19-0807; Rev 0; 4/07 EVALUATION KIT AVAILABLE μ PART TEMP RANGE PIN- PACKAGE PKG CODE ETO+ -40 C to +85 C 42 TQFN-EP* T42359OM-1 * EYE DIAGRAM ( = 3.3V, f = 2.6GHz 600mV P-P PRBS SIGNAL+) * PRBS = PSUEDORANDOM BIT SEQUENCE UI = 606ps Maxim Integrated Products 1
ABSOLUTE MAXIMUM RATINGS (All voltages referenced to.)...-0.3v to +4V (Note 1)...-0.3V to ( + 0.3V) COM_, NC_, NO_...-0.3V to ( + 0.3V) Continuous Current Through Any Switch...±120mA Peak Current Through Any Switches (Pulsed at 1ms, 10% duty cycle)...±240ma Continuous Power Dissipation (T A = +70 C) 42-Pin Thin QFN-EP (derate 35.7mW/ C above +70 C)...2857.1mW Operating Temperature Range...-40 C to +85 C Storage Temperature Range...-65 C to +150 C Junction Temperature... +150 C Lead Temperature (soldering, 10s)...+300 C Note 1: Signal exceeding or are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = +3.0V to +3.6V, T A = T MIN to T MAX. Typical values are at = +3.3V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range 3.0 3.6 V Quiescent Supply Current I DD +3V +3.6V; = 0V or 600 1100 μa ANALOG SWITCH = +3V, 0V V COM_, I COM_ = -40mA ON = +3V, I COM_ = -40mA, 0 V COM_ 1.5V On-Resistance Matching (Notes 3, 4) On-Resistance Flatness (Note 3) ΔR ON R FLAT(ON) = +3V, 1.5V V COM_, I COM_ = -40mA = +3V, 0 V COM_ 1.5V, I COM_ = -40mA T A = +25 C 8 11 T A = T MIN to T MAX 15 T A = +25 C 8 11 T A = T MIN to T MAX 15 T A = +25 C 0.28 0.40 T A = T MIN to T MAX 0.8 T A = +25 C 0.28 0.40 T A = T MIN to T MAX 0.8 = +3V, T A = +25 C 0.02 0.60 I COM_ = -40mA, T A = T MIN to 1.5V < V COM_ < V 1 DD T MAX = +3V, I COM_ = -40mA, 0 V COM_ 1.5V T A = +25 C 0.02 0.60 T A = T MIN to T MAX 1 Ω Ω Ω Leakage Current I L = +3.6V, V COM_ = +0.3V, +3.3V, V NC_ or V NO_ = +3.3V, 0.3V -1 +1 μa SWITCH DYNAMIC Off-Capacitance C OFF f = 1MHz, V COM_ = V NC_ or V NO_ 1.5 pf 2
ELECTRICAL CHARACTERISTICS (continued) ( = +3.0V to +3.6V, T A = T MIN to T MAX. Typical values are at = +3.3V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS On-Capacitance C ON f = 1MHz, V COM_ = V NC_ or V NO_ 2.5 pf Propagation Delay t PD1, t PD2 R S = R L = 50Ω (Figure 2) 100 ps Output Skew Between Ports t SKEW1 Skew between any two ports, R S = R L = 50Ω (Figure 3) Skew Between Same Ports t SKEW2 R S = R L = 50Ω, skew between any two ports (Figure 3) SWITCH AC PERFORMANCE 20 ps 20 ps On-Channel -3dB Bandwidth BW R S = R L = 50Ω (Figure 4) 2.6 GHz Insertion Loss I LOS R S = R L = 50Ω, f = 50M Hz ( Fi gur e 4) 0.6 db Off-Isolation V ISO R S = R L = 50Ω, single-ended, f = 50MHz (Figure 4) -58 db Crosstalk V CT1 Crosstalk between any two switches, R S = R L = 50Ω, f = 50MHz (Figure 4) -49 db LOGIC INPUTS () Input-Low Voltage V IL = +3.0V 0.8 V Input-High Voltage V IH = +3.6V 2.0 V Input-Voltage Hysteresis V HYST 100 mv Input Leakage Current I LEAK = +3.6V, V COM_ or V NC_ or V NO_ = 0V -1 +1 μa Note 2: Maximum and minimum limits over temperature are guaranteed by design and characterization. Device is production tested at T A = +25 C. Note 3: Negative current is going into COM_ and out of NO_ or NC_. Note 4: Guaranteed by design. 3
