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1 Journal of the Heat Transfer Society of Japan
2 How to Write a Manuscript of Dennetsu Taro DENNETSU (Dennetsu University) Microsoft Word [1][2,4] 1 [6-10] 1 A4 (210mm297mm) (Therm. Sci. Eng. ) - 30mm 20mm 1 45mm (JICST) 10 ( mm) mm 10mm 10 ( mm) (Windows) MS [1] B (Macintosh) (1999), [2] Incropera, F. P. and Dewitt, D. P., Fundamentals of (Windows) MS Heat and Mass Transfer, John Wiley & Sons (Macintosh) (1976). [3] Smith, A. et al., Therm. Sci. Eng., 7-5 Times New Roman Symbol (1999), ( =5.271mm) [4] (1980) MS-WORD
3 Vol No. 167 March
4 Journal of The Heat Transfer Society of Japan Vol.41, No.167, March, 2002 CONTENTS < Advances of Heat Transfer Research in the Past 10 Years: Part 2 > An Overview on Development of Electronic Equipment Cooling Technologies in this Decade Masaru ISHIZUKA (Toyama Prefectural University) 1 Advances of Heat Transfer Research in the Past 10 Years: Space Terushige FUJII (Kobe University) 10 Measurements in convective heat transfer in the recent decade Masanobu MAEDA (Keio University) 16 Past, Today and Future in Nano-Microscale Thermal Science and Engineering Ken OKAZAKI (Tokyo Institute of Technology) 25 <Report of Branch> Report of Kyushu Branch Henji ISHIDA (Saga University) 30 <Calendar> 32 <Announcements> 34
5 10 An Overview on Development of Electronic Equipment Cooling Technologies in this Decade Masaru ISHIZUKA (Toyama Prefectural University) [1,2]1970 IBM LSI LSI 1 15 [5] 1984 A4 B5 15mm 1GHzCPU, 512MB [3,4,5] 2 CPU 10 2 [1,6,7] -1- Jour. HTSJ, Vol. 41, No. 167
![10 [16-18]Yazawa [19] [20] [21] 3](/docs-images/93/113163396/images/6-0.jpg "[8-10] [11] [22] [23] [12] Zhang [13]")
![1 Nu Ra 1/5 [24,25] [26] [14,15] Ra](/docs-images/93/113163396/images/6-1.jpg "MG CPU 4 [29] PC [27] [28] 3 [9] 2002")
6 10 [16-18]Yazawa [19] [20] [21] 3 [8-10] [11] [22] [23] [12] Zhang [13] 1 Nu Ra 1/5 [24,25] [26] [14,15] Ra MG CPU 4 [29] PC [27] [28] 3 [9]
7 10 [46] Bejan[47] 5 PC [30] [48,49]Behnia [58] Pak [51] [29,30] [31] CFD 6 [32] [52-56] 5 10 [52] BUA [57] [32-36] [58] CPU CFD [59,60] [37-45] Sasao [61] -3- Jour. HTSJ, Vol. 41, No. 167
8 10 [62] LSI [61,62] [65-66]Shinohara [67] [84,85] [86] [68] [87] [69,70] W 600W 1000kW/m 2 [71-74] LSI Tuckerman [88] 2 3 [89] [90] [75] Nakayama[91] 7 [76] 2cmx2cm CFD 8 FX Mizunuma [92] 1mm [77-79] A [80] 7 [91] [81,82] Gima [83] P IC
![10 1 [91] 57 350m 0.](/docs-images/93/113163396/images/9-1.jpg "1Kcm 2 /W [97,98] [99] 8 [91] [93,94] [95,96] 9 10 Joshi [100-103] 9 [96]")
9 10 1 [91] m 0.1Kcm 2 /W [97,98] [99] 8 [91] [93,94] [95,96] 9 10 Joshi [ ] 9 [96] PF [95] [104] -5- Jour. HTSJ, Vol. 41, No. 167
