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1 機械 知能系 5 セメ 5 th semester 平成 23 年機械 知能系 5 セメスター そうせいがく 創成学 Creation and Production 6. 除去加工特殊加工 Removal processing: advanced processes

2 主な材料加工法 Manufacturing processes 成形加工除去加工付加加工 Forming processes Removal processing Joining processes 鋳造 Casting 切削加工 Cutting 接合 溶接 Bonding and welding 塑性加工 Plastic forming 研削加工 Grinding 粉末 射出成形 Powder processing Injection molding 特殊加工 Advanced processes 表面改質 処理 Surface treatment, modification めっき 蒸着

3 特殊加工とは? What is advanced machining processes? 従来の機械的加工技術 ( 切削 研削 塑性加工 ) に対し まったく新しい加工原理による新しい加工技術の総称 The processes based on non-mechanical means of material removal. 特徴 Characteristics 1 機械的エネルギーに加え ( ) を利用した加工法 In addition to mechanical energy, ( ) are used in advanced machining processes. 2 従来の加工技術では加工困難な ( ) が可能 Ability to machine materials having ( ).

4 特殊加工の分類 Classification of advanced machining 加工機構 Mechanism 従来の加工法 Conventional machining 特殊加工 Advanced machining 微細加工 Micro-fabrication 機械的エネルギー Mechanical energy 切削加工 Cutting 研削加工 Grinding ラッピング Lapping 超音波加工 Ultrasonic machining ウォータージェット加工 Water-jet machining 噴射加工 Abrasive-jet machining イオンビーム加工 Ion-beam machining スパッタリング Sputtering 熱エネルギー Thermal energy 放電加工 Electro-discharge machining 電子ビーム加工 Electron-beam machining レーザー加工 Laser-beam machining 化学作用 Chemical action ドライエッチング Dry etching ウェットエッチング Wet etching 電解加工 Electrochemical machining

5 超音波加工 Ultrasonic machining 工具 ( ホーン ) に ( ) を与え 工具と工作物の間に ( ) を入れて 軽い圧力で加工する The tip of the tool vibrates ( ). Material is removed from a surface by microchipping and erosion with ( ). 特長 Advantages: (1) ( ) の加工が容易 Best suited for materials that are ( (2) 複雑な断面形状の穴の加工が可能 Suited for machining a complex crosssectional shape hole Amplitude ). 工作物 Workpiece 工作物 Workpiece ホーン : 軟鋼 黄銅等 Horn : mild steel, brass 工具 Tool Transducer 工具 Tool JSME テキストシリーズ加工学 Ⅰ- 除去加工 -, 丸善 ( 株 ),2006

6 噴射加工 Abrasive-jet machining 研磨材を不活性ガスに乗せて噴射し 工作物に衝突させ ( ) により 1) 硬脆材料の穴あけ 複雑形状創成 2) バリ取り 3) 酸化膜等の除去などを行う加工 A high-velocity jet of dry air, nitrogen, or carbon dioxide containing abrasive particles is aimed at the workpiece surface to preform operations such as 1)cutting small holes, slotsl or intricate patterns in very hard or brittle materials, 2)deburring, 3) removing oxides and other surface films, etc.

7 ウォータージェット加工 Water-jet machining 小口径 (1mm 以下 ) のノズルから噴射する ( ) によって加工物が除去される プラスチック 紙 布 ゴム 皮革 ガラス 木材などの穴あけ 溝加工に用いられる ( ) sprayed from jet-nozzle (diameter: less then 1mm) acts like a saw and cuts a narrow groove in the material including plastics, fabrics, rubber, wood products, paper, and leather. A pressure level of about ( ) is generally used. Nozzle Water jet 銅 Copper コルク Cork エポキシ Epoxy ウレタン スポンジ Urethane, sponge

8 電解加工 Electrochemical machining ( ) を利用し わずかずつ加工物を取り除く加工方法 Material is removed from a surface by the high rate of ( ). ダイヤモンド砥石 Diamond grinding wheel ダイヤモンド砥粒 Diamond particle 陰極 : 電極工具 Cathode: tool 陽極 : 工作物 Anode: workpiece 工作物 Workpiece 工作物 (+) Workpiece (+) 陽極被膜 Anode ( ー ) 電解液 Solution (casode) 電解液 Electrolyte solution

9 放電加工 Electrical-discharge Machining (EDM) 工具 ( 黄銅 鋼 グラファイトなど ) と工作物との間に ( ) を起こして 工作物を飛散させる Material is removed from a workpiece surface by the erosion caused by ( ) between tool-workpiece gap. 特徴 Advantages: 1 セラミックス 超硬合金の加工も容易 Ability to machine ceramics and carbides 2( ) 3 加工変質層が薄い Thin affected layer 4 加工の方向性が少ない Less anisotropy of machining

10 ワイヤー放電加工 Wire EDM

11 電子ビーム加工 Electron-beam machining 高真空中 (10-4 ~10-6 Torr) で加熱されたW( タングステン ) 陰極から出た ( ) させ 局部的に高温にして 加工する The energy source in electron-beam machining is high-velocity electrons, which strike the workpiece surface and generate heat. 特徴 Characteristics: (1) 加工中の汚染が少ない ( 真空中のため ) Less contamination (2) 硬質材料の精密加工が可能 High precision processing (3) 穴あけ加工 Hole making 金属 石英ガラス サファイア ダイヤモンド Metals, Silica glass, sapphire, diamond (4) 高真空が必要 Vacuum chambers have limit capacity (5) X 線が照射される Hazardous X-rays is produced.

