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Transcription:

1. 2. ( ) 3. ( ) 4. ( ) 5. ( ) 6. MEMS 20mm 400 (40 )100

A-A A 2. ( ) MEMS A (L.M.Roylance et.al., IEEE Trans. on Electron Devices, ED-26 (1979) p.1911) ( (In-Vivo Oximetry)) (J.M.Schmitt,F.G.Mihm and J.D.Meindl, Annals of Biomedical Eng., 14 (1986) 35-52, Frontiers of Engineering and computing in health care-1984, Sixth Annual Conf. (1984) 703-707) (, 110 (1990) 255-261)

( ) (Y.Matsumoto et.al.11 th Biotelemetry, 1990)

( 11 (2005) p.37) (S.Suzuki et.al: Sensors and Actuators,A21-23,(1990) 316-319) (K.Jono et.al.: Measurement Science and Technology,6,1 (1995) 11-15)

3 (R.Toda (Ball Semiconductor Inc.) et.al., MEMS 02 (2002)) DMD ( ) (Y.Matsumoto, Sensors and Actuators A,39 (1993) p.209) 1mm INDEX (M.Esashi, Transducers'93 p.260) ( )

G (VTI ( ) ) F C = 2mv Wii ADXL202/210 2 ( )

VSC (Vehicle Stability Control) M.Nagao et.al.,sae World Congress, Detroit, (2004) ( 40 (2001) p.848) ( )() ( 2004 9 p.75) M.Nagao et.al: 2004 SAE World Congress, Detroit, 2004-01-1113 (2004) (M.Nagao et.al.,sae World Congress, Detroit, (2004))

ESP (Electric Stability Program) Bosch ) () (R.Neul et.al., 2005 IEEE Sensor, p.527 (2005)) Bosch 2001 ~ () (R.Neul et.al., IEEE Sensors Journal, 7, p.302 (2007)) (J.-J.Choi et.al.,, 118-E (1998), 641-646) 2 IDG-1000 (, 2006 2, pp.25-45)

Deep RIE Si deep RIE (M.Takinami, 11th Sensor Symposium, (1992) p.15)

30mm Segway VSG (Vibrating Structure Gyroscope) VSG (Vibrating Structure Gyroscope) (Y.Nonomura et.al. The 16th European Conf. on Solid-State Transducers (2002) p.816 25mm ( ) ( 2004.11.8, p.119)

MEMS ( 8th SEMI Microsystem/MEMS Seminar, (2004) p.25) ibot 3. ( RF ) (IEEE Trans. on Electron Devices, ED-30, 5 (1983) p.122)

DMD (Digital Micromirror Device) DLP L.J.Hornbeck : Micromachining and Microfabrication'95(SPIE), Austin, 3 (1995)) Al DMD (Digital Micromirror Device) ( ) Al (Ti) 0.5 m Al 10nm Ti Al3Ti (H.-J.Lee et.al.(stanford Univ.), Applied Physics Letters, 76, p.3415 (2000))

Texas Instruments Inc., Larry J.Hornbeck (, 2005 2/28, 3/14, 3/28, 4/11, 4/25, 5/9) (DLP : Digital Light Processing) 1920 / sec GLV (Grating Light Valve) (R.B.Apte, D.M.Bloom et.al.,solid-state Sensor and Actuator Workshop, Hilton Head (1994) p.1) GLV(Grating Light Valve) 1080 1920 HDTV (MEMS & (CQ )p.189 )

50m 10m A4 60 / GLV2005 (6) ( )( ) 2005/5/2 Suspended Heater Silverbrook Research ( ) MEMS ( A4 11 6400) (http://silverbrookresearch.com/silverbrook_research.aspx) ( : RF-MEMS (Realize, 2006))