10 10 [104,105] [1] Nakayama, W., Appl. Mech. Rev., 49-10,Part 2, [105] (1996), S167-S173. [2], (1999). [3],, (2000), [4],, (2000), [ ] [5],,, [109] (1991),p4. [6] Nakayama, W.Electronics Cooling, 4-3 (1998), [7] Nakayama, W., Future Circuits, Issue3 (1998), [110][8] Ishizuka, M., IMechE Journal-Proc. Inst. Mech. [111,112] Engrs. 212, Part A (1998), [9] Ishizuka, M., Proc. Symposium on Energy Engineering in the 21 st Century (SEE2000), Hong Kong, 1, (2000), [10],, Thermal Science & Engineering, 7-3 (1999), [11],, ( )(2002) [12] Ishizuka, M., Iwasaki, H., Hisano, K., and Biswas, D., International Journal of Transport
11 10 Phenomena, 1 (1999), [13] Zhang, X, and Fujii, M. The reports of Institute of Advanced Material Study, Kyushu University, 15-1 (2001), [30] Ishizuka, M., Hayama, S., and Iwasaki, H., ITHERM 2000 Proceedings, 1 (2000), [31],,, B,64-628,(1998), [14],, [32],,4-5 (2001), B,62-601(1996), [15] Hisano, K., Iwasaki, H., and Ishizuka, M., Thermal Science & Engineering, 5-2(1997), [33] Nakayama, W, Proceedings IPACK 01, (2001), Paper No.IPACK [16],, [34] Nakayama, W, International Conference on B,64-628,(1998), [17] Kobayashi, T.,Ogushi, T., Sumi, N., and Fujii, M., Electronic Equipment (ICEP), Tokyo, (2001). [35] Nakayama, W., Benia, M., and Soodphakdee, D., IEEE Transactions on Components and IEEE Trans. Components and Packaging Packaging Technologies, (2000), 6-13 Technologies, 24-2(2001), [18],, [36], 15 (2001), No.01-9 (2001), [19] Yazawa, K., Lin, B., and Okuda, M., Advances in Electronic Packaging 1999,EEP-26-1 (1999), [37],,,No.01-9(2001), [38],, No.01-9(2001), [20], B, [39],, (1999), ,No.01-9(2001), [21],,,,, [40],, 5 (2000),,No.01-9(2001), [41], [22],, 11,No.01-9(2001), [42],, 2001, [23] Nishio, T., Yamada,Y., and Koyamada, K.,1998 IEMT/IMC Proceedings, Omiya, Japan (1998), No.01-9(2001), [43],,,, No.01-9(2001), [44],,,, [24],,, B,64-626,(1998), [25] Kobayashi, T., Nakamura, M., Ogushi, T., Iwamura, A., and Fujii, M., Heat Transfer Asian Research (2001), [26] Nishihara, A., Hara, Y., and Sasaki, K., CHT 01 Advances in Computational Heat Transfer II, No.01-9(2001), [45] No.01-9(2001) [46] Ogiso, K., ASME J. of Heat transfer, 123(2001), [47] Bejan, A., ASME J. Heat Transfer, 99 (1977), (2001), [48],,, [27],,53-1,(2001), (B ),61-581(1995), [28],, [49], (B,No.01-9, (2001), ),57-534(1991), [29] Ishizuka, M., and Hayama, S., IMechE Journal- [50] Behnia, M., and Nakayama, W.,, ITHERM-98, Proc.Inst.Mech. Engrs., 214 A (2000), (1998), Jour. HTSJ, Vol. 41, No. 167
12 10 [51] Park, S.-H., Kim, K.-H., Hong, T., and Nakayama, W., Advanced in Electronic Packaging -1999, ASME, 1(1999), Transactions on Components, Packaging and Manufacturing Technology, A. 18-3, (1995), [52],, [69] Namba, K., Kawabata, K., Niekawa, J., and B, ), Kimura, Y., Advances in Electronic Packaging [53],, 1999, EEP-26-1, (1999), B,66-647(2000), [70],,,2001 [54],,, (2001), B,59-562(1993), [55], [71],, B,66-646(2000), B,62-596(1996), [56],, [72],,, B,66-648(2000), B,63-611(1997), [57],, [73] Kondo, Y.,and