12 レーザ加工 Laser-beam machining 強い指向性 高エネルギーの ( ) する A laser (an acronym for light amplification by stimulated emission of radiation) focuses optical energy on the surface of the workpiece. The highly focused, high-density energy source melts and evaporates portions of the workpiece. Assist gas Assist gas Assist gas アシストガス アシストガス アシストガス Laser gas Discharge electrode Mirror Assist gas 熱伝導 Heat transfer レーザ光の吸収 Absorption of laser energy 温度の上昇 Temperature rise 溶融層 Melting layer 溶融層の形成 Formation of melting layer 加工穴 Hole 溶融層の蒸発 vaporization アシストガスによる飛散 Scattering by assist gas Lens 熱伝導率が大きいと 十分に加熱されないことがある Insufficient heating too high heat conductivity レーザパワー密度 ( レーザパワー / 照射面積 ) を調整 表面温度を制御できる Laser power density (laser power/irradiation are) can be controlled.

13 微細加工技術 Micro-manufacturing Micro-manufacturing Applications Aircraft Automobile Machinery gears Integrated circuit package 100 mm Gear for MEMS Features in integrated circuit 100 nm

14 微細加工技術 Micro-manufacturing バイトや砥石 研磨剤の代わりに ( ) を利用する ( ) are used as tools instead of cutting tool, grinding wheel, and abrasives. 原子 エネルキ エネルキ エネルキ e e e e 固体 Solid body 液体 Aqueous fluid 気体 Gaseous matter ( ) させた状態 電子 イオン等からなる A plasma is a distinct state of matter containing a significant number of ( ), a number sufficient to affect its electrical properties and behavior.

15 プラズマの作り方 How to produce plasma (1) 大気圧の1 万分の一ぐらいの圧力 ( ) にする Vacuate the chamber up to 10-2 Pa ( ) (2) 高い電界をかけると 電子が加速して ガス分子に衝突する Electric field is impressed to accelerate electrons and they collide gas molecules. (3) エネルギーを持った中性粒子や イオンが作られる=プラズマ Plasma (high energy neutral particles and ions) is produced. 電子 electron e ガス分子 gas molecules e 電子 electron 高エネルギー中性粒子 High energy neutral particles 正イオン Positive ion 負イオン Negative ion プラズマ Plasma マスク mask マスク mask

16 物理的 / 化学的エッチング Physical/chemical etching (1) プラズマ中のイオンを電界で加速させる Ions in plasma are accelerated with impressed electric field (2) 材料に当てて ( ) する Materials are removed by ( ). (1) プラズマ中の高エネルギー中性粒子が表面に付着 High energy neutral particles contact with the surface of material (2) ( ) して表面から離脱する Materials are detached from the surface by ( ) イオン Ion 電界 Electric field イオン Ions 電界 Electric field マスク Mask マスク Mask

17 シリコンのエッチング Silicon etching シリコン ( 基板材料 電極材料として使用される ) をエッチングし シリコン酸化膜上でエッチングを停止させる Etch silicon, used for substrate or electrode materials, and stop etching on silicon oxide layer. Cl + Cl Cl + SiClx Cl + マスク Mask Cl Cl Cl Cl シリコン Silicon シリコン酸化膜 SiO 2 layer Si-Si binding energy : < 2eV Si-O biding energy : > 9eV Cl Cl Cl Cl J. Vac. Sci. Technol. B18, pp. 2495, 2000 Cl + のエネルキ ーを低くしておけば Si だけエッチングされる Only Si is etched when energy of Cl + is between 2 and 9 ev.

18 本日のまとめ Today s summary 特殊加工 advanced processes: 従来の機械的加工技術 ( 切削 研削 塑性加工 ) に対し まったく新しい加工原理による新しい加工技術の総称 The processes based on non-mechanical means of material removal. 機械的エネルギーに加え 熱エネルギー 化学的作用 電気 光エネルギーを利用した加工法 In addition to mechanical energy, thermal energy, chemical action, electric/optical energy are used in advanced machining processes. 従来の加工技術では加工困難な難加工材料の加工および難加工形状の加工が可能 Ability to machine materials having high strength, high hardness, too brittle materials, too flexible materials, and complex shape. < 主な特殊加工方法 > 超音波加工 ウォータージェット加工 噴射加工 放電加工 電子ビーム加工 レーザー加工 微細加工技術 ( スパッタリング イオンミリング RIE)

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