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1 お客様各位文書管理番号 :RC NT064 平成 24 年 5 月 25 日株式会社 PALTEK QRAグループ西塔浩一 PEX 8649/8648/47/32/24/16/12パッケージ基板変更のご案内拝啓平素は格別のお引立てを賜り厚く御礼申し上げますさて PLX Technology 社より仕様変更について案内文が届きましたので下記に要点を報告致しますご査収の上何卒宜しくお取り計らい下さるようお願い申し上げます敬具記対象製品 PLX Technology 社発行 PRODUCT/PROCESS CHANGE NOTIFICATION (PCN:2012-1) をご参照ください変更内容 PLX Technology 社 PEX 8649/8648/47/32/24/16/12のSerDesモジュールは内部バイアス電流およびインピーダンス校正回路用として1.43kΩ±1%の精度の外部抵抗 (REXT)のご使用を要求しておりますこの変更により REXTノイズ問題によって影響を受けたお客様に関しても外部抵抗 (REXT)これ以上接続頂く必要がなくなりますまたこのパッケージ基板の変更は現在使用されているパッケージ基板との互換性がありお客様の基板上にてREXTノイズに関する対策を実施しているいないに関わらずご使用頂くことが可能です尚この改良はPCB 上ではなくパッケージ基板内でREXT_BピンをGNDと接続する変更のマイナーチェンジとなります (PCN2012-1の3ページ目の package fix を参照下さい ) 完全互換性がございますので既存のお客様 PCB 設計を修正する必要はございません詳細はPLX Technology 社発行 PRODUCT/PROCESS CHANGE NOTIFICATION (PCN:2012-1) をご参照ください実施日 2012 年 8 月 16 日以降の生産分より実施予定添付資料 PLX Technology 社発行 PRODUCT/PROCESS CHANGE NOTIFICATION (PCN:2012-1) PLX Technology 社発行 Package Reliability Qualification Report (Plan) 連絡先この件につきご質問がございましたら弊社営業担当までご連絡くださいますようお願い申し上げます株式会社 PALTEK 神奈川県横浜市港北区新横浜 Tel: Fax: /2

ください変更内容 PLX Technology 社 PEX 8649/8648/47/32/24/16/12のSerDesモジュールは内部バイアス電流およびインピーダンス校正回路用として1.

2 以上注意 :PLX Technology 社発行の英文報告書が正式報告書となっております本和文報告書とPLX Technology 社発行の英文報告書との間に差違が生じた場合はPLX Technology 社発行の英文報告書を優先願います株式会社 PALTEK 神奈川県横浜市港北区新横浜 Tel: Fax: /2

社発行の英文報告書を優先願います株式会社 PALTEK 222-0033 神奈川県横浜市港北区

3 May 18, 2012 Subject: Changing REXT substrate grounding for PEX 8649/8648/47/32/24/16/12 products Reference: PCN# Dear Valued Customer: Please reference the attached Product Change Notification (PCN# ) which addresses the following: REXT substrate grounding change Background: The SerDes modules require external resistors (REXT) 1.43K ± 1% as reference for internal bias current and impedance calibration circuitry. Customers impacted by the REXT noise issue no longer need to externally modify the REXT connection. The substrate modification is backwards compatible with existing designs, with or without, the REXT PCB noise modification. The specific details, associated qualification plan and implementation schedule are included in the PCN. The planned implementation dates for this 90 day notification is August 16, 2012 or unless an approval is granted by the customer for earlier advance release. Should you have any questions, please feel free to contact your local representative directly. Sincerely, Eugene Cabanban Product Marketing PLX Technology 870 Maude Avenue Sunnyvale, CA NDA CONFIDENTIAL -- PALTEK Kazumasa Sumi 1065-FRM _Product_Process_Change_Notification _Rev 1.0

43K ± 1% as reference for internal bias current and impedance calibration circuitry. Customers impacted by the REXT noise issue no longer need to externally modify the REXT connection.

4 PRODUCT/PROCESS CHANGE NOTIFICATION (PCN) PCN # Date: 5/18/2012 Products Affected: FROM: Current P/N TO: New P/N PEX 8649-AA50BC F PEX 8649-AA50RBC F PEX 8648-BB50BC F PEX 8648-BB50RBC F PEX 8647-BB50BC F PEX 8647-BB50RBC F PEX 8632-BB50BC F PEX 8632-BB50RBC F PEX 8624-BB50BC F PEX 8624-BB50RBC F PEX 8616-BB50BC F PEX 8616-BB50RBC F PEX 8612-BB50BC F PEX 8612-BB50RBC F MEANS OF DISTINGUISHING CHANGED DEVICES New Part Number- Adding an R to the part number to represent REXT change. Assembly Location Affected: ASE Kaohsiung, Taiwan Date Effective: August 16, 2012 Note: This PCN will also include the ULA (Ultra Low Alpha) materials previously announced under ION # and embedded herein as reference. PLX_ION_2012-1_Info _Only_Notice_PEX8648_Family.pdf Contact: Eugene Cabanban Title Product Manager Phone: eugenec@plxtech.com NDA CONFIDENTIAL -- PALTEK Kazumasa Sumi 1065-FRM _Product_Process_Change_Notification _Rev 1.0

DISTINGUISHING CHANGED DEVICES New Part Number- Adding an R to the part number to represent REXT change.