Matsushima, H., Journal of B,65-637(1999), Electronic Packages, 122(2000), [58],, [74],,35-9,(2000), B,65-632(1999) [59] Iwasaki, H., and Ishizuka, M., 7 th Intersociety [75],, B, (2001), Conference on Thermal Phenomena in Electronic Systems (ITHERM), 2(2000), [60] Iwasaki, H., and Ishizuka, M., Thermal Science & Engineering, 8-1 (2000), [61] Sasao, K., Honma, M., and Nishihara, A., Advances in Electronic Packaging, EEP-19-2 (1997), [62] Ishizuka, M., Yokono, Y., and Biswas, D., IMechE Journal- Proc. Inst. Mech. Engrs.214, Part A (2000), [76],38,(2001), [77],, B, , (1993), [78],,, B,62-599,(1996), [79],, B,66-641,(2000), [80],,,,,13-1 (1998), [63],, [81] Behnia, M., Pralits, J., and Nakayama, W., B,61-590,(1995), [64] Sata, Y., Iwasaki, H., and Ishizuka, M., IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18-3, (1997), International Journal of Transport Phenomena, (2002). [82] Nishihara, A., Sasaki, S., Ohsone, Y., and Nakajima, T., IEEE Transactions on Components, Packaging and manufacturing Technology-Part A, [65], 20-2, (1997), B,60-575(1994), [83] Gima S., Tomimura, T., Zhang, X., and Fujii, M., [66] Minakami, K., Mochizuki, S., and Ishizuka, M., Proc. of the 4 th JSME-KSME Thermal Journal of Enhanced Heat Transfer, 2-1, (1995), Engineering Conference, 2000,1 (2000), [84] Behnia, M., and Nakayama, W., and Wang, J, 6 th [67] Shinohara, K., Tasaka, M., Tojo, H., Hayashi, C., Intersociety Conference on Thermal and and Ominato, K., ASME/JSME Joint Thermal Thermo-mechanical Phenomena in Electronic Engineering Conference, (1999), Paper Systems (ITHERM) (1998), AJTE [85] Nakayama, W. and Yoneda, N., Proc.2000 [68] Iwasaki, H., Sasaki, T., and Ishizuka, M., IEEE IEMT/IMC Symposium, (2000),
13 10 [86] Hisano, K., Iwasaki, H., Ishizuka, M., and Yamane, T., Proceedings of the ASME Heat Transfer Division, HTD (1999), [87] Ishizuka, M., Heat Transfer-Japanese Research, 26-8, (1997), [88] Tuckerman, D.B. and Pease, R.F., IEEE Elec. Dev. Let. Vol.EDL-2, (1981), 126. [89] Copeland, D, Behnia, M., and Nakayama, W., Thermal science and engineering,.3-2, (1995), 9. [90] Peng X.F. and Peterson G.P., Int. J. Heat Mass Transfer, 138, (1995), 755. International conf. Heat Transfer and Transport Phenomena in Micro-Scale, Banff, (2000), [101] Ramaswamy, C., Joshi, Y., Nakayama, W., and Johnson, W., Journal of Enhanced Heat Transfer, 6 (1999), [102] Haider, S.i., Joshi, Y.K., and Nakayama, W., Proc.2001 IMECE Conference, (2001), Paper NHTC [103] Ramaswamy, C., Joshi, Y., Nakayama, W., and Johnson, W., IEEE Trans. Components and [91] Nakayama, W., Journal of Enhanced Heat Packaging Technology, 23-1(2000), 3, Transfer, 6(1999), [92] Mizunuma, H., Behnia, M., and Nakayama, W, [104],, B,60-574,(1994), th Intersociety Conference on Thermal and [105] Ishizuka, M., Peng, G., and Hayama, S., Proc. of Thermo mechanical Phenomena in Electronic the InterPack01, Paper IPACK , Systems (ITHERM), (1998), (2001). [93],,, [106] Nakayama, W., Proc. 11 th International Heat,, Pipe Conference, Tokyo, 3, (1999), ,No [94],,,,,,No [95],, [107],,,,,66-645,(2000),, [108] Kobayashi.T, Ogushi.T, Haga, S., Ozaki, E., and Fujii, M., Proc. 11th International Heat Pipe, B, 66-49,(2000), Conference, Tokyo (1999), [109] Sauciuc, I., Mochizuki, M., Saito, U., Nguyen, [96] Kawano, K., Sekimura,M., Minakami,K., T., Akbarzadeh, A, ASME/JSME Joint Thermal Iwasaki, H., and Ishizuka, M., JSME International Engineering Conference, (1999), Paper Journal Series B, Fluids and Thermal AJTE Engineering, 44-4, (2001), [97] Fushinobu, K., Majumdar, A., and Hijikata, K.,,,(2001), Journal of Heat Transfer, 117(1995), [111] Nishio, S., Shi, X.-H., and Zhang, W.-M., Int. J. [98],,,, Heat & Mass Transfer,.38 (1995), B,65-630(1999), [112] Hosoda, M, Nishio, S., and Shirakashi, R., [99], ASME/JSME Joint Thermal Engineering,15-1,(2001), Conference, (1999), Paper AJTE [100] Yuan, L., Joshi, Y., and Nakayama, W., Proc. [110], Jour. HTSJ, Vol. 41, No. 167
14 10 Advances of Heat Transfer Research in the Past 10 Years: Space Terushige FUJII (Kobe University) 20 (1) (2) (3) (4) 2002 (5) 1 (1) JAMIC g 10 IC MGLAB g 4.5 (2) MU300G-II g 20 (3) NASDA TR-IA g (ISS) g (1) (2) (3) (4) (5) (1) (2) (3) (4) 10-1 () (g) [1]
15 10 ( (1)) NASA 1984 (3)(8) (9) 510 [11]~[15] (1) (2) (3) NASA (4) 1984 (5) (6) 10 [9][10] (7) (8) (9) (10) CO (11) (12) (13) VCHP (14) (15) (16) (17) (18) -11- Jour. HTSJ, Vol. 41, No. 167
16 (19) 10 4 TR-IA C 24 H 50 (20) NaNO 3 (21) g 10 3 TR-IA KCl 10 2 Si Pr 3 (3 ) g 4 0 L 2 [6] Ma
17 10 10MW SSPS IML-1 9 FMPT IML SFU MSL-1 8 (JAMICMGLAB ) km 90 AO (JEM) 4 [3] 6 () [18] 5 ( ) -13- Jour. HTSJ, Vol. 41, No. 167
18 10 ( ) NASDA 6 [19] ( ) [1] [2] g g No
19 )p [11] 38 [3] Vol.3(2001)p g [12] No.01-9(2001)p Vol.16No.4(1999)p [13] JASMA [4] Vol.18 Supplement B301B303B307(2001) P-SC194 [14] 1993 [5] () JASMA Vol.4(2001) 12 p (2001)p [15] [6] 17 Vol.17(2001) 1996 [16] 12 [7] (2001) (1986 [17] [8] 12 (2001) [18] Masao Furukawa Preparatory study for development of a hybrid capillary pumped loop [9] 25 with a retractable flexible radiator SAE (1988)p (1988)p.26 [10] 27 [19] JSF 2001 (1990)p Vol.1(2001)p Jour. HTSJ, Vol. 41, No. 167
20 10 10 Measurements in convective heat transfer in the recent decade Masanobu MAEDA (Keio University) 10 YAG PIV TSIDANTEC PIV PIV/PTV LDA PDA PDPA 1988 Whole Field Velocimetry
21 10. CCD PTV Adrian 1986[1] PIV 1 CW 50ms 33ms 1989[2] 3 4 DNS CW CCD Willert & Gharib (1991)[3] CCD FFT PIV Willert Goettingen Kompenhans PIV CW PIV Xe a) b) YAG 2 CCD PIV 1. 10ns -17- Jour. HTSJ, Vol. 41, No. 167
