Microsoft Word - ★(5047) 325_A.doc
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1 No. : 取扱説明書 INSTRUCTION MANUAL 5047Series 0.5mm PITCH Board-to-Board Connector A DCN /11/28 H. Sawaki A. Tsunemura K. Yamane O EDN /01/18 H. Sawaki A. Tsunemura K. Yamane NO EDN/DCN DATE PREPARED by CHECKED by APPROVED by KYOCERA Corporation
2 目次 TABLE OF CONTENTS 1. 概要 OUTLINE 2 2. 部品名称および型番 PART NAMES AND MODEL NUMBERS 部品名称 MOUNTING ON THE BOARD 型番 MODEL NUMBERS 3 3. 取り扱い上の注意 PRECAUTIONS IN HANDLING 基板対基板嵌合での使用について USING FOR BOARD-TO-BOARD CONNECTION 実装について MOUNTING 嵌合について ENGAGEMENT 洗浄について CLEANSING プリント基板およびメタルマスク開口部推奨寸法について PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK KYOCERA Corporation PAGE 1/9
3 1. 概要 OUTLINE 本製品 5047 シリーズコネクターは 市場における高密度実装化に対応すべく開発された 0.5mm ピッチの ボードツーボードコネクターです 5047 Series connector is a board-to-board connector with 0.5mm pitch designed to miniaturize outer dimension for high-density mounting. 2. 部品名称および型番 2-1. 部品名称 PART NAMES AND MODEL NUMBERS PART NAMES (1) プラグ Plug 型番 xxx xxx xxx x 金具有り (2) リセプタクル Receptacle 金具有り 金具無し 型番 xxx xxx xxx x 金具無し 5047 SERIES INSTRUCTION MANUAL 2018 KYOCERA Corporation No PAGE 2/9
4 2-2. 型番 MODEL NUMBERS (1) プラグ Plug Plug : X X X X X X X X X + 14 : Plug シリーズ番号 Series Number 極数 Number of Pos. バリエーションコード 1 ( 1) Variation Code 1 バリエーションコード 2 ( 2) Variation Code 2 めっきコード Plating Code( 3) 鉛フリー Lead Free (2) リセプタクル Receptacle Rec. : X X X X X X X X X + 24 : Rec シリーズ番号 Series Number 極数 Number of Pos. バリエーションコード 1 ( 1) Variation Code 1 バリエーションコード 2 ( 2) Variation Code 2 めっきコード Plating Code( 3) 鉛フリー Lead Free 1 バリエーションコード 1 Variation Code 1 コード Code 金具 Anchor Plate ボス Boss 吸着テープ Vacuum Tape バリエーションコード 2 Variation Code 2 コード Code 00 嵌合高さ Stacking Height H = 3.5mm 50 H = 5.0mm 60 H = 6.0mm 70 H = 7.0mm 3 めっきコード Plating Code コード Code めっき Plating 000 No Plating 829 Au : 0.1~0.2μm 856 Au : 0.1μm 861 Au : 0.2μm 832 Pb-Ni KYOCERA Corporation PAGE 3/9
5 3. 取り扱い上の注意 PRECAUTIONS IN HANDLING 3-1. 基板対基板嵌合での使用について USING FOR BOARD-TO-BOARD CONNECTION (1) 基板同士をネジ止めして固定する際は コネクターをねじらないようご注意ください 基板やネジ穴等のバラつきにより コネクターがねじられた状態で固定される恐れがあります When the printed circuit boards on which connectors are mounted were fixed by using screw, the mated connector could be twisted due to variations in dimensions of such as screw holes. So great attention should be given not to twist connectors when fixing the boards. 基板 PCB ネジ Screw (2) コネクターが基板に対してセンターに実装されない場合 もしくは大きい基板同士の嵌合の場合に嵌合が傾く恐れがありますので 下図のような傾き防止用のスペーサーおよび嵌合方向への押さえによる固定をお勧めします When connectors are mounted off-center of the printed circuit board, or when the printed circuit boards to be connected are rather large, mating may tilt. In order to avoid tilting, it is recommended that the printed circuit boards are fixed by the spacer and something that generates a force to retain the proper mated condition. 押さえ Retaining Force スペーサー Spacer KYOCERA Corporation PAGE 4/9
6 3-2. 実装について MOUNTING (1) 実装の際には 接触部及びテール部に不要な外力が加わり 変形等が生じないようご注意ください Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tails. (2) 自動実装の際には 弊社推奨パターン図でのクリームはんだ印刷および実装をお願いします ( プリント基板寸法の詳細につきましては 弊社製品図面をご参照ください ) When the connectors are automatically mounted, please apply cream soldering printing in the process in accordance with the pattern chart of our recommendation. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) (3) 手付けはんだの際には テール部及び基板へのフラックス塗布はしないでください コネクター内部および接触部へのフラックス上がり及び飛散の原因となり 接触不良等の不具合が発生する場合があります また はんだごてで端子に負荷をかけて はんだ付けを行わないでください テール部変形及びインシュレーターの溶け等の恐れがあります Please do not apply flux onto the tail and PC board, when it is soldered manually. Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact. Also avoid giving any stress to the product with the soldering iron. It could deform tail or melt insulator. (4) 実装後 酸化の影響ではんだ付け部に変色が見られる事がありますが 製品性能に影響はありません There is no influence in the product performance thought discoloration might be seen in the soldering tail after mounting. (5) 実装後 テール上面にはんだ濡れ広がりのない場合がありますが 製品性能に影響はありません There is no influence in the product performance though the tail surface doesn't get wet with solder after mounting KYOCERA Corporation PAGE 5/9
