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1 Journal of the Heat Transfer Society of Japan
2 How to Write a Manuscript of Dennetsu Taro DENNETSU (Dennetsu University) Microsoft Word 1 1 A4 (210mm297mm) 30mm 30mm 20mm 20mm 1 45mm 10 ( mm) mm 10mm 10 ( mm) (Windows) MS (Macintosh) (Windows) MS (Macintosh) Times New Roman Symbol ( =5.271mm) [1][2,4] [6-10] (Therm. Sci. Eng.)- (JICST) [1] B (1999), [2] Incropera, F. P. and Dewitt, D. P., Fundamentals of Heat and Mass Transfer, John Wiley & Sons (1976). [3] Smith, A. et al., Therm. Sci. Eng., 7-5 (1999), [4] (1980). MS-WORD
3 Vol No. 167 March
4 Journal of The Heat Transfer Society of Japan Vol.41, No.167, March, 2002 CONTENTS < Advances of Heat Transfer Research in the Past 10 Years: Part 2 > An Overview on Development of Electronic Equipment Cooling Technologies in this Decade Masaru ISHIZUKA (Toyama Prefectural University) 1 Advances of Heat Transfer Research in the Past 10 Years: Space Terushige FUJII (Kobe University) 10 Measurements in convective heat transfer in the recent decade Masanobu MAEDA (Keio University) 16 Past, Today and Future in Nano-Microscale Thermal Science and Engineering Ken OKAZAKI (Tokyo Institute of Technology) 25 <Report of Branch> Report of Kyushu Branch Henji ISHIDA (Saga University) 30 <Calendar> 32 <Announcements> 34
5 10 An Overview on Development of Electronic Equipment Cooling Technologies in this Decade Masaru ISHIZUKA (Toyama Prefectural University) [1,2] 1970 IBM LSI LSI A4 B5 15mm 1GHzCPU, 512MB [3,4,5] 2 CPU 10 [1,6,7] [5] 2-1- Jour. HTSJ, Vol. 41, No. 167
6 10 3 [8-10][11] [12] Zhang [13] 1 Nu Ra 1/5 [14,15] Ra MG CPU [16-18] Yazawa [19] [20] [21] [22][23] [24,25] [26] 4 [29] 3 [9] PC [27][28]
7 10 [46] Bejan[47] 5 PC [30] [29,30] [31] CFD 6 [32] BUA [32-36] CFD [37-45] [48,49] Behnia [58] Pak [51] [52-56] 5 10 [52] [57] [58] CPU [59,60] Sasao [61] -3- Jour. HTSJ, Vol. 41, No. 167
8 10 [62]LSI [61,62] [65-66] Shinohara [67] [68] [69,70] [71-74]LSI 2 3 [75] [76] [77-79] [80] [81,82] Gima [83] P IC [84,85][86] [87] W 600W 1000kW/m 2 Tuckerman [88] [89][90] Nakayama[91] 7 2cmx2cm CFD 8 FX Mizunuma [92]1mm A 7 [91]
9 10 1 [91] 57350m 0.1Kcm 2 /W 8 [91] [93,94] [95,96] [96] [97,98] [99] Joshi [ ] PF [95] 11 [104] -5- Jour. HTSJ, Vol. 41, No. 167
10 10 [104,105] [105] [ ] [109] [110] [111,112] [1] Nakayama, W., Appl. Mech. Rev., 49-10,Part 2, (1996), S167-S173. [2], (1999). [3],, (2000), [4],, (2000), [5],,, (1991),p4. [6] Nakayama, W.Electronics Cooling, 4-3 (1998), [7] Nakayama, W., Future Circuits, Issue3 (1998), [8] Ishizuka, M., IMechE Journal-Proc. Inst. Mech. Engrs. 212, Part A (1998), [9] Ishizuka, M., Proc. Symposium on Energy Engineering in the 21 st Century (SEE2000), Hong Kong, 1, (2000), [10],,, Thermal Science & Engineering, 7-3 (1999), [11],, ()(2002) [12] Ishizuka, M., Iwasaki, H., Hisano, K., and Biswas, D., International Journal of Transport