22 10 PIV 1a PIV LIF 10µm 1994[4] [7],, 3 1 ) a PIV 4 CCD Camera Color filter.. Laser sheet B 1992[5] u w v Particle image by conventional PIV Particle image by fluorescent particle (Rhodamine-B) 3 CCD CCD Rhodamine-B 2 PIV [7] 3 2 PIV [6],
23 PTV SAT-PTV (Spatial PIV Averaged Time resolved Particle Tracking Velocimetry)[11] SAT-PTV 7.7mm 150mm/s t s 2 D (1) 5.2 t=t 1 t=t 1 + t t=t 1 y/h 5.1 t=t 1 t=t 1 + t t=t 1 + t Mean displacement of Brownian motion after t Spatial averaged vector in the interrogation window Tracer particle Spatial-averaging s B Vector of Brownian motion s f s p Vector of fluid flow 4 5 Spatial Averaged Time resolved PTV 2 s = 2 D t (1) kbt D = 3πµ d p W a ll 50µ m/s [89] 50µ m Channel a) c e n te rlin e (PTV) Wall 50µ m/s PIV 50µ m b) Channel cen terlin e PIV PTV 6a) PIV Super resolution PIV[10] b) PIV PTV t=t 1 Vector of particle motion Particle tracking -19- Jour. HTSJ, Vol. 41, No. 167
24 10 2 SAT-PTV PIV Maeda (2000)[16]Kawaguchi(2001)[17] PIVPTV. [14] 1 100GB mm Test section 0.5mm Laser1 Laser2 Laser head PIV PTV Nd:YAG Laser Power Supply Receiver Nd:YAG Laser Control Panel RS422 Pulse Generator Memory Frame CRT Grabber CPU PCI bus König (1986)[12] VGA 200 mm HDD Personal Computer Nozzle r Nd:YAG Laser2 Hesselbecher (1991)[13] Laser head d δθ z N Glover (1995)[14]Skippon (1996)[15]
![I I 10 CO 2 8 Laser sheet Reflection light α Droplet θ Refraction light [18] 10.](/docs-images/93/113163396/images/25-0.jpg "11 Collecting lens Non focal plane Focal plane 8 in-focus de-focus 10 (a) x defocus Droplet Rectangular Collecting Cylindrical Aperture Lens Lens CCD Diameter [µm] 400 300 200 100 Example1")
25 I I 10 CO 2 8 Laser sheet Reflection light α Droplet θ Refraction light [18] Collecting lens Non focal plane Focal plane 8 in-focus de-focus 10 (a) x defocus Droplet Rectangular Collecting Cylindrical Aperture Lens Lens CCD Diameter [µm] Example1 Example2 Example PIV Time [sec] 9 9 PTV 2-3m (b) y in focus -21- Jour. HTSJ, Vol. 41, No. 167
26 , [1920] 2 t=4.2ms PIV 0.15 (a) (b) (c) (d) 0.10 PDF Diameter (µm) r r(mm) (a) Diameter range : 20 < d <30 m (b) 30 < d <40 m z z(mm) (c) 5 40 < d <50 m (d) 5 50 < d <75 m LDV PIV 3 4.2ms 10mm10mm PDF [21] PIV [20] PIV, PTV PIV
27 10 16 (ART) [22] Beam Expander M L YAG Laser M L BS M L BS BS M L CCD 4 DF Test section DF M DF DF CCD 3 CCD 1 CCD 2 15 C* 17 CCD CT t*= z*= z*= z*= ? r z CCD r D 18 CT CT 10 D 19 CT Jour. HTSJ, Vol. 41, No. 167
![10 19 157-167. [13] HesselbacherK.H2 Appl.Opt.30-33 (1991) 4930-4935. 1990 2002 [14] Glover A.R. 2 Appl.Opt. 34-36 (1995) 10 8409-8421. LIF [15] SkipponS.M.TakagiY.SAE33(1996) 183-198. [16] MaedaM.](/docs-images/93/113163396/images/28-0.jpg "2 Meas. Sci. Technol.11 D (2000) L13-L18. [17] T.Kawaguchi 5 The Fifth International Symp. on Diag. and Modeling of Combustion in Internal Combustion Engines (2001) CD-ROM. [18] 37, Vol.2pp.")
