LP2985 マイクロパワー150mA 低ノイズ、超低ドロップアウト・レギュレータ(SOT-23 およびmicro SMD パッケージ) 超低ESR 出力コンデンサが使用可能

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1 VIP 150mA ESR 2985 LP DS Sgm file from Marcom and made addition and changes. lm New datasheet from Chester Simpson; RRD to key in text added titles for all the new curves and some edits to the gen. desc. SN composed the same SN Added 3.5V option to Ordering Table. wg edited some of the typical curves title. SN composed with revised curves per Chester. SN inserted general note to the typperf division.sn composed with the new and revised curves. SN changed thermal resistance in Note 3 from 240 to 220 per A. Simmons. wg. composed the same on the 4th. 7/8 addition of Ordering table. lm composed the same on the 9th. SN 4/29 Final corrections entered again. lm/wg 4/16 Final corrections entered. lm recomposed after fixing layout.sn Converted to nat2000 DTD composed with NAT2000 after editing footnote 2. SN added 2.6V the ordering info. table. SN Where the value of J-A for the SOT-23 package is 220 /W in a typical PC board mounting and the micro SMD package is 225 /W from 320. revised the micro SMD package pin diag per Aaron's request. SN added the two new drawings under Connection Diag. and included the packages in the title. SN added more voltage options to both packages and removed pin numbers from the Typ. Apps. Circuit and. upgraded all the typical curves to colwide with 125 percent. SN updated some of the top markings in the ordering table. SN added the Code F parts according to Bill Weiss, did not know what the Top Markings are for those parts. SN added 2.9V the ordering table. SN changed the tape and reel qty from 1000 to 250 for the micro SMD package. SN removed SOT from the titles and changed the package name. SN added dimensions for the micro SMD pkg. and composed with updated pin diagram. SN added more info. on micro SMD in the apps. section. added micro SMD pin diagram and related info in the document per Chester. SN changed 2.8 to 2.5 in the gen. desc. and changed 250 units on tape and reel to 1000 per Aaron's request. SN added the 2.5V option to the ordering information per Aaron Simmons' request. SN changed the limits in the elec.table. SN mA (SOT-23 micro SMD ) ESR 150mA VIP (Vertically Integrated PNP) : 300mV (150mA ) 7mV (1mA ) : 850 A (150mA ) 75 A (1mA ) : ESR 5m : 1 A (ON/OFF Low ) : SOT-23 micro SMD : 1 (A ) : 10nF 30 V ( ) 2.5V 5.0V 9 VIP 150mA (SOT-23 micro SMD ) ESR 1 A 1 (A ) ( 16V) 0.3 ( 1MHz / (PDA) mA (SOT-23 micro SMD ) ESR National Semiconductor Corporation DS JP 1

2 * ON/OFF V IN ** ( ) ( ) *** ( ) ( ) 5-Lead Small Outline Package (M5) micro SMD, 5 Bump Package (BPA05, TPA05 & BLA05, & TLA05) Top View See NS Package Number MF05A For ordering information see Table 1 Note: Top View See NS Package Number BPA05, TPA05, BLA05 & TLA08 SOT-23 micro SMD V IN 1 C3 GND 2 A1 ( ) ON/OFF 3 A3 High BYPASS 4 B2 V OUT 5 C1 2

3 TABLE 1. Package Marking and Ordering Information 3

4 ( ) TABLE 1. Package Marking and Ordering Information ( ) 4

5 ( ) TABLE 1. Package Marking and Ordering Information ( ) 5

6 ( ) TABLE 1. Package Marking and Ordering Information ( ) 6

7 (Note 1) ( ) ( ) ( ) 0.3V 16V 2.5V 16V 0.3V 16V ( Note 4) 0.3V 9V ( 5 ) 260 I OUT ( ) ESD (Note 2) 2kV ( Note 5) 0.3V 16V (Note 3) (Note 10) T J 25 V IN V O (NOM) 1V I L 1mA C IN 1 F C OUT 4.7 F V ON/OFF 2V 7

8 (Note 10) ( ) T J 25 V IN V O (NOM) 1V I L 1mA C IN 1 F C OUT 4.7 F V ON/OFF 2V Note 1: Note 2: Note 3: SOT micro SMD 5 2 ESD 1kV T J (MAX) - JA T A Note 4: Note 5: Note 6: Note 7: Note 8: Note 9: Note 10: Note 11: SOT-23 JA 220 /W micro SMD 225 /W 12V ( ) 0.3V 16V PNP V IN V OUT 1 ( ) V IN V OUT 25 (SQC) (AOQL) 1V 100mV ON/OFF V OUT 0.5V V OUT ( ) micro SMD 12V ON 50 A 8