11 10 Phenomena, 1 (1999), [13] Zhang, X, and Fujii, M. The reports of Institute of Advanced Material Study, Kyushu University, 15-1 (2001), [14],,, B,62-601(1996), [15] Hisano, K., Iwasaki, H., and Ishizuka, M., Thermal Science & Engineering, 5-2(1997), [16],,, B,64-628,(1998), [17] Kobayashi, T.,Ogushi, T., Sumi, N., and Fujii, M., IEEE Transactions on Components and Packaging Technologies, (2000), 6-13 [18],,, 15 (2001), [19] Yazawa, K., Lin, B., and Okuda, M., Advances in Electronic Packaging 1999,EEP-26-1 (1999), [20], B, (1999), [21],,,,, 5 (2000), [22],, , [23] Nishio, T., Yamada,Y., and Koyamada, K.,1998 IEMT/IMC Proceedings, Omiya, Japan (1998), [24],,,, B,64-626,(1998), [25] Kobayashi, T., Nakamura, M., Ogushi, T., Iwamura, A., and Fujii, M., Heat Transfer Asian Research (2001), [26] Nishihara, A., Hara, Y., and Sasaki, K., CHT 01 Advances in Computational Heat Transfer II, 1(2001), [27],,53-1,(2001), [28],,,No.01-9, (2001), [29] Ishizuka, M., and Hayama, S., IMechE Journal- Proc.Inst.Mech. Engrs., 214 A (2000), [30] Ishizuka, M., Hayama, S., and Iwasaki, H., ITHERM 2000 Proceedings, 1 (2000), [31],,,, B,64-628,(1998), [32],,4-5 (2001), [33] Nakayama, W, Proceedings IPACK 01, (2001), Paper No.IPACK [34] Nakayama, W, International Conference on Electronic Equipment (ICEP), Tokyo, (2001). [35] Nakayama, W., Benia, M., and Soodphakdee, D., IEEE Trans. Components and Packaging Technologies, 24-2(2001), [36], No.01-9 (2001), [37],,,No.01-9(2001), [38],, No.01-9(2001), [39],,,,No.01-9(2001), [40],,,No.01-9(2001), [41],,No.01-9(2001), [42],, No.01-9(2001), [43],,,, No.01-9(2001), [44],,,, No.01-9(2001), [45] No.01-9(2001) [46] Ogiso, K., ASME J. of Heat transfer, 123(2001), [47] Bejan, A., ASME J. Heat Transfer, 99 (1977), [48],,, (B ),61-581(1995), [49],(B ),57-534(1991), [50] Behnia, M., and Nakayama, W.,, ITHERM-98, (1998), Jour. HTSJ, Vol. 41, No. 167
12 10 [51] Park, S.-H., Kim, K.-H., Hong, T., and Nakayama, W., Advanced in Electronic Packaging -1999, ASME, 1(1999), [52],, B, ), [53],, B,66-647(2000), [54], B,59-562(1993), [55], B,66-646(2000), [56],, B,66-648(2000), [57],, B,65-637(1999), [58],, B,65-632(1999) [59] Iwasaki, H., and Ishizuka, M., 7 th Intersociety Conference on Thermal Phenomena in Electronic Systems (ITHERM), 2(2000), [60] Iwasaki, H., and Ishizuka, M., Thermal Science & Engineering, 8-1 (2000), [61] Sasao, K., Honma, M., and Nishihara, A., Advances in Electronic Packaging, EEP-19-2 (1997), [62] Ishizuka, M., Yokono, Y., and Biswas, D., IMechE Journal- Proc. Inst. Mech. Engrs.214, Part A (2000), [63],, B,61-590,(1995), [64] Sata, Y., Iwasaki, H., and