TC-8A TC-3C TC-45C TC-8C TC-3S2 TC-45S2 TC-8S2 Color Dark blue Light reddish brown Brown Wall Thickness mm.3 +.15 -.45 +.1 -.5.8 +.15 -.3 +.15 -.45 +.1 -.5.8 +.15 -.3 +.15 -.45 +.1 -.5.8 +.15 - Features General purpose Medium thermal conductivity High thermal conductivity ISO 227-2.8 1.8 2. Thermal Conductivity W/m K ASTM E153 1.1 1.5 2. Density at 23 C g/cm3 JIS K 6249 2.2 2.6 2.9 HardnessDurometer A JIS K 6249 8 88 75 Tensile Strength MPa JIS K 6249 5.7 3.2 3. Tear Strength kn/m JIS K 6249 8. 9.8 6. Elongation % JIS K 6249 11 1 1 1Dielectric Breakdown Voltage1 kv JIS K 6249 12 15 2 12 15 22 6 9 14 1Dielectric Strength1 kv JIS C 211 7 9 13 1 13 18 5 7 12 Volume Resistivity TΩ m JIS K 6249 1. 3.2 35 Dielectric Constant Dielectric Dissipation Factortan 5Hz 4.8 6. 6.4 1kHz JIS K 6249 4.8 6. 6.3 1MHz 4.7 6. 6.2 5Hz 51-3 61-3 41-3 1kHz JIS K 6249 41-3 31-3 11-3 1MHz 21-3 21-3 41-4 3 Thermal Resistance TO-3P C/W 1.2 1.7 2.6.68.95 1.6.4.6 1.1 Shin-Etsu Method3 2Flame-Retardance2UL94 V- V- V- 4 Low-molecular-weight siloxane content ppm 1>D3-1 1>D3-1 1>D3-1 Shin-Etsu Method4 Depends on the thickness of each product. Approved products for UL94 [ File No.E 48923 ]. Transistor method: (P.28)Acetone extraction method. Not specified values Form Dimensions The cap type products are registered under Japanese Patent No. 1962645. Length Width Wall thickness Thickness Grade TC-3A TC-3C TC-3S2 TC-45A TC-45C TC-45S2 TC-8A TC-8C TC-8S2 Parameter Widthmm Outside dimensions CP-TO-22 11.4.5 21.51. CP-TO-3P 17.5.5 28.51. Lengthmm Thicknessmm CP-TO-22 11.4.5 21.51. 5.8.3 CP-TO-3P 17.5.5 28.51. 5.9.3 CP-TO-22 12.1.5 21.81. 6.5.3 CP-TO-3P 18.2.5 28.81. 6.6.3 Wall thickness mm 5.8.3.3 +.15 -.45 +.1 -.5.8 +.15 - TC series products can be manufactured to custom shapes and forms upon special request. Contact your local sales representative for details. 6

High-hardness Thermal Interface Silicone Rubber Tube Type General Properties Parameter Test Method Grade TC-A-KT Series TC-3A TC-45A TC-8A Color Dark blue Wall Thickness mm.3 +.1 -.45.5.8 +.1 - Features General purpose ISO 227-2.8 Thermal Conductivity W/m K ASTM E153 1.1 Density at 23 C g/cm3 JIS K 6249 2.2 HardnessDurometer A JIS K 62493 8 Tensile Strength MPa JIS K 62493 5.7 Tear Strength kn/m JIS K 62493 8. Elongation % JIS K 62493 11 1Dielectric Breakdown Voltage1 kv JIS K 6249 12 15 2 1Dielectric Strength1 kv JIS C 211 7 9 13 Volume Resistivity TΩ m JIS K 6249 1. 5Hz 4.8 Dielectric Constant 1kHz JIS K 6249 4.8 1MHz 4.7 Dielectric Dissipation Factortan 5Hz 51-3 1kHz JIS K 6249 41-3 1MHz 21-3 4 Thermal Resistance TO-3P C/W 1.2 1.7 2.6 Shin-Etsu Method4 2Flame-Retardance2UL94 V- 5 Low-molecular-weight siloxane content ppm 1>D3-1 Shin-Etsu Method5 Depends on the thickness of each product. Approved products for UL94 [ File No.E 48923 ]. Not specified values Test piece: Dumbbell shaped test piece 2.Transistor method: (P.28)Acetone extraction method. Dimensions Form Length Inside diameter Wall thickness TC series products can be manufactured to custom shapes and forms upon special request. Contact your local sales representative for details. Grade TC-3A TC-45A TC-8A Parameter Inside diameter Length Wall thickness mm mm mm 9.51. 251 31 KT-9525L KT-953L KT-1725L 251 1.71. KT-173L 31 KT-13525L 251 13.51. KT-1353L 31 KT-1725L 251 1.71. KT-173L 31 KT-13525L 251 13.51. KT-1353L 31 KT-1735L 17.1. 351 KT-1725L 251 1.71. KT-173L 31 KT-13525L 13.51. KT-1353L 31 KT-1735L 17.1. 351.3 +.1 -.45.5 251.8 +.1-7

Data Test condition: 15 C Type Parameter Status Value 2h 5h 1h TC-45A TC-45CG TC-45EG TC-45BG A Hardness Durometer A Thermal Resistance Dielectric Strength Dielectric Breakdown Voltage Tensile Strength A Hardness Durometer A Thermal Resistance Dielectric Strength Dielectric Breakdown Voltage Tensile Strength A Hardness Durometer A Thermal Resistance Dielectric Strength Dielectric Breakdown Voltage Tensile Strength A Hardness Durometer A Thermal Resistance Dielectric Strength Dielectric Breakdown Voltage Tensile Strength 8 86 9 93 C/W 1.7 1.7 1.7 1.8 kv 9. 8. 8. 8. kv 15. 14. 15. 15. MPa 6.8 6.9 7.5 7.6 9 9 91 92 C/W 1. 1.9 1.13 1.2 kv 5. 5. 5. 5. kv 1. 11. 11. 12. MPa 2 22 22 21 95 94 95 95 C/W.45.49.5.58 kv 6. 6. 6. 6. kv 8. 8. 8. 7. MPa 14.9 13. 14.5 14.8 9 9 92 94 C/W.35.4.4.45 kv 7. 7. 7.5 7. kv 16. 16. 17. 16. MPa 49. 49. 49. 49. Not specified values 8

