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1 17 JUN 16 Rev M INDUSTRIAL MINI I/O Connector ( ンミニ I/O コネ ) 1. 適用範 1.1 内容本規格ンミニ I/O コネ製品性能試験方法品質保証必要条件規定い 1. Scope 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of INDUSTRIAL MINI I/O Connector. 2. 参考規格類以規格類本規格中規定範内い本規格一部構成万一本規格製品面間一致生時製品面優先適用こ万一本規格参考規格類間一致生時本規格優先適用こ 2.1 TE 規格 A : 試験報告書 (SMT ) 基板側型番 : * *, * *, * * B : 試験報告書 (SMT ) 基板側型番 : * *, * * C : 試験報告書 (DIP ) 基板側型番 : * * 2. Applicable Documents : The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 TE Specifications: A : Test Report: (SMT TYPE) The applicable HDR P/N: * *, * *, * * C : Test Report: (SMT TYPE) The applicable HDR P/N: * *, * * B : Test Report: (DIP TYPE) The applicable HDR P/N: * * 2.2 民間団体規格 A. EIA Commercial Standards and Specifications: A. EIA364 series 2016 Tyco Electronics Japan G.K., a TE Connectivity Ltd. Company All Rights Reserved * Trademark タイコエトニャパン合同会社 TE Connectivity Ltd. ープ 1 of 14 TE logo is a trademark. Other products, logos, and company names might be trademarks of their respective owners. LOC B

2 3. 一般必要条件 3. Requirements: 3.1 設計構造製品該当製品面規定さ設計構造物理的寸法製造さいこ 3.2 材料製品該当製品面規定さ材料製造さいこ 3.3 定格 A. 定格電圧 :60V AC (rms) B. 定格電流 :0.5A C. 使用温度範 : 40 ~85 ( 除く ) 3.4 性能必要条件試験方法製品 Fig.1 規定さ電気的機械的及耐環境的性能必要条件合致う設計さいこ試験特別規定さい限室温行わこ 3.1 Design and Construction: Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 Materials: Material used in the construction of this product shall be as specified on the applicable product drawing. 3.3 Ratings: A. Voltage Rating : 60V AC (rms) B. Current Rating: 0.5A C. Temperature Rating : 40 to 85 (Unless limited by cable) 3.4 Performance Requirements and Test Descriptions : The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig.1. All tests shall be performed in the room temperature, unless otherwise specified. Rev M 2 of 14

3 3.5 性能必要条件試験方法要約 3.5 Test Requirements and Procedures Summary 目試験目規格値試験方法製品確認製品面必要条件合致いこ目視コネ機能支障損傷検査 Examination of Product Meets requirements of product drawing. Visual inspection No physical damage 総合抵抗 ( ) Termination Resistance 初期 40 mω 以試験後 50 mω 以電気的性能 Electrical Requirements 40 mωmax. (Initial) 50 mωmax. (After Test) ン組込嵌合コン開路電圧 20mV 以閉路電流 100mA 以条件測定 Fig.3 参照 EIA Subject mated contacts assembled in housing to 20mV Max open circuit at 100mA. Fig.3. EIA 絶縁抵抗 500MΩ 以 100V DC 1 分間印加コネ嵌合あ隣接コン間測定 EIA Insulation Resistance 500MΩMin. 100V DC. 1minute hold. Test between adjacent circuits of mated connectors. EIA 耐電圧沿面放電ュオ等いこ電流 0.5mA 以コネ嵌合あ 1000V DC 1 分間印加 ( 隣接コン間 ) 1500V DC 1 分間印加 ( コン - 間 ) Dielectric withstanding Voltage No creeping discharge or flashover shall occur. Leak current: 0.5mA Max 温度昇定格電流通電温度昇 30 以 Temperature Rising 30 MAX under loaded rating current. EIA Mated connectors. 1000V DC 1 minute hold(between Contacts) 1500V DC 1 minute hold(between contact shield) EIA 通電温度昇測定こ Measure temperature rising by energized current. Fig. 1 ( 続く ) Fig. 1 (CONT.) Rev M 3 of 14