DESCRIPTION AND PURPOSE OF CHANGE: The SerDes modules require external resistors (REXT) 1.43K ± 1% as reference for internal bias current and impedance calibration circuitry.

5 DESCRIPTION AND PURPOSE OF CHANGE: The SerDes modules require external resistors (REXT) 1.43K ± 1% as reference for internal bias current and impedance calibration circuitry. Customers impacted (very small %) by the REXT noise issue no longer need to externally modify the REXT connection. PLX is introducing a product improvement by implementing a device package substrate modification that is backwards compatible with existing designs, with or without, the REXT PCB noise modification. This PLX device package improvement is a minor change accomplished by simply grounding the REXT_B pin to the device s own package substrate rather than the customer s PCB (See illustration below, ref. package fix ). As indicated below, there are no modifications required for existing customer PCB designs. The change represents a drop in, fully compatible device package. NDA CONFIDENTIAL -- PALTEK Kazumasa Sumi 1065-FRM _Product_Process_Change_Notification _Rev 1.0

PLX is introducing a product improvement by implementing a device package substrate modification that is backwards compatible with existing designs, with or without, the REXT PCB noise modification.

6 RELIABILITY/QUALIFICATION SUMMARY: ASE Kaohsiung s HFCBGA package technologies were qualified previously by PLX with the PEX8648-BB50BC F in a 27 x 27mm, 676 HFCBGA package as the package family vehicle. A mini-package qualification will be conducted to validate the minor package related improvement (REXT_B substrate ground) made to the PEX8649-AA50BC F and the PEX8648-BB50BC F product device family. Please see below for the qualification plan. PEX8648-BBR50BC F_REXT_Package_Rel_Qual_Plan_Rev0.pdf CUSTOMER ACKNOWLEDGEMENT OF RECEIPT (optional): Please the acknowledgement below to PLX QA & R at or qa@plxtech.com or request additional information. Please note: This notice is intended to serve as a quality notification to our valued customers and is a part of our continuous quality improvement effort. This notice does solicit our customer s approval. If PLX does not receive acknowledgement within 30 days of this notice, it will be assumed that this change is acceptable. Customer: Name/Date: Address: Title: / Phone# : Customer Comments: REC D. BY: DATE: NDA CONFIDENTIAL -- PALTEK Kazumasa Sumi 1065-FRM _Product_Process_Change_Notification _Rev 1.0

A mini-package qualification will be conducted to validate the minor package related improvement (REXT_B substrate ground) made to the PEX8649-AA50BC F and the PEX8648-BB50BC F product device family.

7 Package Reliability Qualification Plan Revision 0 Family Qualification: PEX8649-AA50RBC F PEX8648-BB50RBC F PEX8647-BB50RBC F PEX8632-BB50RBC F PEX8624-BB50RBC F PEX8616-BB50RBC F PEX8612-BB50RBC F May 16, 2012 Prepared and Reviewed By: Thomas Huang Quality & Reliability Engineer Approved By: Brete Bigley Director, Quality Assurance & Reliability PLX Technology 870 W. Maude Ave. Sunnyvale, CA

PEX8612-BB50RBC F May 16, 2012 Prepared and Reviewed By: Thomas Huang Quality & Reliability Engineer

8 1. Purpose: The purpose of this qualification is to validate the minor package related improvement made to the PEX8649 AA50BC F and the PEX8648 BB50BC F product device family fabricated in TSMC s 90 nm low K, 1Poly/9 Metal CMOS Technology and assembled at ASE Kaohsiung, Taiwan (ASEK) in a 27 x HFCBGA package. The package improvement includes the following: Additional REXT grounding in substrate to improve Serdes noise margin. This document summarizes the qualification plan per below. As a result of this minor substrate grounding change, the part numbers in the family of products qualified will change by adding an R (R= REXT) to each affected part number (See Page 1, cover page). 2. Scope: The PEX8648 BBR50BC F is fabricated in TSMC 90 nm Low K process technology and is assembled at ASEK in a 27 x 27mm 676 HFCBGA package. The PEX8648 BBR50BC F will be used as the reliability qualification vehicle for the affected products. Both process and package technologies that are used to manufacture this product were qualified previously by PLX with PEX8648 BB50BC. Additional package tests serve to validate the package improvement. The product family includes the following devices: PEX8649/48/47/32 BBR50BC F (676 HFCBGA 27x27mm) PEX8624/16/12 BBR50BC F (324 HFCBGA 19x19mm) Note that the ULA (Ultra Low Alpha) materials previously announced under ION # and qualified, will also be utilized and included in this qualification. See the embedded file for this notice below for your reference. PLX_ION_2012-1_Info _Only_Notice_PEX Background Information: 3.1 Wafer Fab Information Process Type CMOS Logic Process Name 90 nm low K Number of Metal layers 9 PLX Technology 870 W. Maude Ave. Sunnyvale, CA

The package improvement includes the following: Additional REXT grounding in substrate to improve Serdes noise margin. This document summarizes the qualification plan per below.