High-hardness Thermal Interface Silicone Rubber Solvent ResistanceWeight change Solvents Type TC-45A TC-45CG TC-45EG TC-45BG Pure water.2.3.2.4 Ethanol 1.7 1.6 1.3 2.1 Acetone 1.2 1.2 1.3 2.2 Toluene 2.3 2.1.9 2. Test conditionstest piece2mm x 3mm, Immersion time1 min. in each solvent, Exposure time2 min. at room temperature Torque for thread fastening vs. Thermal Resistance 2 1.8 1.6 Thermal Resistance C / 1.4 1.2 1.8.6.4.2 2 4 6 8 Torque for thread fasteningkgfcm TC-A TC-CG TC-EG TC-BG Transistor: TO-3P Applied power: 5V x 2A Thickness of test piece:.45 mm 9

Thermal Interface Silicone Soft Pads General Properties Parameter Test Method Grade TC-1HSV-1.4 TC-1TXS "1" shows 1. mm in thickness. "1" shows 1. mm in thickness. Color Gray Gray Size mm 34 34 Structure Single layer Single layer Thickness mm 1. 1. Density at 23 C g/cm3 JIS K 6249 2.5 3.1 1Hardness1Asker C 25 45 Dielectric Breakdown Voltage kv JIS K 6249 23 2 Dielectric Strength kv JIS C 211 18 18 Specific Heat J/g K.89.83 Calculated Value Thermal Conductivity W/m K ISO 227-2 1.2 3.3 ASTM E153 1.4 5. 2 Thermal Resistance C/W 1.8.4 Shin-Etsu Method2 Flame-RetardanceUL94 V- V- 3 Low-molecular-weight siloxane content ppm 26D3-1 24D3-1 Shin-Etsu Method3 HardnessAsker C Measured using 2 overlappingthermal interface silicone soft padsthickness: 6mm. Model heater method: (P.28)Acetone extraction method..5+.15/-.5, 1.±.15.5±.1, 1.±.15, 1.5±.15 Thickness mm 1.5±.15, 2.±.2, 2.5±.2 2.±.15, 2.5±.2, 3.±.25 3.±.2, 4.±.2, 5.±.3 Grade TC-xxxHSV-1.4 TC-xxxTXS.5mm.63.25 1.mm 1.8.4 1.5mm 1.49.53 2.mm 1.83.67 C/W Thermal Resistance depending on thickness 2.5mm 2.15.82 3.mm 2.59.93 4.mm 1.23 5.mm 1.54 Structure Single layer type HSV-1.4 / THS / TXS / TXS2 Series Composite type THE / TXE Series Thermal interface silicone soft pad (Double-sided adhesive) Carrier liner film (Polyethylene) Carrier liner film (PET) Please release the Carrier liner film when using. Adhesive side: Thermal interface silicone soft pad Non adhesive side: Thermal interface silicone rubber Carrier liner film (Polyethylene or Polypropylene) Carrier liner film (PET) 1

Examples of application TC-1TXS2 TC-1TXE "1" shows 1. mm in thickness. "1" shows 1. mm in thickness. Gray /Light blue/gray 34 34 Single layer Composite Heat dissipation of surface mount semiconductor chip Surface mount semiconductor chip Heatsink 1. 1. 3.1 3.1 2 2 21 21 Substrate Thermal interface silicone soft pad 17 2.83.83 3.3 3.3 5. 5..35.48 V- V- Heat dissipation of substrate Semiconductor chip Substrate 6D3-1 24D3-1 Not specified values General properties are shown only for the selected representative products..5+.15/-.5, 1.±.15, 1.5±.15.5+.15/-.5, 1.±.15 2.±.15, 2.5±.15, 3.±.15 1.5+.3/-, 2.±.25, 2.5±.25 4.±.15, 5.±.3 3.±.25, 4.±.25, 5.±.3 Thermal interface silicone soft pad Heatsink Not specified values TC-xxxTXS2 TC-xxxTXE.18.29.37.48.51.54.64.71.73.92.85 1. 1.9 1.26 1.31 1.55 Not specified values 11

Data TC-HSV-1.4 Series Compressive Load and Compressibility Compressibility% 4 3 2 1.5 1. 1.5 2. 2.5 3. Compressive loadmpa ConditionsCompression rate.5 mm/min. Test Dimensions1 x 1 mm 5HSV-1.4 1HSV-1.4 2HSV-1.4 3HSV-1.4 Compressive Load and Thermal Resistance Thermal Resistance C/W 3. 2.5 2. 1.5 1..5 3HSV-1.4 2HSV-1.4 1HSV-1.4 5HSV-1.4 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Hardness Change 6 Thermal Resistance Change (15 C) 3. HardnessAsker C 5 4 3 2 1 25 5 75 1 Thermal Resistance C/W 2.5 2. 3HSV-1.4 2HSV-1.4 1.5 1HSV-1.4 1. 5HSV-1.4.5 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (85 C/85%RH) 3. Thermal Resistance C/W 2.5 3HSV-1.4 2. 2HSV-1.4 1.5 1. 1HSV-1.4 5HSV-1.4.5 25 5 75 1 Aging timeh Thickness:1mmPressure rising rate:1kv/s Volume Resistivity Change Volume Resistivity cm 1..E+15 1..E+14 1..E+13 1..E+12 1..E+11 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (-4 C to 125 C) 3. Thermal Resistance C/W 2.5 3HSV-1.4 2. 2HSV-1.4 1.5 1HSV-1.4 1. 5HSV-1.4.5 25 5 75 1 Number of cycletimes Thickness:1mmCharging voltage:5v 12