4 目試験目規格値試験方法機械的性能 Mechanical Requirements コネ挿入力 30 N 以操作速度 10mm/ 分挿入要力測定 EIA Connector Mating Force 30 N Max. Operation speed: 10mm/min. Measure force necessary to mate samples. EIA コネ引抜力 30 N 以コネ操作部開状態固定操作速度 10mm/ 分引抜要力測定 EIA Connector Unmating Force 耐久性 ( 繰返挿抜 ) Durability (Repeated Mate/Unmating) 30 N Max. Set lock operation part of plug connector to open. Operation speed: 10mm/min. Measure force necessary to unmate samples. EIA 試験後総合抵抗 ( ) 条件合致こ Termination Resistance 引張耐性付け部いこ線間導通いこ Cable Pull-Out No damage on soldering place. No disconnection between shield wire to shell. Fig. 1 ( 続く ) Fig. 1 (CONT.) 挿抜速度 200 回 / 時挿抜回数 1500 回 (SMT ) 挿抜回数 1500 回 (DIP ) EIA Operation Speed :200cycles/hour No. of Cycles: 1500cycles.(SMT HDR) No. of Cycles: 1500cycles.(DIP HDR) EIA コネ引出方向力加え Fig.4 参照 EIA KIT 品引張力適用別途定 CABLE ASSY 品引張力 CABLE ASSY 面記載 Apply axial load to cable on plug connector. Fig.4 EIA Retention force for KIT products shall be determined by cable. Retention force for CABLE ASSY products shall be specified on CABLE ASSY drawing. Rev M 4 of 14

5 目試験目規格値試験方法強度コネ抜けいこ破壊コネ基板剥そ他有害変形いこ Lock Strength Connector must not unmate. No destruction on Lock elements, no destruction on Receptacle connector with PC-Board and no harmful damage on other parts 屈曲耐性コネ抜けいこ破壊コネ基板剥そ他有害変形いこ Elasticity Connector must not unmate. No destruction on Lock elements, no destruction on Receptacle connector with PC-Board and no harmful damage on other parts 基板固定強度コネ基板剥そ他有害変形いこ Fixed Strength to PC-Board No destruction on Receptacle connector with PC-Board and no harmful damage on other parts. コネ嵌合させ正常掛い状態コネ引出方向力加え 98 N 1 分間 Fig.4 参照 Mate connector and make lock mechanism effective. Apply axial load to cable on plug connector. 98 N. 1 minute. Fig.4 コネ嵌合させ正常掛い状態コネ 20N 引張力加え左右 45 度往復 90 度 1 回各 20 回屈曲させ Fig.5 参照 Mate connector and make lock mechanism effective. Apply axial load to cable on plug connector 20N and bend cable to direction 45 degrees each on both side up to 20 cycles. Fig.5 コネ嵌合させコネ端部力加え力 1 サン 1 方向 40 N 1 分間 Fig.6 参照 Mate connector. Apply load to edge of plug connector. Load one direction on one sample. 40 N. 1 minute. Fig 振動 ( 低周波 ) Vibration (Low Frequency) 振動中 1μsec. こえ連続導通生いこ試験後総合抵抗 ( ) 条件合致こ No electrical discontinuity greater than 1μsec shall occur. Termination Resistance. Fig. 1 ( 続く ) Fig. 1 (CONT.) 嵌合コネ振幅 1.52mm 周波数 Hz/ 分 /1 サ割合変化掃引振動直交軸方向各 2 時間え EIA Subject mated connectors to Hz traversed in 1 minute at 1.52mm amplitude 2 hours each of 3 mutually perpendicular planes. EIA Rev M 5 of 14

6 目試験目規格値試験方法衝撃衝撃 1μsec. こえ連続導通生いこ試験後総合抵抗 ( ) 条件合致こ Physical Shock No electrical discontinuity greater than 1μsec shall occur. Termination Resistance 付け性 (DIP 製品 ) Solder ability (DIP Products) 付け性 (SMT 製品 ) 10 倍大鏡用い目視検査ンホ良等異常いこ Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnifier of 10X. The soldered surface shall be covered with a smooth solder coating with no more than small amounts of scattering imperfections such as pin-holes or un-wet or de-wet areas. 10 倍大鏡用い目視検査ンホ良等異常いこ加速度 :30G 衝撃波形 : 半波正弦波接続時間 :11 m sec. 衝撃回数 :X Y Z 軸正逆方向各 3 回合計 18 回 EIA Accelerated Velocity : 30G Waveform : Half-sin wave Duration : 11 m sec. Number of drops : 3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops. EIA 共晶温度 235±5 浸漬時間 3±0.5 秒鉛 Sn-Ag-Cu 温度 245±5 浸漬時間 3±0.5 秒 MIL-STD-202, 試験法 208 Eutectic solder Solder Temperature : 235±5 Immersion Duration : 3±0.5 sec. Lead-Free solder Sn-Ag-Cu Solder Temperature : 245±5 Immersion Duration : 3±0.5 sec. MIL-STD-202 Method 208 IEC 法準予備加熱 :150±10 60~120 秒半田付け :235±5 10±1 秒回数 : 2 回 Solder ability (SMT Products) Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnifier of 10X. The soldered surface shall be covered with a smooth solder coating with no more than small amounts of scattering imperfections such as pin-holes or un-wet or de-wet areas. Fig. 1 ( 続く ) Fig. 1 (CONT.) Conform to IEC Solder reflow method. Preheating: 150±10, 60~120sec Soldering: 235±5, 10±1 sec Number of reflow : 2 Rev M 6 of 14

