Microsoft Word - ★(5861) 300_C
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1 No. : 汎用 取扱説明書 INSTRUCTION MANUAL 5861 Series 0.35mm Pitch Board-to-Board Connector C DCN /06/29 K. Shiobara K. Yamane B DCN /01/26 K. Shiobara H. Watanabe A. Tsunemura O EDN /10/27 K. Hirata K. Yamane No. EDN/DCN DATE PREPARED by CHECKED by APPROVED by
2 目次 TABLE OF CONTENTS 1. 概要 OUTLINE 2 2. 部品名称および型番 PART NAMES AND MODEL NUMBERS 部品名称 PART NAMES 型番 MODEL NUMBERS 3 3. 取り扱い上の注意 PRECAUTIONS IN HANDLING 基板対基板嵌合での使用について USING FOR BOARD-TO-BOARD CONNECTION 基板対 FPC 嵌合での使用について USING FOR BOARD-TO-FPC CONNECTION 実装について MOUNTING 嵌合について ENGAGEMENT 洗浄について CLEANSING プリント基板およびメタルマスク開口部推奨寸法について PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK 推奨吸着ノズル寸法について RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE PAGE 1/14
3 1. 概要 OUTLINE 本製品 5861 シリーズコネクターは 市場における高密度実装化に対応すべく開発された 0.35mm ピッチの ボードツーボードコネクターです Series 5861 connector is a board-to-board connector with 0.35mm pitch designed to miniaturize outer dimension for high-density mounting. 2. 部品名称および型番 PART NAMES AND MODEL NUMBERS 2-1. 部品名称 PART NAMES (1) プラグ Plug インシュレータ Insulator アンカープレート Anchor Plate コンタクトコンタクト Contact Contact (2) リセプタクル Receptacle インシュレータ Insulator アンカープレート Anchor Plate コンタクト Contact PAGE 2/14
4 2-2. 型番 MODEL NUMBERS (1) プラグ Plug Plug : XXX : Plug シリーズ番号 Series Number 極数 Number of Pos. バリエーション Variation めっきコード Plating Code 鉛フリー Lead Free (2) リセプタクル Receptacle Rec. : XXX : Rec. シリーズ番号 Series Number 極数 Number of Pos. バリエーション Variation めっきコード Plating Code 鉛フリー Lead Free PAGE 3/14
5 3. 取り扱い上の注意 PRECAUTIONS IN HANDLING 3-1. 基板対基板嵌合での使用について USING FOR BOARD-TO-BOARD CONNECTION (1) 基板同士をネジ止めして固定する際は コネクターをねじらないようにご注意下さい 基板やネジ穴等のバラつきにより コネクターがねじられた状態で固定される恐れがあります When the printed circuit boards on which connectors are mounted were fixed by using screw, the mated connector could be twisted due to variations in dimensions of such as screw holes. So great attention should be given not to twist connectors when fixing the boards. 基板 PCB ネジ Screw (2) コネクターが基板に対してセンターに実装されない場合 もしくは大きい基板同士の嵌合の場合に嵌合が傾く恐れがありますので 下図のような傾き防止用のスペーサーおよび嵌合方向への押さえによる固定をお勧めします When connectors are mounted off-center of the printed circuit board, or when the printed circuit boards to be connected are rather large, mating may tilt. In order to avoid tilting, it is recommended that the printed circuit boards are fixed by the spacer and something that generates a force to retain the proper mated condition. 押さえ Retaining Force スペーサー Spacer PAGE 4/14
6 3-2. 基板対 FPC 嵌合での使用について USING FOR BOARD-TO-FPC CONNECTION (1) コネクタを挿抜する際 製品に直接負荷がかからないように FPC の裏面に補強板を貼り付けた状態での使用をお願い致します 補強板仕様に関しましては 弊社製品外形より大きいものを使用し 板厚については実践による確認をお願い致します Please make sure to attach reinforcing board to FPC s back,so that it will relieve the product from the stress caused by connector insertion /extraction. Such reinforcing board should be bigger than our product,and its suitable thickness should be decided through actual test. コネクタ connector pattern supporting (2) 落下 衝撃や FPC 取り回しの際の反力が大きく加わることが懸念される場合はコネクタの嵌合方向への押さえによる固定をお勧め致します When such possibility as the product may fall,receive any impact or reaction force from being thrashed is expected,and then it is recommended to fix them in the direction of engagement PAGE 5/14