Ishizuka, M., IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18-3, (1997), [65],, B,60-575(1994), [66] Minakami, K., Mochizuki, S., and Ishizuka, M., Journal of Enhanced Heat Transfer, 2-1, (1995), [67] Shinohara, K., Tasaka, M., Tojo, H., Hayashi, C., and Ominato, K., ASME/JSME Joint Thermal Engineering Conference, (1999), Paper AJTE [68] Iwasaki, H., Sasaki, T., and Ishizuka, M., IEEE Transactions on Components, Packaging and Manufacturing Technology, A. 18-3, (1995), [69] Namba, K., Kawabata, K., Niekawa, J., and Kimura, Y., Advances in Electronic Packaging 1999, EEP-26-1, (1999), [70],,,2001,, (2001), [71],, B,62-596(1996), [72],,,, B,63-611(1997), [73] Kondo, Y.,and Matsushima, H., Journal of Electronic Packages, 122(2000), [74],,35-9,(2000), [75],, B, (2001), [76], 38,(2001), [77],, B, , (1993), [78],,, B,62-599,(1996), [79],, B,66-641,(2000), [80],,,,,,13-1 (1998), [81] Behnia, M., Pralits, J., and Nakayama, W., International Journal of Transport Phenomena, (2002). [82] Nishihara, A., Sasaki, S., Ohsone, Y., and Nakajima, T., IEEE Transactions on Components, Packaging and manufacturing Technology-Part A, 20-2, (1997), [83] Gima S., Tomimura, T., Zhang, X., and Fujii, M., Proc. of the 4 th JSME-KSME Thermal Engineering Conference, 2000,1 (2000), [84] Behnia, M., and Nakayama, W., and Wang, J, 6 th Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems (ITHERM) (1998), [85] Nakayama, W. and Yoneda, N., Proc.2000 IEMT/IMC Symposium, (2000),
13 10 [86] Hisano, K., Iwasaki, H., Ishizuka, M., and Yamane, T., Proceedings of the ASME Heat Transfer Division, HTD (1999), [87] Ishizuka, M., Heat Transfer-Japanese Research, 26-8, (1997), [88] Tuckerman, D.B. and Pease, R.F., IEEE Elec. Dev. Let. Vol.EDL-2, (1981), 126. [89] Copeland, D, Behnia, M., and Nakayama, W., Thermal science and engineering,.3-2, (1995), 9. [90] Peng X.F. and Peterson G.P., Int. J. Heat Mass Transfer, 138, (1995), 755. [91] Nakayama, W., Journal of Enhanced Heat Transfer, 6(1999), [92] Mizunuma, H., Behnia, M., and Nakayama, W, 6 th Intersociety Conference on Thermal and Thermo mechanical Phenomena in Electronic Systems (ITHERM), (1998), [93],,,,,,,No [94],,,,,,,,No [95],,,,, B, 66-49,(2000), [96] Kawano, K., Sekimura,M., Minakami,K., Iwasaki, H., and Ishizuka, M., JSME International Journal Series B, Fluids and Thermal Engineering, 44-4, (2001), [97] Fushinobu, K., Majumdar, A., and Hijikata, K., Journal of Heat Transfer, 117(1995), [98],,,,, B,65-630(1999), [99],,15-1,(2001), [100] Yuan, L., Joshi, Y., and Nakayama, W., Proc. International conf. Heat Transfer and Transport Phenomena in Micro-Scale, Banff, (2000), [101] Ramaswamy, C., Joshi, Y., Nakayama, W., and Johnson, W., Journal of Enhanced Heat Transfer, 6 (1999), [102] Haider, S.i., Joshi, Y.K., and