J. Jpn. Inst. Electron. Packaging 17(4): (2014)
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- きみのしん みやくぼ
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1 一般社団法人エレクトロニクス実装学会 第 3 回定時総会報告 ,230 2, , ,103 1, TDK Vol. 17 No. 4 (2014) 313
2 ( 1 ) ICEP (MES2013) ICEP2013 ( 2 ) JPCA Show ex-tech ( 3 ) ( 4 ) ( 5 ) 7 1 ( 6 ) ICEP2014 IEEE CPMT Society Japan Chapter IMAPS MOU ( 7 ) ( 8 ) ( 1 ) ( 2 ) ( 1 ) ICEP IEEE CPMT Society Japan Chapter IMAPS ICEP Keynote Vol. 17 No. 4 (2014)
3 388 ( 2 ) ( 3 ) ( 4 ) ( 1 ) ex-tech2013 JPCA Show ex-tech ex-tech ( 2 ) H ( 1 ) 13 1 ( 2 ) ( 3 ) (1) 10/ (2) 2/ CAD/CAE(1) 6/4 44 EMC 4 (2) 11/26 26 EMC EMC 4 (1) 7/ EMCJ (7/11) (7/12) (2) 8/ EMC EMC 5 1 (1) (8) EMC (8 (1) 5/ (2) 7/ (3) 11/ (4) 2/ Vol. 17 No. 4 (2014) 315
4 (1) 7/ (2) 9/ (3) 12/17 88 ECM (1) 11/1 80 (1) 5/21 70 (2) 8/ !! HAST Air-HAST 6 5 JEITA (3) 11/20 85 (4) 12/10 61 YJC 1/ OPT (1) 7/ (2) 10/ (3) 1/ (1) 8/ (2) 10/ / D 2.5D 2.1D 6 e- (1) 12/ EPADs (1) 7/ (2) 9/27 64 (3) 11/ (4) 2/ (1) (1) (2) 11/ / / (1) 7/ (2) 1/ ( 1 ) PWB ( 2 ) ( 1 ) Vol. 17 No. 4 (2014)
5 ( 2 ) 17 Transactions of The Japan Institute of Electronics Packaging Vol J-STAGE J-STAGE 1,000 ( 3 ) (Editorial Manager ) 34 ( 4 ) ( 1 ) ICEP ICEP2014 IEEE CPMT Society Japan Chapter IEEE MOU Memorandum of Understanding IEEE IMAPS IMAPS MOU 4 6 ( 1 ) D IT 3D I-site SR MEMS ips TSV Process and Business Opportunities with cost estimation Kangnam University Gun-Sung Kim I-site 3 30 ( 2 ) ( 1 ) 1 ( 2 ) 1 ( 3 ) 2 SoC SAW LTCC ( 4 ) 2 3 Vol. 17 No. 4 (2014) 317
6 PWB IVH FR-4 1 ( 5 ) 2 ( 6 ) 2 ( 7 ) A-06 15C-05 15A-08 14A GByte/s SiP 15E-14 MID A-14 14B-06 13E-11 MEMS 3F-02 15C PD-03 5PD-13 ( 8 ) MES B1-5 2A1-2 (DIC) 2D3-3 Cu Al 2D3-5 Ag 2D B1-3 1C2-3 2A1-3 2A3-2 2B4-2 ( 9 ) ICEP WD2-2: Transient Heat Transfer of The Microprocessor System Investigation regarding Natural Convection with Slate Style Chassis K. Nishi (AMD Japan), T. Hatakeyama, M. Ishizuka (Toyama Prefectural University/Japan) TA2-1: Cooling Strategy and Structure of 3D Integrated Image Sensor for Auto-mobile Application F. Yamada, K. Matsumoto, H. Kobayashi, K. Sueoka, A. Horibe, S. Kohara, H. Mori, Y. Orii (Association of Super-Advanced Electronics Technology/Japan) TD3-4: Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers E. Higurashi, K. Nakasuji, T. Suga (The University of Tokyo/Japan) FB1-4: Via Formation Process to Form the Smooth Copper 318 Vol. 17 No. 4 (2014)
