MAX4836 DS.J

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1 ; Rev ; 7/4 FLAG RESET FLAG RESET µ µ C C TOP VIEW IN GND OUT 5 SS µ µ PART TEMP RANGE PIN-PACKAGE MAX4836EUTxy_-T* -4 C to +85 C 6 SOT23-6 MAX4836ETTxy_-T -4 C to +85 C 6 TDFN-6 MAX4837EUTxy_dd-T* -4 C to +85 C 6 SOT23-6 MAX4837ETTxy_dd-T -4 C to +85 C 6 TDFN-6 * SHDN 3 EXPOSED PADDLE TDFN ( ) MAX4836ETTxyC ONLY. 4 RESET (FLAG) Pin Configurations continued at end of data sheet. Maxim Integrated Products 1

2 ABSOLUTE MAXIMUM RATINGS IN, SHDN, FLAG, OUT to GND...-.3V to +6V RESET to GND...-.3V to ( +.3V) SS to GND...-.3V to ( +.3V) IN to OUT...±6V OUT Short Circuit to GND...Continuous All Pins ESD Handling (Human Body Model)...2kV Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Continuous Power Dissipation (T A = +7 C) 6-Pin SOT23 (derate 9.1mW/ C above +7 C)...727mW 6-Pin TDFN (derate 24.4mW/ C above +7 C) mW Operating Temperature Range...-4 C to +85 C Operating Junction Temperature Range...-4 C to +125 C Storage Temperature Range C to +15 C Lead Temperature (soldering, 1s)...+3 C ( = + 1V, SHDN = IN, C OUT = 3.3µF, T A = -4 C to +85 C, unless otherwise noted. Typical values are at T A = +25 C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Voltage V Input Undervoltage Lockout Threshold V UVLO rising V Input Undervoltage Lockout Threshold Hysteresis 5 mv SHDN = IN, I OUT = 9 15 Quiescent Current I Q SHDN = IN, I OUT =, V UVLO < < (nominal) 15 µa SHDN = GND, I OUT =.1 2 Dropout Voltage (Note 2) I OUT = 5mA T A = +25 C 2 3 T A = -4 C to +85 C 33 mv Output Voltage Accuracy I OUT = 1mA to 5mA, T A = +25 C I OUT = 1mA to 5mA, T A = -4 C to +85 C Output Current I OUT 5 ma Output Current Limit = V ma Reverse Current at = 5.5V, = V to.1 2 µa C SS = not connected Soft-Start Time (Note 3) t SS C SS =.1µF C SS =.1µF %V NOM ms Line Regulation (Note 4) +.5V < < T A = +25 C V, I LOAD = 1µA T A = -4 C to +85 C %V NOM / V Load Regulation 1µA < I LOAD < 5mA, = + 1V 1.3 %V NOM Output Noise 1Hz to 1kHz, C SS =.1µF 7 µv RMS SHUTDOWN INPUT (SHDN) OUT Discharge Resistance in Shutdown (MAX4837) SHDN = GND 9 Ω SHDN Input-Voltage High V IH 1.4 V SHDN Input-Voltage Low V IL.5 V SHDN Input Hysteresis 3 mv SHDN Input Leakage Current SHDN = IN or GND na 2

3 ELECTRICAL CHARACTERISTICS (continued) ( = + 1V, SHDN = IN, C OUT = 3.3µF, T A = -4 C to +85 C, unless otherwise noted. Typical values are at T A = +25 C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RESET OUTPUT (MAX4837) RESET Threshold V RESET.85 x OUT Drop to RESET Delay (Note 5) RESET Timeout Period RESET Output-Voltage Low RESET Output-Voltage High FLAG OUTPUT (MAX4836).875 x.9 x t OR 35 µs t RESET D1 timing option D2 timing option D3 timing option D4 timing option V, I SINK = 5µA, RESET asserted.3 1.5V, I SINK = 3.2mA, RESET asserted 2.V, I SOURCE 5µA, RESET deasserted Blanking Time (Note 6) t BLANK + 1V 5.5V, OUT = GND ms Open-Drain FLAG Output- Voltage Low.8 x I SINK = 3.2mA, FLAG asserted, 1.5V.4 V.4 V ms V V Open-Drain FLAG Leakage Current V FLAG = 5.5V.1 1 µa THERMAL PROTECTION Thermal-Shutdown Temperature Junction temperature rising +165 C Thermal-Shutdown Hysteresis 15 C Note 1: Parts are 1% tested at +25 C. Limits across the full temperature range are guaranteed by design and correlation over the specified temperature range. Note 2: The dropout voltage is measured from to when is 2% below its nominal value. The nominal output voltage is measured from to GND when is 1V greater than. Defined only for 2.5V. Note 3: Soft-start time is defined as the time required for the output to rise from 1% of its nominal value to 9% of its nominal value. Note 4: For < 2V, must be above 2.5V. Note 5: This is the maximum time OUT can be out of tolerance before a reset is issued. It is implemented to ensure that momentary output glitches do not trigger a reset condition. Note 6: In startup mode, the blanking time counter is not started until the soft-start time has elapsed. The total time from startup to FLAG issued is t SS + t BLANK. 3