Thermal Interface Silicone Soft Pads TC-TXS Series Compressive Load and Compressibility Compressibility% 4 3 2 1.5 1. 1.5 2. 2.5 3. Compressive loadmpa ConditionsCompression rate.5 mm/min. Test Dimensions1 x 1 mm 5TXS 1TXS 2TXS 3TXS 4TXS 5TXS Compressive Load and Thermal Resistance 3. Thermal Resistance C/W 2.5 2. 1.5 1..5 5TXS 4TXS 3TXS 2TXS 1TXS 5TXS 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Hardness Change 8 Thermal Resistance Change (15 C) 1.2 HardnessAsker C 7 6 5 4 3 2 1 25 5 75 1 Thermal Resistance C/W 1. 3TXS.8 2TXS.6 1TXS.4 5TXS.2 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (85 C/85%RH) 1.2 Thermal Resistance C/W 1. 3TXS.8 2TXS.6.4 1TXS 5TXS.2 25 5 75 1 Aging timeh Thickness:1mmPressure rising rate:1kv/s Volume Resistivity Change Volume Resistivity cm 1..E+15 1..E+14 1..E+13 1..E+12 1..E+11 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (-4 C to 125 C) 1.2 Thermal Resistance C/W 1. 3TXS.8 2TXS.6.4 1TXS 5TXS.2 25 5 75 1 Number of cycletimes Thickness:1mmCharging voltage:5v 13

TC-TXS2 Series Compressive Load and Compressibility Compressibility% 7 6 5 4 3 2 1 5TXS2 1TXS2 2TXS2 3TXS2 4TXS2 5TXS2.5 1. 1.5 2. Compressive loadmpa Conditions: Compression rate:.5mm/min Test Dimention:12.7mm Compressive Load and Thermal Resistance Thermal Resistance C/W 3. 2.5 2. 1.5 5TXS2 4TXS2 1. 3TXS2 2TXS2.5 1TXS2 5TXS2 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2 Hardness Change 8 Thermal Resistance Change (15 C) 1.2 HardnessAsker C 7 6 5 4 3 2 1 Thermal Resistance C/W 1..8.6.4.2 3TXS2 2TXS2 1TXS2 5TXS2 2 4 6 8 1 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (85 C/85%RH) 1.2 Thermal Resistance C/W 1. 3TXS2.8 2TXS2.6.4 1TXS2 5TXS2.2 25 5 75 1 Aging timeh Thickness:1mmPressure rising rate:1kv/s Volume Resistivity Change 1..E+13 Volume Resistivity cm 1..E+12 1..E+11 1..E+1 1..E+9 2 4 6 8 1 Aging timeh Number of cycletimes Thermal Resistance Change (-4 C to 125 C) 1.2 Thermal Resistance C/W 1. 3TXS2.8 2TXS2.6.4 1TXS2 5TXS2.2 25 5 75 1 Number of cycletimes Thickness:1mmCharging voltage:5v 14

Thermal Interface Silicone Soft Pads TC-TXE Series Compressive Load and Compressibility Compressibility% 4 3 2 1.5 1. 1.5 2. 2.5 3. Compressive loadmpa ConditionsCompression rate.5 mm/min. Test Dimensions1 x 1 mm 5TXE 1TXE 2TXE 3TXE 4TXE 5TXE Compressive Load and Thermal Resistance Thermal Resistance C/W 3. 2.5 2. 1.5 1..5 5TXE 4TXE 3TXE 2TXE 1TXE 5TXE 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Hardness Change 6 Thermal Resistance Change (15 C) 1.2 HardnessAsker C 5 4 3 2 1 25 5 75 1 Thermal Resistance C/W 1..8 3TXE 2TXE.6 1TXE.4 5TXE.2 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (85 C/85%RH) 1.2 Thermal Resistance C/W 1..8 3TXE 2TXE.6 1TXE.4 5TXE.2 25 5 75 1 Aging timeh Thickness:1mmPressure rising rate:1kv/s Volume Resistivity Change Volume Resistivity cm 1..E+15 1..E+14 1..E+13 1..E+12 1..E+11 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (-4 C to 125 C) 1.2 Thermal Resistance C/W 1. 3TXE.8 2TXE.6.4 1TXE 5TXE.2 25 5 75 1 Number of cycletimes Thickness:1mmCharging voltage:5v 15

Thermal Interface Silicone Ultra Soft Pads General Properties Parameter Test Method Grade TC-1SP-1.7 TC-1SPA-3. "1" shows 1. mm in thickness. "1" shows 1. mm in thickness. Color Gray/Reddish brown Gray Size mm 34 34 Structure Composite Single layer Thickness mm 1. 1. Density at 23 C g/cm3 JIS K 6249 2.3 2.4 1Hardness1Asker C 2 4 Dielectric Breakdown Voltage kv JIS K 6249 2 Dielectric Strength kv JIS C 211 16 Specific Heat J/g K 1.4.94 Calculated Value Thermal Conductivity W/m K ISO 227-2 1.5 2.3 ASTM E153 1.7 3. 2 Thermal Resistance C/W 1..42 Shin-Etsu Method2 Flame-RetardanceUL94 V- V- 3 Low-molecular-weight siloxane content ppm 2D3-1 2D3-1 Shin-Etsu Method3 HardnessAsker C Measured using 2 overlapping thermal interface silicone ultra soft padsthickness: 6mm. Model heater method: (P.28)Acetone extraction method..5±.1, Thickness mm.5±.1, 1.±.15, 1.5±.2, 2.±.25, 2.5±.25, 3.±.25, 4.±.25, 5.±.3 1.±.15, 1.5±.15, 2.±.15, 2.5±.2, 3.±.25 Grade TC-xxxSP-1.7 TC-xxxSPA-3..5mm.57.26 1.mm 1..41 1.5mm 1.28.5 2.mm 1.55.65 C/W Thermal Resistance depending on thickness 2.5mm 1.82.77 3.mm 2.1.85 4.mm 2.61 5.mm 2.72 Structure Single layer type SPA-3.CAS / CAB / CAD / CAT-2 Series Composite type SP-1.7 Series Thermal interface silicone ultra soft pad (Double-sided adhesive) Carrier liner film (Polyethylene) Carrier liner film (PET) Please release the Carrier liner film when using. Adhesive side: Thermal interface silicone ultra soft pad Carrier liner film (PET) Non adhesive side: Thermal interface silicone sheet rainforced with glass fiber 16