9 3.2 Assembly Process Information BOM 1 Package name: HFCBGA 2 Package Size: 27 X 27 mm 3 Solder Ball Diameter: 0.6 mm 4 Solder Ball Pitch: 1mm 5 # of solder balls: Solder Ball Composition: SAC305 (96.5Sn/3Ag/0.5Cu) 7 Solder Bump for Die (exemption 15): 63Sn/37Pb 4. Qualification Plan and Results: 4.1. Die Qualification TSMC 90nm Low K CMOS technology generates consistent and reproducible performance from lot to lot, through a mature fabrication process, in process monitors, and excellent reliability TSMC 90 nm low K, 1Poly/9 Metal CMOS Technology Process Qualification Report; Test Vehicle: PEX8648 BB50BC F. PEX8648-BB_Reliabili ty_qualification_rev2 5. Package Qualification Plan and Results ASEK s HFCBGA package technologies were qualified previously by PLX with PEX8648 BBR50BC F in 27 x 27mm 676 HFCBGA package. The full qualification report is embedded in section above. 5.1 Pre condition Level 4 (JESD A113 E), 96 hrs. 30 C/60 %RH Date Sample No. of Lot # Test Results Notes Code Size Rejects TBD TBD 45 TBD TBD Conditional / Full Pre-condition TBD TBD 45 TBD TBD Qualification, Completion Level4 TBD TBD 45 TBD TBD Date: Target July 2012 PLX Technology 870 W. Maude Ave. Sunnyvale, CA

m 5 # of solder balls: 676 6 Solder Ball Composition: SAC305 (96.5Sn/3Ag/0.5Cu) 7 Solder Bump for Die (exemption 15

10 5.2 Temperature Cycle Test (JESD22 A104B, Condition C), 65 C to 150 C for 1000 Cycles (After preconditioning from 5.1) Lot # Date Sample No. of Cycles Code Size Rejects Results Notes TBD TBD 45 TBD TBD Conditional Qualification, TBD TBD cycles Cum* TBD TBD Completion Date: Target TBD TBD 45 TBD TBD July 2012 TBD TBD 45 TBD TBD TBD TBD cycles Cum* TBD TBD TBD TBD 45 TBD TBD TBD TBD 45 TBD TBD Full Qualification, 1000 cycles Cum TBD TBD 45 TBD TBD Completion Date: Target ** TBD TBD 45 TBD TBD August Ball Shear Post 1000 Cycles Temperature Cycles Test. Lot # Date Code Sample Size Specification (Kg) Maximum (Kg) Minimum (Kg) Average (Kg) Std. Result TBD TBD 2 (10 balls per device) 0.5 TBD TBD TBD TBD TBD TBD TBD 2 (10 balls per device) 0.5 TBD TBD TBD TBD TBD 6.0 CONCLUSION This reliability qualification plan applies to the PEX8649 AA and PEX8648 family of products in revision BB silicon with a minor package improvement, all of which are manufactured with the same process technology (90nm), package type, and materials. The PEX8648 BBR50BC F device is utilized as the validation vehicle for the complete family of products listed as: PLX Technology 870 W. Maude Ave. Sunnyvale, CA

TBD 45 500 cycles Cum* TBD TBD TBD TBD 45 TBD TBD TBD TBD 45 TBD TBD Full Qualification, 1000 cycles Cum TBD TBD 45 TBD TBD Completion Date: Target ** TBD TBD 45 TBD TBD August 2012 5.

11 PEX8649/48/47/32 BBR50BC F (676 HFCBGA 27x27mm) PEX8624/16/12 BBR50BC F (324 HFCBGA 19x19mm) The qualification report with the test results will be made available upon completion. 7.0 REVISION HISTORY Revision Date Originator Comments Rev. 0 05/16/12 Thomas Huang Initial Product Reliability Qualification Plan PLX Technology 870 W. Maude Ave. Sunnyvale, CA

0 REVISION HISTORY Revision Date Originator Comments Rev.

Final Product/Process Change Notification Document # : FPCN22236X Issue Date: 2 October 2018 Datasheet change: The original datasheet will be left act

Final Product/Process Change Notification Document # : FPCN22236X Issue Date: 2 October 2018 Title of Change: Proposed first ship date: Former Fairchild TinyLogic US8 Die and Back End Material Change and