Nakayama, W., Proc.2001 IMECE Conference, (2001), Paper NHTC [103] Ramaswamy, C., Joshi, Y., Nakayama, W., and Johnson, W., IEEE Trans. Components and Packaging Technology, 23-1(2000), 3, [104],, B,60-574,(1994), [105] Ishizuka, M., Peng, G., and Hayama, S., Proc. of the InterPack01, Paper IPACK , (2001). [106] Nakayama, W., Proc. 11 th International Heat Pipe Conference, Tokyo, 3, (1999), [107],,,,,,66-645,(2000), [108] Kobayashi.T, Ogushi.T, Haga, S., Ozaki, E., and Fujii, M., Proc. 11th International Heat Pipe Conference, Tokyo (1999), [109] Sauciuc, I., Mochizuki, M., Saito, U., Nguyen, T., Akbarzadeh, A, ASME/JSME Joint Thermal Engineering Conference, (1999), Paper AJTE [110], 2001,,(2001), [111] Nishio, S., Shi, X.-H., and Zhang, W.-M., Int. J. Heat & Mass Transfer,.38 (1995), [112] Hosoda, M, Nishio, S., and Shirakashi, R., ASME/JSME Joint Thermal Engineering Conference, (1999), Paper AJTE Jour. HTSJ, Vol. 41, No. 167
14 10 Advances of Heat Transfer Research in the Past 10 Years: Space Terushige FUJII (Kobe University) IC (ISS) (1)(2) (3)(4)(5) (1) (2)(3) (4) (1) (2)(3)(4) 2002 (5) 1 (1) JAMIC g 10 MGLAB g 4.5 (2) MU300G-II g 20 (3)NASDA TR-IA g g (g) ( ) 1 [1]
15 10 NASA [9][10] VCHP ((1)) NASA 1984 (3)(8)(9) 510 [11]~[15] (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) CO (11) (12) (13) (14) (15) (16) (17) (18) -11- Jour. HTSJ, Vol. 41, No. 167
16 10 (19) (20) (21) g 2 ( 3 ) 0 L 2 [6] Ma TR-IA C 24 H 50 NaNO 3 TR-IA KCl Si Pr 3 g
17 10 10MW SSPS [3] 8 5 [18] () IML-1 9 FMPT IML SFU MSL-1 (JAMIC MGLAB ) km 90 AO (JEM) 6 () Jour. HTSJ, Vol. 41, No. 167
18 10 () NASDA 6 [19] () [1] [2] g g No
19 )p [3] g Vol.16No.4(1999)p [4] P-SC [5] () 12 (2001)p [6] 1996 [7] (1986 [8] [9] 25 (1988)p [10] 27 (1990)p [11] 38 Vol.3(2001)p [12] No.01-9(2001)p [13]JASMA Vol.18 SupplementB301 B303 B307(2001) [14] JASMA Vol.4(2001) p [15] 17 Vol.17(2001) [16] 12 (2001) [17] 12 (2001) [18] Masao Furukawa Preparatory study for development of a hybrid capillary pumped loop with a retractable flexible radiator SAE (1988) p.26 [19] JSF 2001 Vol.1(2001)p Jour. HTSJ, Vol. 41, No. 167
20 10 10 Measurements in convective heat transfer in the recent decade Masanobu MAEDA (Keio University) 10 YAG PIV TSI DANTEC PIV PIV/PTV LDA PDA PDPA 1988 Whole Field Velocimetry
21 10. CCD Adrian 1986[1] CW 50ms 33ms CW CW PIV Xe YAG 2 CCD PIV. 10ns PTV PIV [2] 3 4 DNS CCD Willert & Gharib (1991)[3] CCD FFT PIV Willert Goettingen Kompenhans PIV a) b) Jour. HTSJ, Vol. 41, No. 167
22 10 PIV 1a PIV LIF 1994[4] 1 ) a B 1992[5] 10m [7],, 3 3 PIV 4 CCD Camera Color filter Laser sheet u w v Particle image by conventional PIV Particle image by fluorescent particle (Rhodamine-B) 2 PIV 3 2 [6] 3 CCD CCD Rhodamine-B [7] PIV,