7 3-3. 嵌合について ENGAGEMENT (1) コネクターの接触部に触れたり 異物を入れたりしないでください バネの変形等の恐れがあります If something touches the contact points or with some foreign object, the spring could be deformed. (2) 過度なこじり挿抜やねじり挿抜はしないでください 本製品は小型化 軽量化のために成形品の肉厚を薄くしているため 成形品の破壊 端子の変形 テール部はんだ剥離の原因となります We minimized the thickness of this product to achieve downsizing and light weightiness. Because of this, uneven pressure or distorted attachment at engagement/disengagement could cause destruction, terminal deformity, plating detachment on the tail. こじり Uneven Pressure ねじり Distorted Attachment KYOCERA Corporation PAGE 6/9
8 3-4. 洗浄について CLEANSING 貴社工程におきまして 洗浄を実施する場合は 下記条件での洗浄を推奨いたします Following cleansing condition should be recommended in case the cleansing is done in your production process. < 耐溶剤性試験条件 > 洗浄剤 : パインアルファ ST-100S ( 荒川化学社製 ) 成分 : ポリエチレングリコール ( アルキルエーテル溶剤 ) 含有比率 80% : ノンイオン系界面活性剤含有比率 15% : 純水含有比率 05% < 洗浄工程および条件 > 工程洗浄すすぎ 水切り 乾燥 乾燥 方式温液超音波揺動超音波揺動エアーナイフ温風リフロー 仕様洗剤使用液剤 パインアルファ ST-100S イソプピルアルコール工場エアー 温度 60 常温常温 85 時間 60 秒間 120 秒間 60 秒間 10 分間 <Test Condition for Resistance to Solvent> Solvent : PINE ALPHA ST-100S (ARAKAWA CHEMICAL INDUSTRIES, LTD.) Content : POLYETHYLENE-GLYCOL (solvent classified as ALKYL-ETHER) Content Ratio 80% : NON-ION SYSTEM SURFACE-ACTIVE AGENT Content Ratio 15% : PURE WATER Content Ratio 05% <Cleansing Process and Condition> Process Cleansing Washing Wiping Drying Drying System Up and Down Movement in Hot Liquid with Ultrasonic Wave Up and Down Movement with Ultrasonic Wave Air Knife Warm Blow Detergent Liquid Medicine PINE ALPHA ST-100S Isopropyl Alcohol Industrial Air Temperature 60 Normal Temperature Normal Temperature 85 Time 60 Seconds 120 Seconds 60 Seconds 10 Minutes KYOCERA Corporation PAGE 7/9
9 3-5. プリント基板およびメタルマスク開口部推奨寸法について PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK 本コネクターは ピッチ間隔が 0.5mm であり 高密度実装が要求されるコネクターとなっております 高密度実装が要求されるコネクターに関しては 半田ブリッジによるショート等の実装不具合を減らすために適正なはんだ量の管理が必要となります つきましては 添付推奨寸法図をご参考願います ( プリント基板寸法の詳細につきましては 弊社製品図面をご参照ください ) 特に PLUG 保持金具部の半田量が多い場合は RECE ソケットと干渉し 不完全嵌合の原因となりますので注意ください プリント基板およびメタルマスク開口部寸法は推奨ですので不明点や懸念点等がございましたらご相談いただけますようお願いします This series of connector is required to be mounted in the high density due to its 0.5mm pitches. The connectors mounted in the high density need to be controlled adequate amount of solder in order to prevent failures in the mounting process such as short-circuit caused by solder bridge. For the dimensions of the metal mask opening, therefore, please refer to our recommended dimensions shown in the attached drawing. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) If excessive solder is applied on the retaining metal of the plug connector, especially, it interferes with the receptacle connector, which leads to incomplete mate of the connectors. As dimensions shown in the drawings are our recommendations. Please feel free to contact us if you have any questions and/or concerns about these dimensions KYOCERA Corporation PAGE 8/9
10 Series 5047 : 0.5 mm Pitch Recommended Pad & Stencil size (SIGNAL CONTACT) PLUG REC. 0.3mm 0.3mm Pad 2.0mm 2.0mm 0.27mm 0.27mm Stencil 1.8mm 1.8mm t=0.15mm t=0.15mm KYOCERA Corporation PAGE 9/9
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