7 目試験目規格値試験方法温度寿命 ( 耐熱 ) 環境的性能 Environmental Requirements 試験後総合抵抗 ( ) 条件合致こ嵌合コネ時間 EIA Temperature Life (Heat Aging) Termination resistance Mated connector 85, 315 Hours EIA 耐湿性 ( 定常状態 ) Humidity (Steady State) 試験後絶縁抵抗耐電圧及総合抵抗 ( ) 条件合致こ Insulation resistance Dielectric Strength Termination resistance 嵌合コネ 90-95%R.H 時間 EIA Mated connector 90-95%R.H hours EIA 熱衝撃試験後総合抵抗 ( ) 条件合致こ Thermal Shock Termination Resistance 嵌合コネ 55 /30 分 +85 /30 分こ 1 サ 10 サ行う EIA Mated connector 55 / 30 min. +85 / 30 min. Making this a cycle, repeat 10 cycles. EIA Fig. 1 ( 続く ) Fig. 1 (CONT.) Rev M 7 of 14

8 目試験目規格値試験方法温湿度サン試験後絶縁抵抗耐電圧及総合抵抗 ( ) 条件合致こ Humidity-Temperature Cycling Insulation resistance Dielectric Strength Termination resistance 塩水噴霧試験後総合抵抗 ( ) 条件合致こ ( 試験槽取出後常温常湿中 1 時間放置測定 ) Salt Spray Termination resistance After it is left for 1 hour under a steady temperature/humidity, it is measured 硫化水素ガ (H2S) 試験後総合抵抗 ( ) 条件合致こ嵌合コネ 25~65 80~100%R.H. 7 サ 10 寒冷衝撃あ EIA Mated connector, 25~65, 80~100%R.H. 7 cycles Cold shock 10 performed EIA 嵌合コネ 5% 塩水噴霧 35±2 48 時間 EIA (MIL-STD-202F 試験法 101 条件 B) Mated connector Salt concentration: 5%, 35±2, 48 hours EIA (MIL-STD-202F Method 101 Condition B) 嵌合コネ H2S ガ :3±1ppm 40±2 96 時間 Hydrogen sulfide Gas (H2S) Termination resistance Mated connector H2S Gas :3±1ppm, 40±2, 96 hours 耐熱性 (DIP 製品 ) Resistance to Soldering Heat (DIP Products) 試験後物理的損傷生いこン基板取付け試験温度 260±5 浸漬時間 10±0.5 秒 MIL-STD-202, 条件 210 手場合 360±10 3±0.5 秒行う但ン部コテ先等力加わいこ No physical damage shall occur. Test connector on PCB. Solder Temperature : 260±5 Immersion Duration : 10±0.5 sec. MIL-STD-202, Condition 210 In case of manual soldering iron, apply it as 360±10 for 3±0.5 seconds without forcing pressure to affect the tine of contact. Fig. 1 ( 続く ) Fig. 1 (CONT.) Rev M 8 of 14

9 目試験目規格値試験方法耐熱性 (SMT 製品 ) 10 倍大鏡用い目視検査割溶融等異常いこン基板取付け試験平均温度昇速度 :3 / 秒以予備加熱温度 :150~200 予備加熱時間 :60~180 秒温度到達温度昇速度 :3 / 秒以加熱 ( 鉛半田液状 (217 )) 時間 :60~150 秒温度 :260 +0/-5 時間 :20~40 秒冷却時温度降速度 :6 / 秒以 25 温度到達時間 :8 分以 Resistance to Soldering Heat (SMT Products) Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnification of 10X, No physical damage such as cracks, chips or malting. 記行後部 DIP 温度 260 ±5 浸せ時間 10±1 秒回数 : 2 回 EIA Test connector on PC-Board. Reflow Average ramp rate: 3 / sec max Preheat temperature:150~200 Preheat time: 60~180sec Ramp to peak: 3 / sec max Time over liquid s (217 ) :60~150 seconds Peak temperature: /-5 Time within 5 of peak:20~40 sec Ramp - cool down: 6 / sec max Time 25 to peak: 8 min max Fig. 1 ( 続く ) Fig. 1 (CONT.) After reflow, then DIP (Legs of shell) Solder temperature 260 ±5 Immersion duration 10±1sec. Number of reflow : 2 EIA Rev M 9 of 14