23 PIV 7.7mm 150mm/s PTV SAT-PTV (Spatial Averaged Time resolved Particle Tracking Velocimetry)[11]SAT-PTV t s 2 D (1) 5.2 t=t 1 t=t 1 +t t=t 1 y/h 5.1 t=t 1 t=t 1 +t t=t 1 +t Mean displacement of Brownian motion after t Spatial averaged vector in the interrogation window Tracer particle Spatial-averaging s B Vector of Brownian motion s f s p 4 [89] (PTV) PIV PIV PTV Super resolution PIV[10] PIV PTV 5Spatial Averaged Time resolved PTV a) b) t=t 1 50 m Channel c e n te rlin e 50 m Channel cen terlin e Vector of fluid flow Vector of particle motion 2 s 2 Dt kbt D 3d W a ll Wall Particle tracking p 50 m/s 50 m/s (1) 6 a) PIV b) -19- Jour. HTSJ, Vol. 41, No. 167
24 10 SAT-PTV PIV PIVPTV 1990 PIV PTV König (1986)[12] Hesselbecher (1991)[13] d Glover (1995)[14] Skippon (1996)[15] 2 Maeda (2000)[16]Kawaguchi(2001)[17].[14] 1 100GB Laser1 Laser2 Laser head Nd:YAG Laser Power Supply Nd:YAG Laser Control Panel Nd:YAG Laser 2 Laser head CRT 200 mm Test section Pulse Generator CPU VGA 200 mm Nozzle Receiver Memory HDD Frame Grabber PCI bus Personal Computer 7 z r RS mm N
25 I I 10 8 Laser sheet Droplet Refraction light CO 2 [18] Reflection light Collecting lens Non focal plane Focal plane 8 in-focus de-focus 10 (a) x defocus Droplet Rectangular Collecting Cylindrical Aperture Lens Lens CCD Diameter [m] Example1 Example2 Example Time [sec] m (b) PIV PTV in focus y -21- Jour. HTSJ, Vol. 41, No. 167
26 [1920] 13, 14 2 t=4.2ms PIV 0.15 (a) (b) (c) (d) 0.10 PDF Diameter (m) r r(mm) (a) Diameter range : 20 < d <30 m (b) 30 < d <40 m z z(mm) (c) 40 < d <50 m (d) 50 < d <75 m ms 10mm10mm PDF PIV [20], LDV PIV [21] 15 PIV PTV PIV
27 10 16 (ART) [22] Beam Expander M L M L BS BS M L M L BS YAG Laser CCD 4 DF Test section DF M DF DF CCD 3 CCD 1 CCD 2 17 CCD CT 15 t*= C* z*= z*= z*= r CCD D CT 10 CT z r 18 CT D Jour. HTSJ, Vol. 41, No. 167
28 LIF D [1] Adrian, R.J., Applied Optics, pp ,(1986) [2] BVol.55,pp (1989) [3] Willert,C.E. and Gharib,M., Experiment in Fluids 10,pp ,(1991) [4] B, Vol.60,pp (1994) [5] WesterweedJ. and NieuwstadtF.M.T. Laser Anemometry Advances and Applications,Vol. 1 ASME, pp ,(1991) [6] B Vol.58,pp (1992) [7] 4,64-622,(1998) [8] SantiagoJ.G.et al. Experiments in Fluids 25, pp , (1998) [9] MeinhartC.D.et al.experiments in Fluids 27, pp , (1999) [10] KeaneR. D. 1 Meas. Sci. Technol. 23 (1995) 261. [11] Inaba, S., 3, 4th International Symposium on Particle Image Velocimetry Göttingen Germany, (2001) CDROM. [12] KönigG. 2 J.Aerosol Sci.172 (1986) [13] HesselbacherK.H 2 Appl.Opt (1991) [14] GloverA.R. 2 Appl.Opt (1995) [15] SkipponS.M. TakagiY. SAE33(1996) [16] MaedaM. 2 Meas. Sci. Technol.11 (2000) L13-L18. [17] T.Kawaguchi 5 The Fifth International Symp. on Diag. and Modeling of Combustion in Internal Combustion Engines (2001) CD-ROM. [18] 37, Vol.2pp , (2000) [19], Vol [20],Vol [21] Khalitov,D.A. and Longmire,E.K.Experiments in Fluids32, pp , (2002) [22] 37 pp (2000)