TC-1CAS-3 TC-2CAS-1 TC-1CAB-3 TC-2CAB-1 TC-1CAD-3 TC-2CAD-1 TC-1CAT-2 1 shows thickness. 2 shows thickness. 1 shows thickness. 2 shows thickness. 1 shows thickness. 2 shows thickness. "1" shows 1. mm in thickness. Dark gray Pink Light reddish purple Gray 34 34 34 34 Single layer Single layer Single layer Single layer 1. 1.5 1. 1.5 1. 1.5 1.9 2.2 3. 3.2 3 1 3 1 3 1 22 3 22 3 15 3 15 1 3 11 3 11 3 11 1.24 1.13.84.83 1.8 2.3 3.2 4.5.87 1.15.64.88.58.74.32 V- V- V- V- V- V- V- 24D3-1 22D3-1 18D3-1 26D3-1 General properties are shown only for the selected representative products. Not specified values.5±.1, 1.±.15 1.5±.15, 2.±.2, 2.5±.2, 3.±.25, 4.±.3, 5.±.3, 6.±.5, 7.±.5, 8.±.5, 9.±.5, 1.±.7.5±.1, 1.±.15 1.5±.15, 2.±.2, 2.5±.2, 3.±.25, 4.±.3, 5.±.3.5±.1, 1.±.15 1.5±.15, 2.±.2, 2.5±.2, 3.±.25, 4.±.3, 5.±.3.5±.1, 1.±.15, 1.5±.15, 2.±.2, 2.5±.2, 3.±.25, 4.±.3, 5.±.3 Not specified values TC-xxxCAS-3 TC-xxxCAS-1 TC-xxxCAB-3 TC-xxxCAB-1 TC-xxxCAD-3 TC-xxxCAD-1 TC-xxxCAT-2.51.43.34.22.87.64.58.32.93.73.61.46 1.15.88.74.58 1.38 1.3.89.73 1.55 1.2 1.5.85 1.83 1.47 1.24 1.9 2.7 1.72 1.39 1.23 Not specified values 17

Data TC-SP-1.7 Series Compressive Load and Compressibility Compressibility% 4 3 2 1.5 1. 1.5 2. 2.5 3. Compressive loadmpa ConditionsCompression rate.5 mm/min. Test Dimensions1 x 1 mm 5SP-1.7 1SP-1.7 2SP-1.7 3SP-1.7 4SP-1.7 5SP-1.7 Compressive Load and Thermal Resistance Thermal Resistance C/W 5. 4. 3. 2. 1. 5SP-1.7 4SP-1.7 3SP-1.7 2SP-1.7 1SP-1.7 5SP-1.7 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Hardness Change 12 Thermal Resistance Change (15 C) 2.5 HardnessAsker C 1 8 6 4 2 25 5 75 1 Thermal Resistance C/W 2. 3SP-1.7 2SP-1.7 1.5 1SP-1.7 1. 5SP-1.7.5 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (85 C/85%RH) 2.5 Thermal Resistance C/W 3SP-1.7 2. 2SP-1.7 1.5 1SP-1.7 1. 5SP-1.7.5 25 5 75 1 Aging timeh Thickness:1mmPressure rising rate:1kv/s Volume Resistivity Change Volume Resistivity cm 1..E+15 1..E+14 1..E+13 1..E+12 1..E+11 25 5 75 1 Aging timeh Number of cycletimes Thermal Resistance Change (-4 C to 125 C) 2.5 Thermal Resistance C/W 3SP-1.7 2. 2SP-1.7 1.5 1SP-1.7 1. 5SP-1.7.5 25 5 75 1 Number of cycletimes Thickness:1mmCharging voltage:5v 18

Thermal Interface Silicone Ultra Soft Pads TC-SPA-3. Series Compressive Load and Compressibility 7 Compressibility% 6 5 4 3 2 1 5SPA-3. 1SPA-3. 15SPA-3. 2SPA-3. 25SPA-3. 3SPA-3..2.4.6.8 1. Compressive loadmpa Conditions: Compression rate:.5mm/min. Test Dimensions12.7mm Compressive Load and Thermal Resistance 3. Thermal Resistance C/W 2.5 2. 1.5 1..5 3SPA-3. 2SPA-3. 1SPA-3. 5SPA-3. 5 1 15 2 25 3 35 Compressed loadkpa Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2 Hardness Change 16 Thermal Resistance Change (15 C) 1.2 HardnessAsker C 12 8 4 25 5 75 1 Thermal Resistance C/W 1..8.6 3SPA-3. 2SPA-3. 1SPA-3..4 5SPA-3..2 25 5 75 1 Aging timeh Number of cycletimes Aging timeh Measured using 2 overlapping padsthickness:6mm Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2 Thermal Resistance Change (85 C/85%RH) Thermal Resistance C/W 1.2 1..8.6.4.2 25 5 75 1 Aging timeh 3SPA-3. 2SPA-3. 1SPA-3. 5SPA-3. Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2 Thermal Resistance Change (-4 C to 125 C) Thermal Resistance C/W 1.2 1..8.6.4.2 25 5 75 1 Number of cycletimes 3SPA-3. 2SPA-3. 1SPA-3. 5SPA-3. Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2 TC-CAS-1 Series Compression Property 7 Hardness Change 6 Compressibility% 6 5 4 3 2 1 2CAS-1 3CAS-1 HardnessAsker C 5 4 3 2 1.5 1. 1.5 2. 2.5 Stress Rate of compression:.5mm/min. Test Dimensions12.7mm 25 5 75 1 Aging timeh Number of cycletimes Measured using 2 overlapping padsthickness:6mm 19

