Original (English version) Copyright 2001 Semiconductor Industry Association All rights reserved ITRS 2706 Montopolis Drive Austin, Texas

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1 INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2001 EDITION EECA, European Electronic Component Manufacturers Association () JEITA, Japan Electronics and Information Technology Industries Association KSIA, Korea Semiconductor Industry Association TSIA, Taiwan Semiconductor Industry Association SIA, Semiconductor Industry Association SIA ()

2 Original (English version) Copyright 2001 Semiconductor Industry Association All rights reserved ITRS 2706 Montopolis Drive Austin, Texas Japanese translation by the JEITA, Japan Electronics and Information Technology Industries Association under the license of the Semiconductor Industry Association ( ) 2001 ITRS page XX, Figure(Table) YY 2001 ITRS JEITA XX,()YY JEITA

3 2001 ITRS Göltz,

6 2001 International Technology Roadmap for Semiconductors2001 ITRS 15 ( ) IC 2001 ITRS ITRS 1992 Semiconductor Industry AssociationSIA National Technology Roadmap for SemiconductorsNTRS requirements possible solutions NTRS ( ) 15 NTRS International Technology Roadmap for SemiconductorsITRS World Semiconductor Council European Electronics Component Manufacturers Association EECA Korea Semiconductor Industry Association KSIA Electronic Industry Association of Japan EIAJ Japan Electronics and Information Technology Industries Association JEITA Taiwan Semiconductor Industry Association TSIA ITRS ITRS 1997 NTRS technology requirements

7 ( ) 5 30 CMOS Complementary Metal-Oxide-Silicon CMOS CMOS CMOS ITRS 2001 ITRS 1015 CMOS 1940 CMOS ITRS CMOS

8 pre-competitive) ITRS 2001 ITRS ITRS

10 % 17% ITRS ITRS

11 ITRS 15 ITRS CMOS Complementary Metal-Oxide- Silicon 2001 CMOS MOSFET Metal Oxide Semiconductor Field Effect Transistor 9nm ITRS CMOS ITRS CMOS 75% CMOS IC micro-electromechanical systemsmems IC / ITRS 1 ITRS

12 International Technology Working GroupITWG 2 ITWG ITWG ITWG ITWG 2001 ITRS ITWG ITWG ITWG 5 TWG regional Technology Working Group TWG 1-2 ITWG TWG / TWG 1 TWG ITRS 3 ( ) ( ) ( ) ITWG ITWG TWG TWG ( )

13 Japan % Korea 64 8% 39% USA 324 Consortia / Research Inst. / University % 1% Other 10 54% Chip Makers % Taiwan 161 8% Europe 68 Equipment / Materials Suppliers % TWG Members by Regions TWG Members by Affiliations 1 TWG ITRS International Roadmap CommitteeIRC 2-4 SIA Roadmap Coordinating GroupRCG IRC ITWG / ITRS ITRS IRC / Overall Roadmap Technology Characteristics ORTC Technology Node ITWG ORTC ORTC ITWG ITWG ORTC ITWG 2001 ITRS ORTC

14 ORTC 23 B BITRS Near-term Years YEAR OF PRODUCTION ½ ½ Long-term Years YEAR OF PRODUCTION ½ ½ ORTC 2 1

15 Production Ramp-up Model and Technology Node Volume (Parts/Month) 100M 10M 1M 100K 10K 1K Alpha Tool Development Beta Tool First Conf. Papers Production Tool Production First Two Companies Reaching Production 200K 20K 2K Volume (Wafers/Month) Months ORTC 1 ITRS ( ) 2 ITRS 1 ( 1 ) 2 3 ITRS 3 ( ) ITRS ( )

16 Feature Size (Half Pitch) (µm) Feature Size of Technology W.P.C. W.P.C. W.P.C. W.P.C. W.P.C. W.P.C. ITRS Technology Node W.P.C.= Total Worldwide Wafer Production Capacity (Relative Value) Sources: 1995 to 1999: SICAS 2000: Yano Research Institute& SIRIJ For >0.7 µm µm <0.4µm For 2000 >0.8 µm µm µm µm µm µm Year <0.18 µm 3 ORTC ( ) ( ) (wspm: wafer-starts-per-month)2 20wspm mm2 6K 6M 300mm Kwspm 70% M Dynamic Random Access Memory DRAM 3 DRAM DRAM / (decouple)

17 microprocessor unitmpu DRAM MPU (product-specific) 1999 ITRS 2001 ITRS ORTC B DRAM MPU MPU ITWG B ITRS DRAM DRAM B nm DRAM ITRS Half Pitch (=Pitch/2) Definition Metal Pitch Poly Pitch Typical DRAM Typical MPU/ASIC * nm nm 150 nm 180 nm 130 nm 2001 IRTS B

18 1999 IRTS nm nm nm 9nm 3 ITWG ORTC B ( ) ITWG FEP-ITWG CD / ITWG ITWG ORTC first-pass version ORTC 1 ITWG ORTC

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untitled ITRS2005 DFM STRJ : () 1 ITRS STRJ ITRS2005DFM STRJ DFM ITRS: International Technology Roadmap for Semiconductors STRJ: Semiconductor Technology Roadmap committee of Japan 2 ITRS STRJ 1990 1998 2000 2005