, No.923, 2006 4 10 () (K.Ikeda, Tech.Digest of the 7th Sensors Symposium (1988) p.55) MEMS (MEMS + ) SiT8002 SiT0100 ( ) SiT8002UT ( 0.38mm) : 1-125MHz : 2.0mm 2.5mm 0.85mm : 5 /8 : 6 3 G Q : 8 : 0.05ppm 0.15ppm/ : 1.8V, 2.5V, 3.3V (+ PLL) (0.3mm ) SiT8102 (5pS rms) (1-200MHz) ( 5-10pS rms 15-25pS rms)

4 m (1 m poly Si) ( ) : MEMS (SiP) : MEMS Knowels Acostics MEMS (,248 (2006,2) p.38) MEMS (NHK,) (T.Tajima (NHK ), M.Esashi et.al., Micro and Nanoengineering 2002 Internal. Conf., Lugano Switzerland (2002)) (N.Asada et.al., IEEE Trans. on Magnetics 30 (1994))

( 2007 2 p.24) on <160mW (6V ) <0.3 <3ms 8000 3V-15mA 20GHz LSI 300 LSIMEMS (Y.Liu et.al., MEMS 01) ( Advantest Technical Report, 22 (2004), 9-16) Vertical spring pin connection Metal Pads Print Circuit Board Metal Stiffner Si Ti Au-Sn Au LTCC Ceramic Space transformer Ni (S.H.Choe et.al., Transducers 2005, 1259) (S.H.Choe,IEEE Interi. Test Conf. 2007, Santa Clara, CA, Oct.21-26, 2007 )

Ag Ag ( ( ) SEMICON Japan STS, 2007/12/5) 4 SAW (J.Kuypers, APCOT2006 p.293) TPMS (Tire Pressure Monitoring System) 2000 Ford Explorer Bridgestone/Firestone TREAD (Transportation Recall Enhancement Accountability and Document Act) TPMS 2005 10 20% 2006 9 70% 2007 9 100% SAW (S.Hashimoto (Nissan motor),, Proceedings of the 24th Sensor Symposium, Tokyo, (2007), 267-271)

( ) (S.Tanaka, K.Isomura (IHI), Power MEMS 2007, Freiburg, pp.359-362) 87 rpm ( 470m/s) 2 (S.Tanaka, K.Isomura (IHI), Power MEMS 2007, Freiburg, pp.359-362) DMD ( ) Si

50 m 5 m Pyrex glass Temperature( ) 800 Tempeature( ) Pressure(MPa) 600 400 200 0 0:00 0:28 0:57 1:26 1:55 2:24 Time(h:m) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 Pressure(MPa) SiC mold Step 1 Step 2 Step 3 Step 1 Sp 800 Step 2 Tg 528 Step 3 (K.-O.Min, MEMS'2005, 475) 5. ( ) (A.H.Epstein, J.of Eng.for Gas Turbines and Power, 126, (2004) 205-226)

ph,co 2 ISFET (Supplement to the J.J.AP.,44 (1975),339-343) (S.Shoji and M.Esashi., Sensors and Actuators, 14 (1988) pp.101-107) CMOS

PC (Cr) 4 10 / 4 (T.Katsumata et.al., Optical MEMS 97) (K. Totsu et.al., Transducers 03 (2003) ) (J.-J.Chen, IEEE Sensors 2005, 920)

3 mm (J.-J.Chen, IEEE Sensors 2005, 920) 1mm 7. (N.Kikuchi, Transducers'03)

1 2 2001 9 ( MEMS + LSI ) LSI MEMS ( ) () 3 m BiCMOS MEMS DMD( ) MEMS AlMEMS MEMS CMOSPoly-SiGe MEMS (W.A.Mehta(IMEC),ISSC 2005, p.88) IMEC SiGe (MEMS2007) CMOS (< 400 )

MEMS MEMS LSI NICT MEMS ( ) MEMS A B C D 9 ( ) MEMS 4

MEMS (XeF 2 Si HF+CH 3 OH SiO 2 ) ( : : : MEMS ) ( ( ) TV ( (Wii))

MEMS (, MEMS,, 2006 Sept.) 3 ( ) Knowles( ) ( ) LSI MEMS MEMS MEMS http://www.memspc.jp MEMS (CD) 8/23-25 280 8/22-24 80