Thermal Interface Silicone Ultra Soft Pads TC-CAB-1 Series Compression Property 7 Hardness Change 6 Compressibility% 6 5 4 3 2 1 2CAB-1 3CAB-1 HardnessAsker C 5 4 3 2 1.5 1. 1.5 2. 2.5 Stress Rate of compression:.5mm/min. Test Dimensions12.7mm 25 5 75 1 Aging timeh Number of cycletimes Measured using 2 overlapping padsthickness:6mm TC-CAD-1 Series Compression Property 7 Hardness Change 6 Compressibility% 6 5 4 3 2 1 2CAD-1 3CAD-1 HardnessAsker C 5 4 3 2 1.5 1. 1.5 2. 2.5 Stress Rate of compression:.5mm/min. Test Dimensions12.7mm 25 5 75 1 Aging timeh Number of cycletimes Measured using 2 overlapping padsthickness:6mm TC-CAT-2 Series Compression Property 7 Hardness Change 6 Compressibility% 6 5 4 3 2 1 5CAT-2 1CAT-2 2CAT-2 3CAT-2 HardnessAsker C 5 4 3 2 1.5 1. 1.5 2. 2.5 Stress Rate of compression:.5mm/min. Test Dimensions12.7mm 25 5 75 1 Aging timeh Number of cycletimes Measured using 2 overlapping padsthickness:6mm Thermal Resistance Change Thermal Resistance C/W 1.2 1..8.6.4.2 25 5 75 1 Aging timeh Number of cycletimes Breakdown Voltage Change Breakdown VoltagekV 3 25 2 15 1 5 25 5 75 1 Aging timeh Number of cycletimes 2 Model Heater:TO-3P Applied Power:28W Contact area:7cm 2 Compressed load:29.4kpa=3g/cm 2

Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheets Thermal interface sheets which also shield high frequency noise. General Properties Parameter Structure 1GHz Magnetic permeability Real part: µ Concentric pipe Composite Imaginary part: µ S-parameter Method 1.4 Temperature Range C -4 to +15 ISO 227-2 2.5 Thermal Conductivity W/m K ASTM E153 3.5 Thermal Resistance C/W.3mm.5mm 1.mm Test Method The Shin-Etsu Method Grade EMI-TC83 4.1.47 2.mm.93 Hardness Asker C 8 Density at 23 C g/cm 3 JIS K 6249 4.6 Flame-RetardanceUL94 V-1V-1 equivalent Thickness mm 1., 2. Examples of application Electromagnetic noise suppression and heat conduction for LSI Heatsink Connector Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheet Electromagnetic noise suppression and heat conduction for flat cable Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheet Flat cable Structure Composite sheet : EMI-TC83 EMI-TC83 Not specified values Thermal interface silicone rubber layer Carrier liner filmpolyethylene Carrier liner film Suppression of electromagnetic interference between devices within chassis Electromagnetic Noise Suppression and Thermal Interface Silicone Rubber Sheet Electromagnetic noise suppression and thermal interface silicone putty layer Please remove the carrier liner when using. Chassis Printed circuit boardpcb Magnetic permeability frequency response 7 Real part 3 Imaginary part 6 5 2 4 3 2 1 1.1 1 1 1 Frequency.1 1 1 1 Frequency If considering export these products discrided in this page from Japan, first talk to a Shin-Etsu sales representative. 21

Double Sided Thermal Interface Silicone Tapes Thermal interface tape: Single layer, double-sided adhesive. Structure New lineup will include 1 µm and 2 µm thicknesses. Strong and stable adhesive strength without screws. Thermal resistance is stable across a wide temperature range. Can be applied to wide areas using automated equipment. Examples of application Double Sided Thermal Interface Silicone Tape Double sided thermal interface silicone Tape Carrier liner film Heat dissipation of LED substrate Substrate Double Sided Thermal Interface Silicone Tape Steel case Transistor Substrate Sheet Heatsink The way to attach and the way to peel off the film. 1 The way to peel off the transparent film. 2 The way to attach. 1 Bend the orange film side, to release the edge of the transparent film. 2 Pick up the edge of the transparent film and peel off it. 1 2 3 Attach the edge of a TC-SAS on the object. Bend a TC-SAS not to attach on whale surface. Gradually attach a TC-SAS from end to end. After attach TC-SAS to whale surface of the object, equally press whale surface of TC-SAS by a roll. Defat surface of object by solvents. 3 The easy way to peel off the orange film. 1Attach the tape on the edge of the orange film. 2 Pull the tape. 3The edge area of the orange film is removed. 4Pull the orange film. General Properties Parameter Test Method Grade TC-1SAS TC-2SAS Color White White Matrix Silicone Silicone Thickness µm 1 2 Dielectric Breakdown Voltage kv JIS K 6249 3.2 6.5 Thermal Conductivity W/m K ASTM E14611 1. 1. Alminum 2Shin-Etsu Method 2 6. 6.4 Peeling Strength N/cm 2Shin-Etsu Method 2 7. 7.6 Glass epoxy 2Shin-Etsu Method 2 7.6 8.1 Flammability UL94 V- V- Low-molecular-weight siloxane content ppm 3Shin-Etsu Method 3 1>D3-1 1>D3-1 Sheet size mm 34or 3mm5m 34or 3mm5m Laser flash method: (P.29) Not specified values After sticking a tape on a test plate, then pressed down using a 2 kg roller. After 1 minutes, the tape was then peeled off in the 18-degree direction and measurements taken. (Temp.: 23 C, peeling speed: 3 mm/min) Acetone extraction method. SAS series products can be manufactured to custom shapes and forms upon special request. Contact your local sales representative for details. 22

Pressure/time dependency of adhesive strength Sample Size Pressure Time Shear Strength 1sec 27 2kg 1min 45 TC-2SAS 1cm 2 1sec 46 4kg 1min 65 Tape size Sandwich the TC-2SAS sample with two SUS plates, and pressurize with various pressure and time. Afterwards, measure the shear strength. SUS/aluminum plate Shear tool Temperature dependency of adhesive strength Shear StrengthN/cm 2 6 5 4 3 2 1 TC-2SAS Acrylic tapecompetitor 25 5 75 1 Temperature C Tape size Sandwich a tape with two aluminum plates, and pressurize using a 2kg roller. After 6 minutes, measure the shear strength under several temperature conditions. Tape Shear Strength after aging Shear StrengthN/cm 2 3 25 2 15 1 5 2 4 6 8 1 12 14 16 Aging timeh Number of cycletimes 1. Sandwich the TC-2SAS sample (1 x 1 mm size) with aluminum plates. 2. Press the sample with 2 psi clips. Spacers are inserted to ensure uniform pressure (Press condition: 25 C/1h). 3. Remove the spacer and clip, then measure initial shear strength. 4. Put w/o pressure sample into the aging chamber. 5. After aging, measure the shear strength. Thermal Resistance after aging Thermal Resistancecm 2 K/W 8 7 Acrylic tapecompetitor 6 5 4 3 2 TC-2SAS 1 5 1 15 Aging timeh Thermal Resistancecm 2 K/W 8 7 6 Acrylic tapecompetitor 5 4 3 TC-2SAS 2 1 5 1 15 Aging timeh Thermal Resistancecm 2 K/W 8 7 6 5 4 3 2 1 Acrylic tapecompetitor TC-2SAS 5 1 15 Number of cycletimes 1. Sandwich the sample (TC-2SAS) with two pieces of aluminum plates. 2. Press the sample with 2 psi clips. Spacers are inserted to ensure uniform pressure (Press condition: 25 C/1h). 3. Measure the thermal resistance with laser flash method ( h). 4. Press the sample with clip again. Put sample into the aging chamber. 5. After aging, measure the thermal resistance with Laser Flash method. 23

