Vol. 19, No. 3 (2012) 207 Fig. 2 Procedures for minute wiring onto polyimide substrate. Fig. 3 Ink - jet printing apparatus as part of laser sintering

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206 : 316-8511 4-12 - 1 Laser Sintering Characteristics of Silver Nanoparticle Paste for Electronics Packaging YAMASAKI Kazuhiko, MAEKAWA Katsuhiro (Received January 10, 2012) Ibaraki University,

1 206 : Laser Sintering Characteristics of Silver Nanoparticle Paste for Electronics Packaging YAMASAKI Kazuhiko, MAEKAWA Katsuhiro (Received January 10, 2012) Ibaraki University, Faculty of Engineering, Department of Mechanical Engineering ( Nakanarusawa, Hitachi, Ibaraki , Japan) In terms of electronics packaging with conservation of resources and energy as well as low environmental damage, we investigated laser - sintering technology followed by printing of metal nanoparticles: especially, minute wiring and wire - bonding - pad formation using silver nanoparticles. A line width of 100 mm, a specific resistance of 4.8 µω cm, and pull wire - bond strength similar to that of electroplating were achieved. A bulk - like functional - film structure can be obtained by sintering to be started from the substrate using a continuous - wave, near - infrared laser beam with low - absorbance of the paste, together with preheating to reduce solvents in the paste. Key words : metal nanoparticles, laser sintering, patterning, thin film, wire bonding, electronics packaging 1. SiP SoC 1 a TEM 5 nm b NPS - J 10 mpa s 65 wt% 2.2 PITorey/DuPont Kapton500H mm Fig C 1 min X - Y 4 mm/s Fig. 1 Fig. 1 Ag - nanoparticle paste used in laser sintering.

4 W JIS C1220P 0.1 mm 0.3 mm Fig. 3 φ 300 μm 128 11 pl 1,200 dpi 100 C 1 min X - Y Nd : YAG 4 mm/s X - Y 3 l/min Ar Ar 3% Fig.

2 Vol. 19, No. 3 (2012) 207 Fig. 2 Procedures for minute wiring onto polyimide substrate. Fig. 3 Ink - jet printing apparatus as part of laser sintering. Fig. 4 Optical properties of Ag - nanoparticle paste. Nd : YAG 1,064 nm 0.4 mm 140 W 980 nm 50 W532 nm 5 W Ar 488 nm 1.4 W JIS C1220P 0.1 mm 0.3 mm Fig. 3 φ 300 μm pl 1,200 dpi 100 C 1 min X - Y Nd : YAG 4 mm/s X - Y 3 l/min Ar Ar 3% Fig. 4 20, nm 420 nm 100 C 1 min 70 % 220 C 60 min 2.3 FIB - SIM LSM FIB - SIM Ga 30 LSM PI R 2 mm/s 10 mm/s 4 φ 25 μm

7 4 FIB - SIM FIB - SIM 30 2 Fig. 6 Fig.

3 208 : 150 C 500 h 1,000 h 3. Fig. 5 4 PI PI 100 μm 500 μm Fig. 6 LD Ar 1,000 rpm 0.50 μm Fig. 7 Comparison of FIBed cross - sections of sintered Ag on polyimide. PI 4.8 μω cm 3 2 Ar 8.0 μω cm Fig. 7 4 FIB - SIM FIB - SIM 30 2 Fig. 6 Fig. 5 Comparison of laser - sintered Ag on polyimide after bend - peel test. Fig. 6 Comparison of specific electric resistance of laser - sintered Ag on polyimide μm 1 coffee stain Fig μm IJ

$3 (2012) 209 Table 1 Pull strength and fracture modes of laser - sintered pads before/after heat soak$ tests. Soak time at 150 C 0 h 500 h 1,000 h Fig.

Pull strength Fracture modes Average 9.2 cn 8.8 cn 8.8 cn Maximum 10.7 cn 10.7 cn 10.9 cn Minimum 7.