9 C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN V OUT vs Temperature Short-Circuit Current Short-Circuit Current Short Circuit Current vs Output Voltage Ripple Rejection Ripple Rejection 9

10 ( ) C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN Ripple Rejection Ripple Rejection Ripple Rejection Ripple Rejection Ripple Rejection Ripple Rejection 10

11 ( ) C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN Ripple Rejection Output Impedance vs Frequency Output Impedance vs Frequency Output Noise Density Output Noise Density Ground Pin vs Load Current 11

12 ( ) C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN Dropout Voltage vs Temperature Input Current vs Pin GND Pin Current vs Temperature Instantaneous Short Circuit Current Load Transient Response Load Transient Response 12

13 ( ) C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN Load Transient Response Line Transient Response Line Transient Response Line Transient Response Line Transient Response Turn-On Time 13

14 ( ) C IN 1 F C OUT 4.7 F V IN V OUT (NOM) 1V T A 25 ON/OFF V IN Turn-On Time Turn-On Time Turn-On Time 14

15 1 F ( ) 1cm : ( ) ESR 1 F ESR 5m ( ) ESR ( ) ESR 1cm BYPASS 10nF A DC 100nA NPO COG 10nF 2.2 F 4.7 F ESR ( ) 2.2 F ESR 10m 20m 1 ( 2.2 F) Z5U Y5V F 1 F ( ) Z5U Y5V 4.7 F X7R 15 X7R : ESR 2.2 F ( ) ( ) 1 F 4.7 F ESR ESR ESR ( ) ESR

16 ( ) ON/OFF ON/OFF Low High ON/OFF V IN ON/OFF V ON/OFF / ON/OFF ( ) 40mV/ sec : V ON/OFF AC ( DC) ( ) PNP ( ) SCR V IN ( ) V IN V OUT ( V IN V OUT ) 0.3V ( ) micro SMD micro SMD AN-1112 (SMT) 5 NSMD ( ) PC micro SMD micro SMD micro SMD micro SMD 1cm

17 inches (millimeters) 5-Lead Small Outline Package (M5) NS Package Number MF05A For Order Numbers, refer to Table 1 in the Ordering Information section of this document. 17

18 millimeters ( ) NOTES: Sn/37Pb EUTECTIC 3. NSMD (Non-Solder Mask Defined) 4. 1 ( ) 5. XXX X1 X2 X JEDEC micro SMD, 5 Bump, Package (BPA05) NS Package Number BPA05A For Order Numbers, refer to Table 1 in the Ordering Information section of this document. The dimensions for X1, X2 and X3 are as given: X / 0.030mm X / 0.030mm X / 0.050mm 18

19 millimeters ( ) NOTES: Sn/37Pb EUTECTIC 3. NSMD (Non-Solder Mask Defined) 4. 1 ( ) 5. XXX X1 X2 X JEDEC micro SMD, 5 Bump, Package (TPA m ball) NS Package Number TPA05 For Order Numbers, refer to Table 1 Ordering Information section of this document. The dimensions for X1, X2 and X3 are as given: X1 = / 0.030mm X2 = / 0.030mm X3 = / 0.075mm 19

20 millimeters ( ) NOTES: Sn/37Pb EUTECTIC 3. NSMD (Non-Solder Mask Defined) 4. 1 ( ) 5. XXX X1 X2 X JEDEC micro SMD, 5 Bump, Package (BLA m ball) NS Package Number BLA05A For Order Numbers, refer to Table 1 Ordering Information section of this document. The dimensions for X1, X2 and X3 are as given: X1 = / 0.030mm X2 = / 0.030mm X3 = / 0.100mm 20

21 millimeters ( ) NOTES: Sn/37Pb EUTECTIC 3. NSMD (Non-Solder Mask Defined) 4. 1 ( ) 5. XXX X1 X2 X JEDEC micro SMD, 5 Bump, Package (TLA m ball) NS Package Number TLA05A For Order Numbers, refer to Table 1 Ordering Information section of this document. The dimensions for X1, X2 and X3 are as given: X1 = / 0.030mm X2 = / 0.030mm X3 = / 0.075mm 21

22 ( ) (CEO) (GENERAL COUNSEL) (a) (b) National Semiconductor Copyright 2007 National Semiconductor Corporation / TEL.(03) mA (SOT-23 micro SMD ) ESR

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