Thermal Interface Phase Change Materials Phase change materials are high-performance thermal interface sheets that soften with heat. Heat softens the sheet for a better conforming fit, which reduces thermal resistance. The result is superior dissipation of heat. Non-silicone phase-change products can t compete in terms of long-term reliability under high temperature. Superior heat-dissipating effect Sheets compress easily to a fraction of their initial thickness, so they act to level multiple chips of different heights. (Developed for next-generation CPUs) The layer thins under compression, resulting in lower thermal resistance. Examples of application Heat dissipation of surface mount semiconductor chip Heatsink Before Phase-change After Phase-change Surface mount semiconductor chip Substrate Thermal interface Phase Change Material Heatsink Phase Change Material Heat Source Improving close contact reduces thermal resistance. Sheets transfer easily, making them easy to stick on. Transfer Method Position a PCS-LT sheet (with tab attached) on top of the heat sink. Apply pressure over the entire surface using the fingers or a roller (pressure: 2-3 psi). Use a spatula or similar tool to smooth down the upper left part of the PCS-LT sheet (pressure: 5-1 psi). 1 2 3 4 Pull the tab firmly to remove. 1 psi = 6.895 kpa Resists pump-out. Shin-Etsu PCM (after 25 cycles) Olefin type Initial size Oven-heated to 7 C for 1 h + 25 cycles Oven-heated to 7 C for one hour only. General Properties Parameter Test Method Grade PCS-LT-3 PCS-CR-1 Color Gray White Initial Thickness µm 12 2 1 Thickness after heat / compression 1 µm Micro gauge 28 1 Density at 25 C JIS K 6249 2.4 2.9 Dielectric Breakdown Voltage kv/mm 8. Softening Point C Shin-Etsu Method 48 48 Thermal Conductivity W/m K ASTM E14612 3. 2. 1 Thermal Resistance cm 2 K/W ASTM E14612.11.8 Sheet size mm 34 34 After 1 hour compression, 2 psi/1 C. Not specified values Laser flash method: (P.29) 24

Data Pressure-Dependence of Thickness (7 C/1h) 5 Bond Line Thicknessµm 4 3 2 2 4 6 8 1 12 Test Method Thickness / Thermal Resistance after aging Observations Pressurepsi PCS-LT-3 Thicknessµm 8 7 6 5 4 PCS-LT-3 3 2 1 5 1 15 Aging timeh Thicknessµm 8 7 6 5 4 PCS-LT-3 3 2 1 5 1 15 Aging timeh Thicknessµm 8 7 6 5 4 PCS-LT-3 3 2 1 2 4 6 8 1 Number of cycletimes Pressure-Dependence of Thermal Resistance (7 C/1h) Thermal Resistancemm 2 K/W 19 18 17 16 15 2 4 6 8 1 12 Pressurepsi PCS-LT-3 1. The sheet is transferred to an aluminum plate used for the laser flash test. 2. Another aluminum plate is placed on the top, sandwiching the sample. Spacers are inserted to ensure uniform pressure. 3. Pressure is applied with clips. 4. This unit is heated in a 7 C oven for 1 hour. 5. The unit is taken from the oven, and a microgauge used to measure the thickness of the sample after compression. Its thermal resistance is again measured using the laser flash method. Thermal Resistancemm 2 K/W Thermal Resistancemm 2 K/W Thermal Resistancemm 2 K/W 2 18 16 14 12 1 PCS-LT-3 8 6 4 2 5 1 15 Aging timeh 2 18 16 14 12 1 8 PCS-LT-3 6 4 2 5 1 15 Aging timeh 2 18 16 14 12 1 8 6 PCS-LT-3 4 2 2 4 6 8 1 Number of cycletimes 1. PCS-LT series can work without deterioration in extremely severe condition like 15 C/15hrs because PCS-LT series are silicone-based phase change material. 2. In addition, PCS-LT series are excellent also in anti pumping-out properties. In a heat cycle condition (-4 C125 C/1 cycle), the increasing of thermal resistance is not observed at all. 3. The tendency for thermal resistance to decrease after aging was observed. It is surmised that the contact condition of PCS-LT and aluminum plate improved by aging, as a result, thermal resistance could be decreased. 25

Measuring and Test Methods Thermal Interface Silicone Rubber Dielectric Breakdown Voltage/Dielectric Breakdown Strength A test sample is inserted between two 25 mm diameter electrodes and immersed in insulating oil. An alternating current is applied, and the voltage is steadily increased at a rate of 1 kv/sec. The minimum voltage necessary to cause dielectric breakdown is measured, and this is considered the dielectric breakdown voltage. The dielectric breakdown voltage of a test sample sheet (thickness: 1 +.2 -.1 mm) was measured, and this value divided by the thickness of the sample is considered the dielectric breakdown strength. Measured in accordance with JIS K 6249 Dielectric breakdown strength (kv/mm) Dielectric breakdown voltage as measured (kv) Thickness of test sample (mm) Dielectric Strength A test sample is inserted between two 25 mm diameter electrodes and immersed in insulating oil. A constant voltage is applied for 2 seconds to test dielectric breakdown of the test sample. Voltage is increased in stages, and the maximum voltage before dielectric breakdown is measured. This value is considered the dielectric strength. Measured in accordance with JIS C 211. Upper electrode 25 mm Test piece Insulating oil Lower electrode Flame-Retardancy The test piece (width: 13 mm; length: 125 mm) is positioned vertically, and the lower edge is exposed to a 2 mm flame for 1 seconds. The piece is then removed from the flame and afterflame time (t 1 ) is measured. After burning stops, the flame is applied again, and afterflame time (t 2 ) plus afterglow time (t 3 ) is measured again in the same manner. A set of five specimens is to be tested. Criteria Conditions Classification UL94 V- UL94 V-1 1 sec 3 sec Total flame time t 1 + t 2 for the 5 specimens 5 sec 25 sec 3 sec 6 sec Afterflame time after first flame application Afterflame time after second flame application Afterglow time after second flame application 26