7 Wiring Using Adhesion Layer S. Sasaki, M. Tani (Fujitsu Laboratories/Japan) FE2-1: Multiscale Modeling of Anisotropic Creep Response of Heterogeneous Single Crystal SnAgCu Solder S. Mukherjee, A. Dasgupta (University of Maryland/USA) 1 Poster-12: A Proposal of New Electrode Structure for Intra- Body Communication T. Fujisawa, F. Koshiji (Kokushikan University/Japan) 4 5 ( 1 ) MES 23 Mate2014 MES2013 2, , ,892 64,032 22,583,625 11,608,570 10,975, ,447 4,213,882 3,944, ,207 1,657, ,061 7,338,058 11,526,208 4,188, , , ,000 8,892,208 6,815,462 2,076, , ,342 41,977 41,286,724 36,999,624 4,287,100 2 (1) 16,669,212 13,669,212 3,000,000 5,000,000 5,000, ,500,000 18,500, ,500,000 14,500,000 16,500,000 2,000, ,000, ,500,000 5,000,000 6,000,000 1,000,000 59,669,212 59,669,212 0 (2) 5 12,127 12, , , , ,434 52,400 15,000,000 15,000, ,618,023 15,682,545 64,522 75,287,235 75,351,757 64, ,573, ,351,381 4,222, ,650 1,090, ,470 13,005,220 12,938,590 66, ,427 1,015, ,760 26,000 17,000 9,000 14,478,297 15,060, , ,669,212 13,669,212 3,000,000 16,669,212 13,669,212 3,000,000 31,147,509 28,730,109 2,417, ,426,450 83,621,272 1,805,178 43,000,000 46,000,000 3,000,000 85,426,450 83,621,272 1,805, ,573, ,351,381 4,222,578 Vol. 17 No. 4 (2014) 319
8 (1) 47,514,430 49,053,500 1,539, , ,000 6,000 21,670,430 23,011,500 1,341,070 25,320,000 25,560, , , ,000 48,000 53,334,785 44,597,153 8,737,632 44,195,065 34,905,433 9,289,632 2,430,114 4,306,006 1,875,892 4,927,230 3,547,425 1,379, , , ,419 1,507, , , , , ,489 57, ,170 52,629 57, ,170 52, ,906,756 93,760,823 7,145,933 (2) 77,248,203 83,692,093 6,443,890 23,372,146 24,312, ,452 1,500,000 1,500, ,942,231 3,557, ,440 11,954,859 14,445,549 2,490,690 5,340,403 6,970,496 1,630,093 1,411,606 2,053, ,448 28,929 46,478 17, , , , , , ,419 13,144,359 14,822,207 1,677, , , ,152,973 7,501, ,433 5,478,659 4,531, , , , , ,302 58,302 1,127,380 1,078,532 48, , , ,802 21,846,712 22,652, ,022 10,588,470 11,068, ,154 1,500,000 1,500, ,693,613 1,958, , , ,782 76, , ,380 63, , , ,946 28,930 46,478 17, , , , , , , , , , , , ,310,440 3,219,300 91, , ,275 36, , , , , ,597 95,293 99,094, ,344,827 7,249, ,811,841 12,584,004 14,395,845 2 (1) ) ,663 6, ,805,178 12,584,004 14,395,845 83,621,272 96,205,276 12,584,004 85,426,450 83,621,272 1,805, ,426,450 83,621,272 1,805,178 ( 1 ) ( 2 ) ( 3 ) 13,669,212 3,000, ,669,212 5,000, ,000,000 18,500, ,500,000 16,500, ,000,000 14,500,000 6,000, ,000,000 5,000,000 59,669,212 3,000,000 3,000,000 59,669,212 16,669,212 ( 0) ( 0) (16,669,212) 5,000,000 ( 0) ( 5,000,000) ( 0) 18,500,000 ( 0) (18,500,000) ( 0) 14,500,000 ( 0) (14,500,000) ( 0) 5,000,000 ( 0) ( 5,000,000) ( 0) 59,669,212 ( 0) (43,000,000) (16,669,212) 546, , , , Vol. 17 No. 4 (2014)