(T A = +25 C, unless otherwise noted.) ON-RESISTANCE (Ω) 8.2 8.1 8.0 7.9 7.8 7.7 7.6 7.5 7.4 7.3 7.2 ON-RESISTANCE vs. V COM_ = 3V = 3.3V V COM_ (V) = 3.6V 0 0.6 1.2 1.8 2.4 3.0 3.6 toc01 ON-RESISTANCE (Ω) 10 9 8 7 6 5 4 3 2 1 0 ON-RESISTANCE vs. TEMPERATURE T A = +85 C T A = -40 C T A = +25 C 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 V COM_ (V) toc02 SUPPLY CURRENT (μa) 700 650 600 550 500 450 SUPPLY CURRENT vs. SUPPLY VOLTAGE T A = +85 C T A = +25 C T A = -40 C 400 3.0 3.1 3.2 3.3 3.4 3.5 3.6 (V) toc03 LEAKAGE CURRENT (na) 10 1 LEAKAGE CURRENT vs. TEMPERATURE toc04 ON-LOSS (db) 0-1 -2-3 -4-5 -6 FREQUENCY RESPONSE toc05-7 0.1-40 -15 10 35 60 85 TEMPERATURE ( C) -8 1 10 100 1000 10,000 FREQUENCY (MHz) 4
1, 4, 10, 14, 17, 19, 21, 39, 41 5, 8, 13, 18, 20, 30, 40, 42 2 COM1+ 3 COM1-6 COM2+ 7 COM2-9 11 COM3+ 12 COM3-15 COM4+ 16 COM4-22 NO4-23 NO4+ 24 NO3-25 NO3+ 26 NC4-27 NC4+ 28 NC3-29 NC3+ 31 NO2-32 NO2+ 33 NO1-34 NO1+ 35 NC2-36 NC2+ 37 NC1-38 EP EP μ 5
0 COM_ to NC_ 1 COM_ to NO_ FUNCTION NC3+ NC3- NO3+ NO3- NC4+ NC4- NO4+ NO4- COM1+ COM1- NO1+ NO1- COM2+ NC2+ COM2- NC2- NO2+ NO2- COM3+ COM3- COM4+ COM4- μ μ 6
V N_ NC_ COM_ OR NO_ V OUT R L C L LOGIC INPUT C L INCLUDES FIXTURE AND STRAY CAPACITANCE. V OUT = V N_ ( R L R L + R ON ) +3.3V IN+ COM1+ OUT+ COM1- NC1- IN- OUT- COM1+ IN+ COM1- IN- OUT+ t PD1 t PD2 NC1- OUT- 7
+3.3V COM1+ IN+ OUT+ COM1- NC1- IN- OUT- COM1+ IN+ COM1- IN- t PLH1 t PLH1 OUT+ t PLH2 t PLH2 50% 50% 50% 50% NC1- OUT- PROCESS: BiCMOS Connect exposed paddle to. 8
3dB BANDWIDTH/INSERTION LOSS NETWORK ANALYZER COM1+ 2 38 NETWORK ANALYZER NETWORK ANALYZER CROSSTALK COM2+ 6 NC2+ 36 R13 49.9Ω NETWORK ANALYZER COM2-7 NC2-35 R14 49.9Ω NETWORK ANALYZER OFF-ISOLATION R15 49.9Ω COM3+ 11 NC3+ 29 NETWORK ANALYZER HDMI1 TMDS 8 LOW-FREQUENCY SIGNALS NC_ R TMDS R X COM_+ COM_- G B HDMI2 CK TMDS NC_ 8 MAX4929 MCU HPIR HPD 5V (HPIR), HPD, DDC/SCL, DDC/SDA EDID EEPROM 9
DVI SIGNALS COM1+ COM1- COM2+ COM2- NO1+ NO3+ NO3- NO1- NO2+ NO2- NO4+ NO4- DOCKING STATION COM3+ COM3- NCI- COM4+ COM4- NC2+ NC2- NC3+ NC3- DVI CONNECTOR MONITOR NC4+ _DOCK NC4- TOP VIEW 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 39 21 40 20 41 42 + 19 18 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 COM1+ COM2- COM1- VDD COM2+ COM4- VDD COM3+ VDD COM4+ COM3- NC2- NC1- NC2+ NO1- NO1+ NO2- NO2+ NC3- VDD NC3+ NO4- NC4+ NO3+ NO4+ NC4- NO3- *EP TQFN *CONNECT EXPOSED PADDLE TO GROUND. 10
japan.maxim-ic.com/packages 42L THIN QFN.EPS 11
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