Fig. 1: Sample setup Thermal Conductivity Based on ISO 227-2 A constant current is supplied to a sensor sandwiched between two sheets which measure 6 mm 6 mm 6 mm (as shown in Fig. 1). The sensor is heated to a constant temperature, and the thermal conductivity calculated from the temperature increase of the sensor. The sensor consists of nickel foil in a double spiral pattern, and the temperature change can be measured as the change in electrical resistance of the sensor. Fig. 2 shows the signal obtained from the sensor when constant current is applied. If we scale the horizontal axis (function of time and thermal diffusivity of the sample) of the temperature increase graph (Fig. 2) with D, we see the result in Fig. 3. From equation (1), we know that the slope of this straight line is inversely proportional to the thermal conductivity of the sample. The sensor temperature increase Tave is represented theoretically by the following model. Power applied to the sensor Radius of the sensor Thermal conductivity of the sample Non-dimensional parameter defined by Thermal diffusivity of the sample Measurement time Function of non-dimensional Fig. 2: Time change of applied current and sensor signal Current applied to sensor Time Sensor temperature increase Fig. 3: Correlation between temperature increase curve and D Time Based on ASTM E153 A sample of TC silicone (thickness: 9 mm; diameter: 5 mm) is pres s-fit as shown in the diagram. When the temperature reaches equilibrium, the difference in temperature between the two sides of the silicone and heat flux are measured. Fourier's Law states that Thermal resistance Temperature of the surface of the upper plate Temperature of the surface of the lower plate Heat flux passing through the test piece Therefore Thickness of the test piece Thermal conductivity Total thermal resistance between the test piece and the surface of the plate Measuring equipment and test piece Guarded heater Upper heater Upper platetu Test piece Lower platetm Calorimeter Lower heater Heatsink Compressive Load Guarded heater Spacer Test piece 9mm 5mm 27

Thermal Interface Silicone Rubber Thermal Resistance Transistor method:high-hardness Thermal Interface Silicone Rubber A TC test piece (Model TO-3P) is inserted between a heatsink and transistor. The transistor is secured to the heatsink with a 3. mm diameter screw. Power is applied to the transistor for 1 minutes, then the temperatures of the transistor and heatsink are measured. Thermal resistance is calculated according to the following equation. Thermocouple Thermocouple Transistor temperature Heatsink temperature Screw Torque 51kgfcm Applied power 1W Contact area about 2.8 cm2 T1 Transistor Test piece T2 Heatsink Model heater method:thermal Interface Silicone Soft Pads/Ultra Soft Pads A model heater (aluminum case with built-in heater) is used. The test piece is inserted between a heatsink and the model heater, and a designated compressive load is applied. Power is applied for 5 minutes, then the temperatures of the heater and heatsink are measured. Thermal resistance is calculated according to the following equation. Compressive load 3gf/cm 2 Model heater temperature Heatsink temperature Compressive load 3gf/cm2 Applied power 28 Contact area about 7cm2 Test piece Side T1 T2 Model heater Pore of a thermocouple Heatsink Test piece Model heater Heater Length T1 Heatsink Pore of a thermocouple 28

Measuring and Test Methods Double Sided Thermal Interface Silicone Tapes Thermal Interface Phase Change Materials Laser flash method (Based on ASTM E1461) Thermal resistance and thermal conductivity were measured by the laser flash method, which is one method of analyzing thermal constants : a pulse laser is used to illuminate and heat one face of the sample. The temperature rise is measured at the opposite face using an infrared sensor, with no contact involved. IR sensor Signal amplifier Software Furnace Furnace power supply Computer + Data acquisition Sample Laser powersupply Plotter printer Laser Experimental result 29

Low-molecular-weightLMWSiloxane What is LMW siloxane? The figure shows the chemical formula of low-molecular-weight siloxane, a nonreactive cyclic dimethyl polysiloxane (generally D3-D1), which is volatile and therefore sublimates into the atmosphere both during and after curing. As shown below, LMW siloxane has been reported to cause electrical contact failure under certain conditions. Electrical contact failure It has already been noted that various substances may lead to contact failure. Contact failure may be caused by organic materials such as human body oils and organic gases, or inorganic materials such as hydrogen sulfide and ammonia gas. Electric and electronic manufacturers report that LMW siloxane can cause contact failure in the low-voltage, low-current range. Relationship of load conditions to contact reliability Effects of load on contact reliabilitymicro-relay Load Presence of Si accretion Contact resistance at point of contacty/n 1 DC1V 1mA N No increase measured 2 DC1V 36mA N Occasional increase of several ohms 3 DC3.5V 1mA N No increase measured Mechanisms of contact failure Cyclic dimethyl polysiloxane vapor Electrical spark energy 4 DC5.6V 1mA Y No increase measured 5 DC12V 1mA Y Increase of several ohms, up to infinity 153 6 DC24V 1mA Y Around 15 times, readings of infinity were seen; at 3 times, all were infinity 345 7 DC24V 35mA Y Around 3 times, readings of infinity were seen; at 45 times, all were infinity 8 DC24V 1mA Y No increase measured 9 DC24V 2mA Y No increase measured 1 DC24V 1A Y No increase measured 11 DC24V 4A Y No increase measured [Test conditions] Switching frequency1 Hz, temp.room temperature, contact force13 g Presented bythe Institute of Electronics, Information and Communication Engineerscorporation, Yoshimura and Itoh EMC76-41 Feb. 18, 1977. Formation of insulators Contact failure Functions as an abrasive Abrasion The prime ingredients of RTV silicone rubber, but the dimethyl polysiloxane derived in the normal manufacturing process does contain ring structures in trace amounts. Because this cyclic dimethyl polysiloxane is nonreactive and volatile, there is sometimes after curing. As shown in the figure above, this sublimated cyclic dimethyl polysiloxane can be a mechanism of contact failure under certain conditions. 3