10 目試験目規格値試験方法 IP テコンテ接触いこ IP20 嵌合いいコネテンガ (12mm 径長さ 80mm) 使用 IP30 嵌合コネ銅線 (2.5mm 径長さ 80mm) 使用 IEC IP test Live parts shall not be accessible by test tool IP20 Unmated connector Use metal test finger of 12mmDia, 80mm length IP30 Mated connector Use copper wire of 2.5mmDia, 80mm length IEC Fig. 1 ( 終 ) Fig. 1 (END) Rev M 10 of 14

11 4 製品認定試験試験序 4 Product Qualification Test Sequence 試験 / Test Group 試験目 Test Examination 試験序 / Test Sequence (a) 製品 Examination of Product 確認検査総合抵抗 ( ) Termination Resistance 絶縁抵抗 Insulation Resistance 2,5 2,5 2,6 2,5 2,4 2,4 2,4 2,4 2,4 2,4 耐電圧 Dielectric withstanding Voltage 3,6 3,6 温度昇 Temperature Rising 2 ネタ挿入力 Conn. Mating Force 3 ネタ引抜力 Conn. Unmating Force 4 耐久性 ( 繰返挿抜 ) 引張耐性強度 Durability (Repeated Mate/Unmating) Cable Pull-Out Lock Strength 5 2 屈曲耐性 Elasticity 2 基板固定強度振動 Fixed strength to PC-Board Vibration (High Frequency) 2 3 衝撃 Physical Shock 4 付け性温度寿命 ( 耐熱 ) 耐湿性 ( 定常状態 ) Solder ability 2 Temperature Life (Heat Aging) Humidity (Steady State) 熱衝撃 Thermal Shock 3 温湿度イ Humidity-Temperature Cycling 4 3 塩水噴霧 Salt Spray 3 硫化水素ガ (H2S) 耐熱性 Hydrogen sulfide Gas (H2S) Resistance to Soldering Heat 3 2 IP テ IP test Fig.2(CONT.) (a) 欄内数字試験実施序示 /Numbers indicate sequence in which tests are performed. Rev M 11 of 14

12 試験目製品確認検査総合抵抗 ( ) 絶縁抵抗耐電圧温度昇ネタ挿入力ネタ引抜力耐久性 ( 繰返挿抜 ) 引張耐性強度屈曲耐性基板固定強度振動衝撃付け性温度寿命 ( 耐熱 ) 耐湿性 ( 定常状態 ) 熱衝撃温湿度イ塩水噴霧硫化水素ガ (H2S) 耐熱性 Test Examination 17 Examination of Product 1 Termination Resistance Insulation Resistance Dielectric withstanding Voltage Temperature Rising Conn. Mating Force Conn. Unmating Force Durability (Repeated Mate/Unmating) Cable Pull-Out Lock Strength Elasticity Fixed strength to PC-Board Vibration (High Frequency) Physical Shock Solder ability Temperature Life (Heat Aging) Humidity (Steady State) Thermal Shock Humidity-Temperature Cycling Salt Spray Hydrogen sulfide Gas (H2S) Resistance to Soldering Heat 試験 / Test Group 試験序 / Test Sequence (a) IP テ IP test 2 (END) Rev M 12 of 14

13 SMT Type DIP Type ( 測定値単体長さ X 分抵抗値差引く ) (Cable balk resistance of length X is deducted from measurement value.) Fig.3 総合抵抗 ( ) 測定方法 Termination Resistance Measurement Points Fig.4 引張耐性強度測定方法 Cable Pull-Out Lock Strength Measurement Method DIP 省略 Fig of DIP Type is omitted. Fig.5 屈曲耐性測定方法 Elasticity Measurement Method DIP 省略 Fig of DIP Type is omitted. Rev M 13 of 14

14 ( 基板固定矢印方向力加え力 1 サン 1 方向 ) (Fix P.C.Board. Load as shown figure 1 direction par 1 sample.) Fig.6 基板固定強度測定方法 Fixed strength to PC-Board Measurement Points DIP 省略 Fig of DIP Type is omitted. Rev M 14 of 14

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Microsoft Word doc 14JUL2009 Rev. B シールドフィンガ 1511 (Shield Finger 1511) 1. 適用範囲 1. 1 内容本規格はシールドフィンガ 1511 の製品性能試験方法品質保証の必要条件を規定している適用製品名と型番は附表 1 の通りである 2. 参考規格類以規格類は本規格中で規定する範囲内に於いて本規格の一部を構成する万一本規格と製品図面の間に不一致が生じた時は