7 3-3. 実装について MOUNTING (1) 実装の際には 接触部及びテール部に不要な外力が加わり 変形等が生じないようにご注意下さい Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tails. (2) 自動実装の際には 弊社推奨パターン図でのクリームはんだ印刷および実装をお願いします ( プリント基板寸法の詳細につきましては 弊社製品図面をご参照下さい ) When the connectors are automatically mounted, please apply cream soldering printing in the process in accordance with the pattern chart of our recommendation. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) (3) クリームはんだ印刷時のスクリーン厚さは 0.10mm~0.12mm をお勧め致します 0.10mm~0.12mm is recommended for the thickness of screen of the cream solder printing. (4) 実装条件が弊社推奨リフロー温度プロファイル条件と異なる場合は あらかじめ実装後にコネクタの変形 変色が無いことをご確認の上 実装を行って下さい When the mounting condition differs from those of our profile in any way,please make sure that you do not observe any deformity nor color change with the mounted connector before the mounted PCB is installed in the unit. (5) N 2 実装を行う場合は 事前に実践による確認をお願い致します If you need to mount on the N 2 reflow condition, please make sure to conduct the reflow test in advance. (6) 手付けはんだの際には テール部及び基板へのフラックス塗布はしないで下さい コネクタ内部 接触部へのフラックス上がり 飛散の原因となり 接触不良等の不具合が発生する場合があります また はんだごてで端子に負荷をかけて はんだ付けを行わないで下さい テール部変形 及び インシュレータ溶け等の恐れがあります Please do not apply flux onto the tail and PC board, when it is soldered manually. Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact. Also avoid giving any stress to the product with the soldering iron. It could deform tail or melt insulator. はんだごて Soldering iron PAGE 6/14
8 (7) PLUG 側は接点が外側に露出している為 実装の際はフラックスの飛散にご注意願います In the mounting process,special care is needed so that the exposed contact points on the plug side will be free from splattered flux. 接触部 Contact area PAGE 7/14
9 3-4. 嵌合について ENGAGEMENT (1) コネクタの接触部に触れたり 異物を入れたりしないで下さい バネの変形等の恐れがあります If something touches the contact points or with some foreign object, the spring could be deformed. (2) 過度なこじり挿抜やねじり挿抜はしないで下さい 本製品は小型化, 軽量化のために成形品の肉厚を薄くしているため 成形品の破壊, 端子の変形, テール部はんだ剥離の原因となります We minimized the thickness of this product to achieve downsizing and light weightiness. Because of this, uneven pressure or distorted attachment at engagement/disengagement could cause destruction, terminal deformity, plating detachment on the tail. こじり Uneven Pressure ねじり Distorted Attachment 基板 FPC uneven pressure distorted attachment 万が一こじり抜去を行う必要がある場合は 長手方向に行って下さい 但し 長手方向への作業は こじる側の実装基板 FPC 厚みにより コネクタが山反り方向に変形 または 破損する場合があります 事前にご確認の上 作業を行って下さい If it is required to unmate connectors with uneven pressure, apply such pressure to the long side of the connector. Applying the uneven pressure to the long side of the connector may cause doomed warpage or destruction on the connector depending on the PCB/FPC thickness. Please make sure beforehand when you apply the uneven pressure to the long side of the connector. 長手方向 ( ) 短手方向 ( ) PAGE 8/14
10 (3) 本製品はコネクタのみでの基板保持は出来ません 押さえが無い場合 嵌合のはずれ テールはんだ剥離 接触不安定が懸念されます スペーサーなどをご使用頂き ねじ止めなどの嵌合固定が必要です The connector is impossible to support the PCB by itself. Without other supporting objects, imperfect mating, peeling of tails or contacting failure may be caused. As supporting objects, use spacers fixed by screws. NG OK PAGE 9/14