4 ( = + 1V, SHDN = IN, C OUT = 3.3µF, T A = +25 C, unless otherwise noted.) IQ (µa) QUIESCENT CURRENT vs. INPUT VOLTAGE (NO LOAD) T A = +85 C T A = +25 C T A = -4 C = 1.5V (V) MAX4836 toc1 IQ (µa) QUIESCENT CURRENT vs. INPUT VOLTAGE (5mA LOAD) T A = +85 C T A = -4 C T A = +25 C 1 = 3.3V (V) MAX4836 toc2 PULSE DURATION (µs) MAXIMUM TRANSIENT DURATION vs. RESET THRESHOLD OVERDRIVE RESET ASSERTS ABOVE THIS LINE 15 = 3.5V = 2.5V RESET THRESHOLD OVERDRIVE (mv) MAX4836 toc3 DROPOUT VOLTAGE (mv) DROPOUT VOLTAGE vs. LOAD CURRENT = 3.3V MAX4836 toc4 PSRR (db) POWER-SUPPLY REJECTION RATIO vs. FREQUENCY = 2V C OUT = 3.3µF I LOAD = 2mA MAX4836 toc5 COUT ESR (Ω) REGION OF STABLE C OUT ESR vs. LOAD CURRENT STABLE REGION C OUT = 3.3µF = 1.8V MAX4836 toc LOAD CURRENT (ma) FREQUENCY (khz) LOAD CURRENT (ma) OUTPUT NOISE (µvrms) OUTPUT NOISE vs. FREQUENCY = 3V = 1.8V C SS = 1nF I LOAD = MAX4836 toc7 SOFT-START RESPONSE (C SS = FLOATING) MAX4836 toc8 t SS k 1k 1k FREQUENCY (Hz) 2ms/div 4

5 ( = + 1V, SHDN = IN, C OUT = 3.3µF, T A = +25 C, unless otherwise noted.) SOFT-START RESPONSE (C SS =.1µF) MAX4836 toc9 2ms/div t SS SOFT-START RESPONSE (C SS =.1µF) MAX4836 toc1 t SS 2ms/div LOAD-TRANSIENT RESPONSE MAX4836 toc11 = 4.3V = 3.3V C IN =.1µF C OUT = 3.3µF I LOAD : STEP FROM 1mA TO 1mA BACK TO 1mA 1µs/div 5mV/div AC-COUPLED LOAD-TRANSIENT RESPONSE NEAR DROPOUT MAX4836 toc12 = 3.4V = 3.3V C IN =.1µF C OUT = 3.3µF I LOAD : STEP FROM 1mA TO 1mA BACK TO 1mA 1µs/div 5mV/div AC-COUPLED LINE-TRANSIENT RESPONSE MAX4836 toc13 C IN =.1µF C OUT = 3.3µF = 3.3V I LOAD = 1mA 1µs/div 5V 5mV/div 4.5V 5mV/div AC-COUPLED RESET RESPONSE TO MAX4836 toc14 C SS = FLOATING 4ms/div t RESET V RESET RESET RESPONSE TO MAX4836 toc15 = 3.5V, C SS = FLOATING RESET RESPONSE TO SHUTDOWN MAX4836 toc16 = 3.5V, C SS = FLOATING V SHDN t RESET V RESET t RESET V RESET 4ms/div 4ms/div 5

6 ( = + 1V, SHDN = IN, C OUT = 3.3µF, T A = +25 C, unless otherwise noted.) FLAG RESPONSE WHEN OUT IS SHORTED TO GND < BLANKING TIME MAX4836 toc17 1ms/div I OUT 2mA/div V FLAG 5V/div FLAG RESPONSE WHEN OUT IS SHORTED TO GND > BLANKING TIME (IN IS TOGGLED) MAX4836 toc18 t BLANK FLAG CONNECTED TO LOGIC SUPPLY 1ms/div V FLAG FLAG RESPONSE WHEN OUT IS SHORTED TO GND > BLANKING TIME (SHDN IS TOGGLED) MAX4836 toc19 t BLANK FLAG CONNECTED TO LOGIC SUPPLY 1ms/div V FLAG V SHDN STARTUP IN AN OVERLOAD CONDITION (C SS NOT CONNECTED) MAX4836 toc2 t SS t BLANK 2ms/div = 2.5V I LOAD = I LIMIT MAXIMUM FLAG CONNECTED TO LOGIC SUPPLY V FLAG STARTUP IN AN OVERLOAD CONDITION (C SS =.1µF) MAX4836 toc21 t SS t BLANK 4ms/div = 2.5V I LOAD = I LIMIT MAXIMUM FLAG CONNECTED TO LOGIC SUPPLY V FLAG NORMALIZED OUTPUT VOLTAGE NORMALIZED OUTPUT VOLTAGE vs. TEMPERATURE NORMALIZED TO +25 C I LOAD = 3mA I LOAD = 5mA I LOAD = 1mA TEMPERATURE ( C) MAX4836 toc22 6

