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- せぴあ すみだ
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1 WG11 WG11 WECCWG ) WG NECEL) NECEL SEAJ/ SEAJ/ 1
2 ITRS (YMDB) --- MetLER/LWR LithoPIDS YEWG11WECCWG YEYMDB WWDefect Budget Survey Met /YE ITRSDifficult Challenge YMDB: Yield Model & Defect Budget WECC: Wafer Environmental Contamination Control 2
3 WECC cleanroom/upw/chemicals/gas CF Gas UPW 3
4 WECC cleanroom/upw/chemicals/gas 4
5 ITRS YE-TWG WECC sub-wg Air Products Intel Intel, IBM, Texas Instruments, Motorola, Infineon, Sematech, Air Liquide, Arch, Chemtrace, Air Products, Metara, Balazs, MW Zander, etc
6 ITRS Assy&Pkg FEP Litho PIDS Design Factory Integration M&S Test ESH Interconnect Metrology YE WECC 6
7 7
8 8
9 1. TBD 2. FEP Cu/SiCu 3. UPWMS) 4. H2N2ppbppb H2O2pptppt 9
10 TBD TBD 10
11 FEP Cu/SiCu FEP WECC ~10 7 atoms/cm 2 (ppt) FEPWECC 11
12 UPWMS) Year of Production Technology node hp90 hp65 Dissolved Nitrogen (ppm) mega-sonic WECC 12
13 H 2 O 2 5pptppt H 2 N 2 50ppbppb 13
14 14
15 15
16 16
17 17
18 CVD Ru CVD 18
19 19
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WG 2013 P P P P WG WG P WG 12 12 P P20 200 200 200 200 2011 2012 2012 11 1 2 21 2 2 1 2 2 2 2 1 2 1 2 11 720,450(8.0) 37,845(0.4) 4) 37.7 7 5.4 0.1 8,299,154(91.6)
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SoC -SWG ATE -SWG 2004 2005 1 SEAJ 2 VLSI 3 How can we improve manageability of the divergence between validation and manufacturing equipment? What is the cost and capability optimal SOC test approach?
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b 0 1PPm 10PPm 100PPm 1000PPm 10000PPm 0.0001% 0.001% 0.01% 0.1% 1% 10% 1PPm 10PPm 100PPm 1000PPm 10000PPm 0.0001% 0.001% 0.01% 0.1% 1% 10% 1PPm 10PPm 100PPm 1000PPm 10000PPm 0.0001% 0.001% 0.01%
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ITRS2005 DFM STRJ : () 1 ITRS STRJ ITRS2005DFM STRJ DFM ITRS: International Technology Roadmap for Semiconductors STRJ: Semiconductor Technology Roadmap committee of Japan 2 ITRS STRJ 1990 1998 2000 2005
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