9 (1) 47,514,430 47,514, , ,000 21,670,430 21,670,430 25,320,000 25,320, , ,000 53,334,785 53,334,785 44,195,065 44,195,065 2,430,114 2,430,114 4,927,230 4,927, , ,432 1,507,745 1,507, , ,199 57,541 57,541 57,541 57,541 53,334,785 47,571, ,906,756 (2) 77,248,203 77,248,203 23,372,146 23,372,146 1,500,000 1,500,000 2,942,231 2,942,231 11,954,859 11,954,859 5,340,403 5,340,403 1,411,606 1,411,606 28,929 28, , , , ,856 13,144,359 13,144, , ,150 8,152,973 8,152,973 5,478,659 5,478, , , ,127,380 1,127, , ,584 21,846,712 21,846,712 10,588,470 10,588,470 1,500,000 1,500,000 1,693,613 1,693, , , , , , ,852 28,930 28, , , , , , , , ,150 3,310,440 3,310, , , , , , ,304 77,248,203 21,846,712 99,094, ,913,418 25,725,259 1,811,841 2 (1) (2) ,663 6,663 6,663 6,663 23,913,418 25,718,596 1,805,178 57,110,336 26,510,936 83,621,272 33,196,918 52,229,532 85,426, ,196,918 52,229,532 85,426, /4/1 2014/3/ ,205, ((1) (2) (3)) 63,008,358 (1) 39,094,940 (2) 77,248,203 (3) 53,334, ,196, ,718,189-1,840,501 5,558, ,354,577 4,024, , ,373,613 6,941,164 3,432, , ,749 1,370, ,649,154 10,075,447 4,573, ,667,831 1,296, , ,493,373 1,321, , ,737,831 2,474, ,109 (1) (2) (1) 96,205,276 96,205,276 96,205,276 96,205,276 96,205,276 39,985,772 39,094,940 79,971,544 63,008, ,957,316 81,295,772 83,692,093 81,295,772 77,248,203 81,295,772 41,310,000 44,597,153 41,310,000 53,334,785 41,310,000 56,219,504 57,110,336 16,233,732 33,196, Vol. 17 No. 4 (2014) 321
10 ( 1 ) ( 2 ) Vol. 17 No. 4 (2014)
11 ,860 23,655,139 UFJ 10,701,531 95,498 11,784, , ,207 1,787 7,338,058 7,338, , , ,319 8,892,208 41,286,724 59,669,212 16,669,212 ICEP 18,500,000 5,000,000 14,500,000 5,000,000 15,618, ,984 15,000, ,034 75,287, ,573, ,650 13,005,220 7,172,000 4,160,000 52,000 ICEP 1,621, ,427 56,543 44, , ,448 26,000 20,000 6, ,478,297 16,669,212 16,669,212 31,147,509 85,426,450 Vol. 17 No. 4 (2014) 323
12 (1) 48,600,000 47,514,430 1,085, , ,000 2,000 22,600,000 21,670, ,570 25,520,000 25,320, , , ,000 42,000 46,490,000 53,334,785 6,844,785 23,500,000 26,730,963 3,230,963 60, ,000 85,000 9,200,000 11,571,623 2,371,623 4,500,000 3,974, ,950 6,650,000 7,871,727 1,221,727 80,000 51,000 29,000 2,500,000 2,990, , ,000 57,541 7,541 50,000 57,541 7,541 95,140, ,906,756 5,766,756 (2) 76,760,000 77,248, ,203 14,700,000 14,448, , , ,165 48,835 10,300,000 11,439,238 1,139,238 1,400,000 1,236, ,550 