General Features of Silicone Rubber Silicone rubbers are built on a backbone of siloxane bonds (-Si-O-Si-), which exhibit high bonding energy and are highly stable. As a result, silicones have heat resistance, electric non-conductance and chemical stability superior to that of common organic rubbers. Electric Insulation Silicone rubbers are electrically non-conductive and exhibit stable properties over a wide range of temperatures and frequencies. They are highly resistant to corona and arc discharge under high-voltage stress, making them particularly suited for use as an insulating material in high-voltage applications. Flame-Retardancy Silicone rubber exhibits excellent flame resistance. Almost all of Shin-Etsu's thermal interface silicone products have received UL V-/V-1 certification or meet equivalent specifications. The diagram shows a properties comparison between silicone and other rubbers. Heat resistance Chemical stability Resistance to weathering Resistance to chemicals Flame retardancy Electrical properties Resistance to cold Silicone rubber Ethylene-propylene rubber Chloroprene rubber Fluorine rubber Natural rubber Acrylic rubber Handling Precautions Quality, Storage and Handling 1. Products should be stored in a dry place out of direct sunlight. 2. Avoid contact with residual solvents or oils as they may deteriorate the properties of the product. 3. For better results, the substrate surface should be cleaned and dried to remove any dirt, moisture or oils before application. 4. Prior to using the product with a thermal interface grease, test a sample with a small amount to determine compatibility. 31

Shin-Etsu Chemical Co.,Ltd. Silicone Division Sales and Marketing Department III 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo, Japan Phone : +81-()3-3246-511 Fax : +81-()3-3246-5364 Shin-Etsu Silicones of America, Inc. 115 Damar Drive, Akron, OH 4435, U.S.A. Phone : +1-33-63-986 Fax : +1-33-63-9855 Shin-Etsu do Brasil Representação de Produtos Químicos Ltda. Rua Coronel Oscar Porto, 736 11º Andar - 114/115 Paraíso São Paulo - SP BrasilCEP: 43-3 Phone : +55-11-3939-69 Fax : +55-11-352-394 Shin-Etsu Silicones Europe B.V. Bolderweg 32, 1332 AV, Almere, The Netherlands Phone : +31-()36-549317 Fax : +31-()36-5326459 (Products & Servises: Fluid products) Germany Branch Rheingaustrasse 19-196, 6523 Wiesbaden, Germany Phone : +49-()611-962-5366 Fax : +49-()611-962-9266 (Products & Servises: Elastomer products) Shin-Etsu Silicone Taiwan Co., Ltd. Hung Kuo Bldg. 11F-D, No. 167, Tun Hua N. Rd., Taipei, 1549 Taiwan, R.O.C. Phone : +886-()2-2715-55 Fax : +886-()2-2715-66 Shin-Etsu Silicone Korea Co., Ltd. GT Tower 15F, 411, Seocho-daero, Seocho-gu, Seoul 6615, Korea Phone : +82-()2-59-25 Fax : +82-()2-59-251 Shin-Etsu Singapore Pte. Ltd. 4 Shenton Way, #1-3/6, SGX Centre II, Singapore 6887 Phone : +65-6743-7277 Fax : +65-6743-7477 Shin-Etsu Silicones India Pvt. Ltd. Flat No.712, 7th Floor, 24 Ashoka Estate, Barakhamba Road, New Delhi 111, India Phone : +91-11-4362381 Fax : +91-11-4362384 Shin-Etsu Silicones (Thailand) Ltd. 7th Floor, Harindhorn Tower, 54 North Sathorn Road, Bangkok 15, Thailand Phone : +66-()2-632-2941 Fax : +66-()2-632-2945 Shin-Etsu Silicone International Trading (Shanghai) Co., Ltd. 29F Junyao International Plaza, No.789, Zhao Jia Bang Road, Shanghai 232, China Phone : +86-()21-6443-555 Fax : +86-()21-6443-5868 Guangzhou Branch B-249, 241, Shine Plaza, 9 Linhexi Road, Tianhe, Guangzhou, Guangdong 5161, China Phone : +86-()2-3831-212 Fax : +86-()2-3831-27 The data and information presented in this catalog may not be relied upon to represent standard values. Shin-Etsu reserves the right to change such data and information, in whole or in part, in this catalog, including product performance standards and specifications without notice. Users are solely responsible for making preliminary tests to determine the suitability of products for their intended use. Statements concerning possible or suggested uses made herein may not be relied upon, or be construed, as a guaranty of no patent infringement. The silicone products described herein have been designed, manufactured and developed solely for general industrial use only; such silicone products are not designed for, intended for use as, or suitable for, medical, surgical or other particular purposes. Users have the sole responsibility and obligation to determine the suitability of the silicone products described herein for any application, to make preliminary tests, and to confirm the safety of such products for their use. Users must never use the silicone products described herein for the purpose of implantation into the human body and/or injection into humans. Users are solely responsible for exporting or importing the silicone products described herein, and complying with all applicable laws, regulations, and rules relating to the use of such products. Shin-Etsu recommends checking each pertinent country's laws, regulations, and rules in advance, when exporting or importing, and before using the products. Please contact Shin-Etsu before reproducing any part of this catalog. Copyright belongs to Shin-Etsu Chemical Co., Ltd. JCQA-4 JCQA-E-2 JCQA-18 JCQA-E-64 JQA-479 JQA-EM298 The Development and Manufacture of Shin-Etsu Silicones are based on the following registered international quality and environmental management standards. Gunma Complex ISO 91 ISO 141 (JCQA-4 JCQA-E-2) Naoetsu Plant ISO 91 ISO 141 (JCQA-18 JCQA-E-64) Takefu Plant ISO 91 ISO 141 (JQA-479 JQA-EM298) Shin-Etsu Silicone is a registered trademark of Shin-Etsu Chemical Co., Ltd. This is an edited version of the product data released on Dec. 217. http://www.silicone.jp/ C Shin-Etsu 211.1/217.12 11 1.5.M.G. Printed in Japan.