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あいりいざわ
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1 We have been supplying lead-free solders to prevent contamination of the environment. Dross Generated Offered by Nihon Superior Lead-Free Solders Patented in 10 countries Under Patent Applied for 23 countrie

2 Properties of Recommended Lead-Free Solders Compared with Sn63Pb37solder Recommended Soldering Temperature

Bridge-Free Wave Soldering with SN100C Experience in commercial

Sn-Cu+Ni alloy, with the complementary top-up alloy SN100Ce

The patented Ni addition improves the wetting and flow of the

drainage of excess solder from the board.

silver-containing alloys and joints are smoother and brighter.

better because of higher electrical conductivity. Peak temp.

3 Bridge-Free Wave Soldering with SN100C Experience in commercial mass production over nearly six years has confirmed that SN100C Sn-Cu+Ni alloy, with the complementary top-up alloy SN100Ce reliably provides bridge-free soldering. The patented Ni addition improves the wetting and flow of the alloy facilitating through-hole penetration, fillet formation and drainage of excess solder from the board. Performance is at least comparable with that of more expensive silver-containing alloys and joints are smoother and brighter. It has even been reported that the sound quality audio system is better because of higher electrical conductivity. Peak temp (total time s) Wave soldering with SN100C QFP100 pins 0.65mm pitch Cooling property is important Less Copper Erosion with SN100C

Hot Air Solder LevelingHASL SN100CL SN100CL provides a smooth bright finish and clear through holes at coating temperatures of 265.

8mm pitch pads Smooth uniform coating on pads and hole walls Uniform coating on pads and hole walls, even on the shoulder Anode for ElectroplatingButton, Tip, Plate SN100CP SN100CP, available as

For High Temperature Dip Soldering and Tinning SN100C3SN100C4 When high solder temperaturses to burn insulating enamels off copper wire erosion of the copper wire can be a problem.

Brass connector pins electroplated with SN100CP the average of failure of copper wire. (sec.) alloy code at 4004 0.29mm diameter 0.44mm diameter!

If the copper content of the SN100C in the solder bath exceeds 0.85% there is likely to be an increase in the incidence of bridges, icicles and other defects.

4 Hot Air Solder LevelingHASL SN100CL SN100CL provides a smooth bright finish and clear through holes at coating temperatures of 265. The SN100CL HASL process can provide the electronics industry with lead-free boards with a solderable shelf life of over a year. Bridge-free coating on 0.8mm pitch pads Smooth uniform coating on pads and hole walls Uniform coating on pads and hole walls, even on the shoulder Anode for ElectroplatingButton, Tip, Plate SN100CP SN100CP, available as ball, button, bar and plate anodes provides excellent performance in panel or reel-to-reel Sn-Cu plating systems providing high anode efficiency and generating very little sludge. For High Temperature Dip Soldering and Tinning SN100C3SN100C4 When high solder temperaturses to burn insulating enamels off copper wire erosion of the copper wire can be a problem. The higher copper contents of SN100C3 and SN100C4 make it possible to carry out dip soldering with minimum copper erosion at temperature up to 400. Brass connector pins electroplated with SN100CP the average of failure of copper wire. (sec.) alloy code at mm diameter 0.44mm diameter! Managing the Copper Content of the SN100C Wave Soldering Bath As the SN100C solder bath is used copper is dissolved from boards and component leads. If the copper content of the SN100C in the solder bath exceeds 0.85% there is likely to be an increase in the incidence of bridges, icicles and other defects. Nihon Superior have devised a simple but effective method of keeping the copper content in the optimum range of %. To replace solder carried off on the soldered boards a top-up alloy with a lower copper content, SN100Ce is used. For replacing solder removed during the skimming of dross the standard SN100C alloy can be used. Nihon Superior provide solder bath analyses to ensure that the copper content is in the recommended range. Cu content Cu content Number of pcb soldered Cu content, when SN100C is used for top-up Number of pcb soldered Cu content, when SN100Ce is used for top-up

5mm pitch)qfp reflow soldered with SN96CI

to work in the Nihon Superior laboratory

5 Solder Paste for Reflow Soldering 100 Pin(0.5mm pitch)qfp reflow soldered with SN96CI The optimum reflow profile is to some extent dependent on the characteristics of the board and the capability of the reflow oven. The thermal profile below has been found to work in the Nihon Superior laboratory and could be used a starting point in optimizing the profile for a particular board and oven. Reflow Profile for SN96CI

6 Spreading test Both of NS-828B-ne and NS-824 are a robust, high activity flux with all the properties necessary to get reliable joints in lead-free soldering. S.G S.G SG vs Temperature Temp. SG vs Temperature Temp mm diameter(10m For best soldering use the compatible flux RM-5. RM-5 Flux for BGA/CSP

7 Note All statements, technical information and recommendations contained herein are based on the data or other information available to us that we believe to be reliable but the accuracy and completeness of which we can not guarantee. Descriptions including specifications are subject to change without prior notification for the purpose of improvement in quality, etc. Registered Trade Mark of Nihon Superior Co., Ltd. Overseas Affiliates NIHON SUPERIOR (SHANGHAI) CO., LTD. Bldg. B, No.1619 Wu Zhong Road, Minhang District, Shanghai , China Tel:+86-(0) Fax:+86-(0) NIHON SUPERIOR (TAIWAN) CO., LTD. 3A23, Taipei World Trade Center Building, No.5, Hsin-yi Rd., Sec.5, Taipei Taiwan, 110, R.O.C. Tel:+886-(0) Fax:+886-(0) Updated July 2004

錫-亜鉛-アルミニウム系鉛フリーはんだの実用化

錫-亜鉛-アルミニウム系鉛フリーはんだの実用化 - Practical Use of Lead-Free Tin-Zinc-Aluminum (Sn-Zn-Al) Solder - - - - - Abstract Fujitsu has implemented a company-wide effort to progressively reduce the use of lead and eventually eliminate this environmental