11 3-5. 洗浄について CLEANSING 貴社工程におきまして 洗浄を実施する場合は 下記条件での洗浄を推奨致します Following cleansing condition should be recommended in case the cleansing is done in your production process. < 耐溶剤性試験条件 > 洗浄剤 : パインアルファ ST-100S ( 荒川化学社製 ) 成分 : ポリエチレングリコール ( アルキルエーテル溶剤 ) 含有比率 80% : ノンイオン系界面活性剤含有比率 15% : 純水含有比率 05% < 洗浄工程および条件 > 工程洗浄すすぎ 水切り 乾燥 乾燥 方式温液超音波揺動超音波揺動エアーナイフ温風リフロー 仕様洗剤使用液剤 パインアルファ ST-100S イソプピルアルコール工場エアー 温度 60 常温常温 85 時間 60 秒間 120 秒間 60 秒間 10 分間 <Test Condition for Resistance to Solvent> Solvent : PINE ALPHA ST-100S (ARAKAWA CHEMICAL INDUSTRIES, LTD.) Content : POLYETHYLENE-GLYCOL (solvent classified as ALKYL-ETHER) Content Ratio 80% : NON-ION SYSTEM SURFACE-ACTIVE AGENT Content Ratio 15% : PURE WATER Content Ratio 05% <Cleansing Process and Condition> Process Cleansing Washing Wiping Drying Drying System Up and Down Movement in Hot Liquid with Ultrasonic Wave Up and Down Movement with Ultrasonic Wave Air Knife Warm Blow Detergent Liquid Medicine PINE ALPHA ST-100S Isopropyl Alcohol Industrial Air Temperature 60 Normal Temperature Normal Temperature 85 Time 60 Seconds 120 Seconds 60 Seconds 10 Minutes PAGE 10/14
12 3-6. プリント基板およびメタルマスク開口部推奨寸法について PCB AND RECOMMENDED DIMENSIONS OF THE OPENING AREA IN THE METAL MASK 本コネクタは ピッチ間隔が 0.35mm であり 高密度実装が要求されるコネクターとなっております 高密度実装が要求されるコネクターに関しては 半田ブリッジによるショート等の実装不具合を減らすために適正なはんだ量の管理が必要となります つきましては 添付推奨寸法図をご参考願います ( プリント基板寸法の詳細につきましては 弊社製品図面をご参照下さい ) 特に PLUG 保持金具部の半田量が多い場合は REC. ソケットと干渉し 不完全嵌合の原因となりますので注意下さい プリント基板およびメタルマスク開口部寸法は推奨ですので 不明点や懸念点等がございましたら ご相談頂けますようにお願いします This series of connector is required to be mounted in the high density due to its 0.35mm pitches. The connectors mounted in the high density need to be controlled adequate amount of solder in order to prevent failures in the mounting process such as short-circuit caused by solder bridge. For the dimensions of the metal mask opening, therefore, please refer to our recommended dimensions shown in the attached drawing. (For detailed dimensions of the printed circuit board, please refer to our product drawings.) If excessive solder is applied on the retaining metal of the plug connector, especially, it interferes with the receptacle connector, which leads to incomplete mate of the connectors. As dimensions shown in the drawings are our recommendations. Please feel free to contact us if you have any questions and/or concerns about these dimensions PAGE 11/14
13 5861 Series: 0.35 mm Pitch Recommended Pad & Stencil size (SIGNAL CONTACT) PLUG REC. Pad 0.18mm(7.1mil) 0.55mm (21.7mil) 0.18mm(7.1mil) 0.38mm (14.9mil) Stencil t=0.12mm (4.7mil) 0.18mm(7.1mil) 0.18mm(7.1mil) 0.35mm (14.0mil) 0.32mm (12.6mil) Stencil t=0.1mm (3.9mil) 0.18mm(7.1mil) 0.39mm (15.3mil) 0.18mm(7.1mil) 0.38mm (14.9mil) PAGE 12/14
14 5861 Series : 0.35 mm Pitch Recommended Pad & Stencil size (ANCHOR PLATE) PLUG REC.(SPAN) REC.(PITCH) Pad 0.4mm (15.7mil) 0.3mm (11.8mil) 0.35m (13.8mil) 0.3mm (11.8mil) 0.35mm (13.8mil) 0.2mm (7.87mil) 0.8mm (31.5mil) 1.0mm (39.8mil) Stencil t=0.12mm (4.7mil) 0.28mm (11.0mil) 0.315mm (12.4mil) 0.21mm (8.3mil) 0.18mm (7.09mil) 0.35mm (13.8mil) 0.8mm (31.5mil) 0.3mm (11.8mil) 1.0mm (39.8mil) 0.4mm(15.8mil) Stencil t=0.1mm 0.34mm (13.4mil) 0.25mm (11.8mil) 0.35mm (13.8mil) 0.3mm (11.8mil) (3.9mil) 0.35mm (13.8mil) 0.2mm (7.87mil) 0.8m (31.5mil) 1.2mm (47.2mil) REC. MOUNTING LAYOUT SIGNAL PITCH PAGE 13/14
15 3-7. 推奨吸着ノズル寸法について RECOMMENDED DIMENSIONS OF THE PICK-UP NOZZLE 推奨吸着ノズル寸法は以下の通りです The following is the recommended dimensions of the pick-up nozzle. コネクタが基板上に有る際の最大加圧荷重 : 20N Maximum pressure when the connector is placed on a PCB: 20N PAGE 14/14
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