JDR 2012.5.11 1 2 3 4 5 7-41-3 Fujiwara, Funabashi, CHIBA, 273-0047 JAPAN, JTTAS 1 1-1 Hibariga-oka, Tempakucho, Toyohashi, AICHI, 441-8580 JAPAN, Toyohashi University of Technology 2 1-2-4 Kinshi, Sumida, TOKYO, 130-8560 JAPAN, AIU Insurance Company 3 1-51-6 Hounan, Suginami, TOKYO, 168-0062 JAPAN, I-Ryu Management Institute Inc. 4 4-2-5, Kanda-Surugadai, Chiyoda, TOKYO, 101-0062 JAPAN, InterRisk Research Institute & Consulting, Inc. 5 Abstract Keywords BCP 1. Introduction ISO ISO9000ISOISO14000 PDCA BCMSISO22300 ISOISO BCMS BCPBCP 1
JDR 2012.5.11 2. Figure1 PDCA 3. Figure 1 3.1 2
JDR 2012.5.11 National Key Resources [1] 1 11.6km1 500 IT 100500km Table 1 30km 16 10km 30km 8 1km 10km 4 100m 1km 2 100m 0 3.2 13 8 Table 2 10 6 8 6 4 2 0 4 10 4 8 4 0 2 2 4 2 3.3 5km10km20km Table 3 P I PI 7 0 4 0 6 0 4 0 6 500 2 3 6 5 10 2 20 5 34 2 68 94 3
JDR 2012.5.11 12m 0 4 0 8m 12m 0 4 0 4m 8m 0 4 0 2m 4m 500 0 4 0 1m 2m 1 4 4 1m 3 3 9 13 5m 0 4 0 2m 5m 0 4 0 1m 2m 100 1 4 4 1m 4 3 12 16 60m/s 0 3 0 50m/s 60m/s 0 3 0 40m/s 50m/s 20 1 3 3 30m/s 40m/s 1 3 3 20m/s 30m/s 6 2 12 18 0 3 0 3 0 3 0 2 2 4 I 3 1 3 7 4 3 2 1 148 3 P IPI PI Table 3 I 3.4 4 Table 4 1km 8 1km - 10km 4 10km 30km 2 30km 0 1km 8 1km - 10km 4 10km 30km 2 30km 0 4 0 4 0 4 2 0 90% 8 60 90% 4 30 60% 2 30% 0 90% 8 60 90% 4 30 60% 2 30% 0 90% 8 60 90% 4 30 60% 2 30% 0 90% 8 60 90% 4 30 60% 2 30% 0 90% 8 60 90% 4 2 2 4
JDR 2012.5.11 30 60% 2 30% 0 90% 8 60 90% 4 30 60% 2 30% 0 3.5 5 Table 5 3 16 8 4 0 8 4 0 3 16 8 4 0 3 16 8 4 0 3 16 8 4 0 3 16 8 4 0 3 16 8 4 0 3 16 8 4 0 3 16 8 4 0 16 8 4 0 4. 4.1 5
JDR 2012.5.11 6 3 Table 6 3 2 A B N C N D A B C D E F 4 3 2 1 4.2 7 3 Table 7 3 2 A B N C 4 100% 3 2 1 4.3 8V I Y 8 NCA 3A N Table 8 6
JDR 2012.5.11 V I Y VIY A B N C N D A B 3 2 2 12 4 2 3 24 3 1 3 9 2 3 2 12 2 1 1 2 5. 5.1 9 AMD SEMI Semiconductor Equipment and Materials International20033 [1] Table 9 1 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 1/2 1/4 20. 2 4 10 2 21. 22. 23. IT 7
JDR 2012.5.11 24. 25. 26. 27. 28. 29. 3 30. 1 31. 3 32. 33. 34. 35. 36. 37. IT 3: 2: 1: 0: Table 10 1. 2. 3. BOM Bill of Materials 4. 5. 6. 7. 8. 9. 10. 11. 5.2 10 12. 13. 14. 15. 16. 8
JDR 2012.5.11 17. 18. 5. 1 3 2 2 1 0 3 6. 2 1 3: 0 2: 3 1: 0: 7. 2 1 0 6. 6.2 121981 Table 12 1981 10 1981 0 6.1 11 1-4 6 5-9 4 10-14 2 15 0 4 8 Table 11 1. 2. 3. 4. 100m 3 50m 100m 2 10m - 50m 1 10m 0 30% 3 10% -30% 2 5% - 10% 1 5% 0 50% 3 50% - 70% 2 70% - 90% 1 90% 0 3 2 1 0 3 6 2 4 1 2 0 10 5 0 2 1 0 2 1 0 2 1 0 6.3 9
JDR 2012.5.11 3 P IPI PI 13 IT Table 13 3 P I PI 6.4 ICT 14 Table 14 IT 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. DVD 2 11. 12. 2 13. 2 10
JDR 2012.5.11 14. 15. 3: 2: 1: 0: BCMS ISO22301 ISO ISO9001 ISO ISO14001 ISMS ISO27001 3 2 15IT IT IT Table 15 IT 1. IT 2. RPO 3. IT RPO 4. RTO 5. IT RTO 3 2:10 3 20 3 2 0 3 20 3 2 0 6.5 PDCA PDCA 16 ISO22001ISO50001 Table 16 1 0 7. 4 11
JDR 2012.5.11 PDCA Acknowledgements Resilience Research Council of Japan20124 NKSJ NKSJ IS www.resilience-japan.org References: [1] Business Continuity Guideline for the Semiconductor Industry and its Supply Chain SEMI, March 2003 [1] National Key Resources Pandemic Influenza Preparedness, response, and Recovery Guide for Critical Infrastructure and Key Resources U.S. Department of Homeland Security, September, 2006 BCP.com20111 201216 12