28 [13] HesselbacherK.H2 Appl.Opt (1991) [14] Glover A.R. 2 Appl.Opt (1995) LIF [15] SkipponS.M.TakagiY.SAE33(1996) [16] MaedaM. 2 Meas. Sci. Technol.11 D (2000) L13-L18. [17] T.Kawaguchi 5 The Fifth International Symp. on Diag. and Modeling of Combustion in Internal Combustion Engines (2001) CD-ROM. [18] 37, Vol.2pp , (2000) [19] [1] Adrian, R.J., Applied Optics, 25-21, Vol pp ,(1986) [20] [2],Vol BVol.55,pp (1989) [3] Willert,C.E. and Gharib,M., Experiment in Fluids 10,pp ,(1991) B, Vol.60,pp (1994) [5] Westerweed J.and Nieuwstadt F.M.T.Laser Anemometry Advances and Applications,Vol. 1 ASME, pp ,(1991) [6] BVol.58,pp (1992) [7] 4,64-622,(1998) [8] SantiagoJ.G.et al.experiments in Fluids 25, pp , (1998) [9] MeinhartC.D.et al.experiments in Fluids 27, pp , (1999) [10] KeaneR. D. 1 Meas. Sci. Technol. 23 (1995) 261. [11] Inaba, S., 3, 4th International Symposium on Particle Image Velocimetry Göttingen Germany, (2001) CDROM. [12] König G. 2 J.Aerosol Sci (1986) [21] Khalitov,D.A. and Longmire,E.K. Experiments in Fluids32, pp , (2002) [22] 37 [4] pp (2000)
29 10 Past, Today and Future in Nano-Microscale Thermal Science and Engineering Ken OKAZAKI (Tokyo Institute of Technology) LSI JSPS NSF [1] 3 10 Thermal Science and Engineering [2] [3] 1 CPU 0.13 µm MEMS -25- Jour. HTSJ, Vol. 41, No. 167
30 10 Micro Electro Mechanical System STIM , 2 LSI -1 LSI 1993 STIM MESFET LSI MEMS STIM YAG
31 10-2 TSE [4] CVD 1999 MEMS CVD SiO 2 AFM MRI IR SMAMM FT-ICR -27- Jour. HTSJ, Vol. 41, No. 167
32 µm 1993 MEMS 5 LJ 20 µm 1993 nm MEMS DSMCMC 3 MEMS MEMS MEMS MEMS
33 10 MEMS [1],, (1990) [2] Therm. Sci. & Eng., 2-1 (1994) [3] Therm. Sci. & Eng., 7-6 (1999) [4] S. Kotake, Therm. Sci. & Eng., 10-2 (2002) -29- Jour. HTSJ, Vol. 41, No. 167
34 Report of Kyushu Branch Kenji ISHIDA (Saga University) < > < > < > / Characteristic of Wetting Velocity during Quenching High Temperature Surface with an Impinging Jet. Jaffar Abdulla Hammad (NIOT) 1MW 1 35km 1MW wetting front Development of Dual-Mode Regenerative Adsorption Heat Pump System Bidyut Baran Saha
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38 39 Prof. Van P. Carey(UC, Berkeley) , TEL : (011) ( ) 10,000 12, () 9:3015:15 5,000 6,000 I 1) CD-ROM 6 7 () 9:0012:30 CD-ROM B 8, () 13:3014:30 2) B CD-ROM :00-17:00 A :0020: ( ) 1 ( ) 8,000 10, ( ) 4,000 5, :00-19:40 ( ) ( () ) 100 3,500 2,000 ( ) OHP ( ) 66 () 15:3016:30 A () 16:4017:30 htsymp39@mech-me.eng.hokudai.ac.jp D E (TEL ) Microscale Effects in Liquid-Vapor Phase Change Processes
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59 2. JIS- 1. THERMAL SCIENCE AND ENGINEERING Jour. HTSJ, Vol. 41, No. 167
60 ) ) ) ) THERMAL SCIENCE AND ENGINEERING ) TEL, FAX htsj@asahi-net. .ne.jp HP: THERMAL SCIENCE AND ENGINEERING TEL: FAX: motizuki@cc.tuat.ac.jp
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64 Leading Edge the Thermal Technology
65 Tel : Fax : takimoto@t.kanazawa-u.ac.jp