4 Vol. 19, No. 3 (2012) 209 Table 1 Pull strength and fracture modes of laser - sintered pads before/after heat soak tests. Soak time at 150 C 0 h 500 h 1,000 h Fig. 8 LSM image of surface profile of laser - sintered Ag pad with single - step printing. Pull strength Fracture modes Average 9.2 cn 8.8 cn 8.8 cn Maximum 10.7 cn 10.7 cn 10.9 cn Minimum 7.5 cn 7.8 cn 7.8 cn 1st bond Wire 100% 100% 100% 2nd bond Fig. 9 LSM images of surface profile of laser - sintered Ag pad on Cu lead tip. Fig. 11 Cross - sectional analysis of laser - sintered Ag pad at 150 C for 1000 h. Fig. 10 FIBed cross - sections of laser - sintered Ag pads on Cu lead tip. Nd : YAG 100 W 3 Fig. 9 Fig. 10 FIB SIM μm 8.6 cn C 0 h Table 1 0 h 8.6 cn 500 h 1,000 h 8.8 cn 1st 2nd EDX Fig. 11 1,000 h Ag/Cu Cu Ag/Au Fig. 5

210 : Fig. 13 TEM image at laser - sintered Ag/polyimide substrate interface. Fig. 12 Schematic of laser sintering process with different wavelengths or absorbance of light.

14 Ag/Cu X XPS Nd : YAG 133 W Fig. 14 Atomic percent profiles of cross - section of sintered - Ag/Cu interface.

5 210 : Fig. 13 TEM image at laser - sintered Ag/polyimide substrate interface. Fig. 12 Schematic of laser sintering process with different wavelengths or absorbance of light. Fig. 7 FIB - SIM Fig. 12 Fig. 4 Nd : YAG PI Fig. 12 a Ar Fig. 12 b 5.2 Fig. 13 Ag/PI TEM PI PI PI Fig. 14 Ag/Cu X XPS Nd : YAG 133 W Fig. 14 Atomic percent profiles of cross - section of sintered - Ag/Cu interface ms 500 C 600 C Ag/Cu 20 nm Ag Cu b 220 C 60 min Ag/Cu nm 2 μm 100 nm Fig wt%

Vol. 19, No. 3 (2012) 211 Fig. 15 SEM image of φ100 - nm - sized Ag particles. WB 2 3 μm 150 C 1,000 h Fig. 16 FIBed cross - sections of laser - sintered φ 100 - nm - particle paste.

2 Haynes, W.M. ed. : CRC Handbook of Chemistry and Physics 92 nd ed., CRC Press, 2011, 12-42. 3 Maekawa, K., Yamasaki, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N. and Saito, H.

6 Vol. 19, No. 3 (2012) 211 Fig. 15 SEM image of φ100 - nm - sized Ag particles. WB 2 3 μm 150 C 1,000 h Fig. 16 FIBed cross - sections of laser - sintered φ nm - particle paste. 88 W Nd : YAG Fig. 16 FIB - SIM 2 μm a b Ag/Cu Cr 100 nm 4 JST JST A - STEP M&M 1 Wong, W.S. and Salleo, A. eds : Flexible Electronics : Materials and Applications, Springer, New York, Haynes, W.M. ed. : CRC Handbook of Chemistry and Physics 92 nd ed., CRC Press, 2011, Maekawa, K., Yamasaki, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N. and Saito, H. : High - Speed Laser Plating for Wire - Bonding Pad Formation, Trans. The Japan Institute of Electronics Packaging, 3-1, 2010, Tsutsui, Y., Yamasaki, K., Maekawa, K., Niizeki, T., Bucheeri, A., Mita, M., Matsuba, Y., Terada, N. and Saito, H. : Size Effect of Ag Nanoparticles on Laser Sintering and Wire Bondability, Proc. ECTC 2010, 2010, nm

42 1 Fig. 2. Li 2 B 4 O 7 crystals with 3inches and 4inches in diameter. Fig. 4. Transmission curve of Li 2 B 4 O 7 crystal. Fig. 5. Refractive index

$42 1 Fig. 2. Li 2 B 4 O 7 crystals with 3inches and 4inches in diameter. Fig. 4. Transmission curve of Li 2 B 4 O 7 crystal. Fig. 5. Refractive index$ MEMOIRS OF SHONAN INSTITUTE OF TECHNOLOGY Vol. 42, No. 1, 2008 Li 2 B 4 O 7 (LBO) *, ** * ** ** Optical Scatterer and Crystal Growth Technology of LBO Single Crystal For Development with Optical Application