7 SOT23 PIN TDFN NAME FUNCTION 1 1 IN µ Regulator Power Input. Bypass IN to GND with a.1µf ceramic capacitor. Install the bypass capacitor as close to the device as possible. 2 2 GND Ground 3 3 SHDN 4 4 FLAG (MAX4836) RESET (MAX4837) SHDN Active-Low Shutdown Input. Drive low to shutdown the regulator. Drive high or SHDN connect to IN for normal operation. Overcurrent Flag. Open-drain FLAG goes low when the device senses sustained current FLAG SHDN exceeding the current-limit threshold for a duration longer than the blanking time. is high FLAG when SHDN is low or the device is in thermal shutdown. Active-Low Reset Output. Push-pull RESET goes low when the voltage at OUT is below the reset RESET SHDN threshold or when the voltage at OUT is greater than IN. is low when SHDN is low or the RESET device is in thermal shutdown. After the reset condition terminates, remains low for the RESET duration of the reset timeout period. 5 5 SS 6 6 OUT EP EP Soft-Start Control. Connect a capacitor, C SS, from SS to GND to program the output rise time at startup. No capacitor from SS to GND gives 1ms output rise time at startup. See the soft-start response time plots in the Typical Operating Characteristics. µ Regulator Output. Bypass OUT to GND with a 3.3µF or larger ceramic capacitor. The capacitor s Ω ESR should be less than.2ω for stable operation. Exposed Pad. EP is internally connected to GND. Externally connect EP to GND to provide a low thermal resistance path from the IC junction to the PC board. BLANK RESET RESET FLAG SHDN RESET RESET SHDN > RESET RESET RESET SHDN µ µ SHDN 7

8 IN SHDN RESET (FLAG) OVERLOAD PROTECTION RESET TIMEOUT (BLANKING PERIOD) REVERSE- CURRENT PROTECTION PASS TRANSISTOR V REF V FB THERMAL PROTECTION ERROR AMPLIFIER 1.23V V REF v FB SWITCH OPEN DURING SOFT-START = V REF WHEN SOFT-START IS COMPLETE 9% x V REF MAX4837 ONLY 9Ω SWITCH CLOSED IN SHUTDOWN V REF 1.23µA OUT SS 1nF GND ( ) MAX4836E xyc ONLY. IN OUT IN OUT 2.5V TO 5.5V C IN.1µF V LOGIC C OUT 3.3µF LOAD 2.5V TO 5.5V C IN.1µF C OUT 3.3µF LOAD MAX4836 MAX4837 TO µc FLAG SS TO µc RESET SS C SS C SS OFF ON SHDN GND OFF ON SHDN GND 8

9 Ω µ FLAG + C C C t SS = C SS (ms) SHDN Ω µ µ C C µ µ Ω µ 9

10 PART PIN- PACKAGE OUTPUT CURRENT (ma) RESET OUTPUT CONFIGURATION RESET (FLAG) SHUTDOWN DISCHARGE LATCH OFF MAX4836EUTxyC-T 6 SOT Open-Drain FLAG No Yes MAX4836ETTxyC-T 6 TDFN-6 5 Open-Drain FLAG No Yes MAX4837EUTxyBdd-T 6 SOT Push-Pull RESET Yes No MAX4837ETTxyBdd-T 6 TDFN-6 5 Push-Pull RESET Yes No xy OUTPUT VOLTAGE (V) TOP VIEW IN GND SHDN 1 6 OUT 2 MAX4836/ MAX SS RESET (FLAG) dd RESET TIMEOUT (ms) D D2 3 D3 225 D4 18 SOT23 ( ) MAX4836EUTxyC ONLY. TRANSISTOR COUNT: 1575 PROCESS: BiCMOS TDFN Exposed Pad: Connected to GND 1

11 japan.maxim-ic.com/packages PIN 1 INDEX AREA D E DETAIL A E2 LC N L C 6, 8, &1L, DFN THIN.EPS L L A e e PACKAGE OUTLINE, 6, 8, 1 & 14L, TDFN, EXPOSED PAD, 3x3x.8 mm NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY F 1 2 COMMON DIMENSIONS SYMBOL MIN. MAX. A.7.8 D E A1..5 L.2.4 k.25 MIN. A2.2 REF. PACKAGE VARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b [(N/2)-1] x e T ±.1 2.3±.1.95 BSC MO229 / WEEA.4± REF T ±.1 2.3±.1.65 BSC MO229 / WEEC.3± REF T ±.1 2.3±.1.5 BSC MO229 / WEED-3.25±.5 2. REF T ±.1 2.3±.1.4 BSC ± REF T ±.1 2.3±.1.4 BSC ± REF PACKAGE OUTLINE, 6, 8, 1 & 14L, TDFN, EXPOSED PAD, 3x3x.8 mm F

12 japan.maxim-ic.com/packages 6LSOT.EPS PACKAGE OUTLINE, SOT-23, 6L F Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA Maxim Integrated Products, Inc. All rights reserved. is a registered trademark of Maxim Integrated Products.

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