11,860,000 11,210, ,540 80, ,000 2,900,000 3,301, ,386 1,090,000 1,127,380 37,380 33,580,000 33,683, ,566 21,380,000 21,846, ,712 10,400,000 10,588, ,470 1,500,000 1,500, ,800,000 1,693, , , , , , ,565 59, , , , ,930 28, , , , , ,858 20, , ,110 95, , ,150 5,150 3,200,000 3,310, , , ,633 33, , , , , ,304 3,696 98,140,000 99,094, , ,000,000 1,811,841 4,811,841 2 (1) (2) ,663 6, ,000,000 1,805,178 4,811,841 83,621,272 83,621, ,621,272 85,426,450 4,805, ,621,272 85,426,450 4,805, Vol. 17 No. 4 (2014)
13 ( 1 ) ( 2 ) ( 3 ) ICEP ( 4 ) JPCA Show ex-tech ( 5 ) ( 6 ) JPCA ( 7 ) 7 1 (Editorial Manager ) ( 8 ) ICEP IEEE CPMT Society Japan Chapter, IMAPS ICEP ICEP Steering Committee 3 IAAC (IMAPS All Asia Conference) ( 9 ) (10) (11) JPCA JIEP 2014 JPCA ( 1 ) ( 2 ) 4 1 ( 1 ) ICEP 2014 IEEE CPMT Society Japan Chapter IMAPS ( 2 ) ( 3 ) Vol. 17 No. 4 (2014) 325
14 ( 4 ) ( 1 ) JPCA Show ex-tech JPCA Show ( 2 ) ( 1 ) 13 ( 2 ) 22 ( 3 ) 4 3 ( 1 ) PWB (2014.6) ( ) ( 2 ) 2 ( 3 ) ( 4 ) JPCA JPCA JIEP 4 4 ( 1 ) 7 (Editorial Manager ) ( 2 ) (Transactions of The Japan Institute of Electronics Packaging Vol. 7) J-STAGE ( 3 ) ( 4 ) 4 5 ( 1 ) ICEP2015 IEEE CPMT Society Japan Chapter IMAPS ICEP2014 ICEP2015 IEEE CPMT Society Japan Chapter IMAPS MOU IEEE Xplore 326 Vol. 17 No. 4 (2014)
15 ( 2 ) IAAC (IMAPS All Asia Conference) IAAC (IMAPS All Asia Conference) IAAC 2015 ( 3 ) ICEP ICEP Steering Committee 3 ( 2 ) ( 3 ) ( 1 ) MES ICEP (1) 47,718,148 46,490,000 1,228,148 24,200,000 23,500, , ,000 60,000 10,208,148 9,200,000 1,008,148 4,220,000 4,500, ,000 6,820,000 6,650, ,000 80,000 80, ,190,000 2,500, ,000 (2) 47,090,000 48,650,000 1,560,000 47,090,000 48,600,000 1,510, , ,000 40,000 21,850,000 22,600, ,000 24,840,000 25,520, , , ,000 40, ,000 50, ,000 50,000 94,808,148 95,140, , (1) 80,915,066 76,760,000 4,155,066 16,900,000 14,700,000 2,200, , , ,000 15,681,176 10,300,000 5,381,176 MF 1,260,000 1,400, ,000 11,502,800 11,860, ,200 80,000 80, ,730,000 2,900, ,000 1,100,000 1,090,000 10,000 31,011,090 33,580,000 2,568,910 1 (2) 20,091,090 21,380,000 1,288,910 9,420,000 10,400, ,000 1,500,000 1,500, ,500,000 1,800, , , ,000 0 Vol. 17 No. 4 (2014) 327
16 664, ,000 35, , , ,200 26, , , , , , , , , ,200,000 3,200, , , , , , , ,006,156 98,140,000 2,866,156 6,198,008 3,000,000 3,198,008 33,196,918 30,270,000 2,926,918 26,998,910 27,270, , ,000,000 2,000, ,000,000 1,000, ,000,000 3,000, ,000,000 3,000, ,000,000 3,000, JCU IBM Vol. 17 No. 4 (2014)
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