66 F Tel / Fax : Copyright Clearance Center, Inc.(CCC) 222 Rosewood Drive, Danvers, MA USA Phone : Fax : Notice about photocopying In order to photocopy any work from this publication, you or your organization must obtain permission from the following organization which has been delegated for copyright for clearance by the copyright owner of this publication. Except in the USA The Copyright Council of the Academic Societies (CCAS) 41-6 Akasaka 9-chome, Minato-ku, Tokyo Japan Phone / Fax : In the USA Copyright Clearance Center, Inc. (CCC) 222 Rosewood Drive, Danvers, MA USA Phone : Fax : ISSN Journal of The Heat Transfer Society of Japan Vol. 41, No (5689) (5689) Published by The Heat Transfer Society of Japan 16-16, Yushima 2-chome, Bunkyo-ku, Tokyo , Japan Phone / Fax :
How to Write a Manuscript of Dennetsu Taro DENNETSU (Dennetsu University) Microsoft Word 1 1 A4 (210mm297mm) 30mm 30mm 20mm 20mm 1 45mm 10 ( mm
Journal of the Heat Transfer Society of Japan How to Write a Manuscript of Dennetsu Taro DENNETSU (Dennetsu University) Microsoft Word 1 1 A4 (210mm297mm) 30mm 30mm 20mm 20mm 1 45mm 10 (100.3514mm) 8 2
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Journal of the Heat Transfer Society of Japan How to Write a Manuscript of Dennetsu Taro DENNETSU (Dennetsu University) Microsoft Word 1 1 A4 (210mm297mm) 30mm 30mm 20mm 20mm 1 45mm 1 2.2 http://www.htsj.or.jp/
IEEE HDD RAID MPI MPU/CPU GPGPU GPU cm I m cm /g I I n/ cm 2 s X n/ cm s cm g/cm
Neutron Visual Sensing Techniques Making Good Use of Computer Science J-PARC CT CT-PET TB IEEE HDD RAID MPI MPU/CPU GPGPU GPU cm I m cm /g I I n/ cm 2 s X n/ cm s cm g/cm cm cm barn cm thn/ cm s n/ cm
Journal of The Heat Transfer Society of Japan Vol.39, No.155, March, 2000 CONTENTS <Reports on the Branch Activities> Researches and technologies for
Vol. 39 2000 No. 155 March Joint Research SEE2000 37 37 ICHMT 2 nd International Symposium On ADVANCES IN COMPUTATIONAL HEAT TRANSFER CHT 01 CO 2 Journal of The Heat Transfer Society of Japan Vol.39, No.155,
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3 108-0023 3-16-20 7F Tel(03)5484-3535 Fax(03)5484-3534 http://www.ipsj.or.jp/ E-mail somu@ipsj.or.jp mem@ipsj.or.jp keiri@ipsj.or.jp sys@ipsj.or.jp sig@ipsj.or.jp jigyo@ipsj.or.jp intl@ipsj.or.jp IFIP
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2). 3) 4) 1.2 NICTNICT DCRA Dihedral Corner Reflector micro-arraysdcra DCRA DCRA DCRA 3D DCRA PC USB PC PC ON / OFF Velleman K8055 K8055 K8055
1 1 1 2 DCRA 1. 1.1 1) 1 Tactile Interface with Air Jets for Floating Images Aya Higuchi, 1 Nomin, 1 Sandor Markon 1 and Satoshi Maekawa 2 The new optical device DCRA can display floating images in free
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Optical Lenses CCD Camera Laser Sheet Wind Turbine with med Diffuser Pitot Tube PC Fig.1 Experimental facility. Transparent Diffuser Double Pulsed Nd:
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