29 10 Past, Today and Future in Nano-Microscale Thermal Science and Engineering Ken OKAZAKI (Tokyo Institute of Technology) LSI 3 1 CPU 0.13 m JSPS NSF [1] 10 Thermal Science and Engineering [2] [3] MEMS -25- Jour. HTSJ, Vol. 41, No. 167
30 10 Micro Electro Mechanical System , 2-1 LSI STIM LSI 1993 STIM MESFET LSI MEMS STIM YAG
31 TSE [4] CVD 1999 MEMS CVD SiO 2 AFM MRI IR SMAMM FT-ICR -27- Jour. HTSJ, Vol. 41, No. 167
32 LJ m MEMS 5 20 m nm MEMS MEMS DSMCMC 3 MEMS MEMS MEMS
33 10 MEMS [1],, (1990) [2] Therm. Sci. & Eng., 2-1 (1994) [3] Therm. Sci. & Eng., 7-6 (1999) [4] S. Kotake, Therm. Sci. & Eng., 10-2 (2002) -29- Jour. HTSJ, Vol. 41, No. 167
34 Report of Kyushu Branch Kenji ISHIDA (Saga University) <> <> <> (NIOT) 1MW 1 35km 1MW Development of Dual-Mode Regenerative Adsorption Heat Pump System Bidyut Baran Saha / Characteristic of Wetting Velocity during Quenching High Temperature Surface with an Impinging Jet. Jaffar Abdulla Hammad wetting front
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38 , TEL : (011) () 10,000 12,000 5,000 6,000 1) CD-ROM CD-ROM 8,000 2) CD-ROM :0020:00 8,000 10, ,000 5,000 ( ) ( () ) OHP 6 6 () 15:3016:30 A 6 6 () 16:4017:30 D E Microscale Effects in Liquid-Vapor Phase Change Processes Prof. Van P. Carey (UC, Berkeley) () 9:3015:15 I 6 7 () 9:0012:30 B 6 7 () 13:3014:30 B :00-17:00 A 40 2 () 1 () 2 () :00-19: ,500 2,000 ( ) ( ) 39 htsymp39@mech-me.eng.hokudai.ac.jp (TEL )
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59 1. THERMAL SCIENCE AND ENGINEERING JIS Jour. HTSJ, Vol. 41, No. 167
60 12 THERMAL SCIENCE AND ENGINEERING ) ) ) ) THERMAL SCIENCE AND ENGINEERING ) TEL, FAX htsj@asahi-net. .ne.jp HP: TEL: FAX: motizuki@cc.tuat.ac.jp
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64 Leading Edge the Thermal Technology
65 Tel : Fax : takimoto@t.kanazawa-u.ac.jp 14 25
66 F Tel / Fax : Copyright Clearance Center, Inc.(CCC) 222 Rosewood Drive, Danvers, MA USA Phone : Fax : Notice about photocopying In order to photocopy any work from this publication, you or your organization must obtain permission from the following organization which has been delegated for copyright for clearance by the copyright owner of this publication. Except in the USA The Copyright Council of the Academic Societies (CCAS) 41-6 Akasaka 9-chome, Minato-ku, Tokyo Japan Phone / Fax : In the USA Copyright Clearance Center, Inc. (CCC) 222 Rosewood Drive, Danvers, MA USA Phone : Fax : ISSN Journal of The Heat Transfer Society of Japan Vol. 41, No (5689) (5689) Published by The Heat Transfer Society of Japan 16-16, Yushima 2-chome, Bunkyo-ku, Tokyo , Japan Phone / Fax :
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