EMC 2 EMC 3 EMC EMC PCB EMC [3] [4] [21] PCB EMC EMC PCB EMC SI EMC 2. EMC PCB EMC 1 GND 2 Signal Integrity SI Common mode CM Cross talk 3 4 Immunity

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1 EMC EMC, a) An Approach for the Electromagnetic Compatibility around the Printed Circuit Board Hiroshi INOUE, a) and Yoshiki KAYANO EMC PCB EMC PCB GND PCB PCB EMC EMI PCB PCB 1. [1] Electromagnetic Compatibility, EMC [2] 1 [1] 1 Printed Circuit Board PCB EMC Akita University, 1 1 Tegatagakuen-cho, Akita-shi, Japan Akita Prefectural Resource Technology Development Organization, 9 3 Furudate, Kosakakouzan, Kosaka-machi, Kazuno-gun, Akita-ken, Japan a) inoueh@gipc.akita-u.ac.jp Fig. 1 1 EMC Model for EMC problem in electronics machine. 378 B Vol. J96 B No. 4 pp c 2013

2 EMC 2 EMC 3 EMC EMC PCB EMC [3] [4] [21] PCB EMC EMC PCB EMC SI EMC 2. EMC PCB EMC 1 GND 2 Signal Integrity SI Common mode CM Cross talk 3 4 Immunity Susceptibility [2] PCB EMC THz IC PCB EMC SI EMC EMC EMC PCB 1 1 PCB IC EMC [22] [27] 2 PCB [28], [29] 3 PCB [30], [31] 4 PCB [32] [38] 5 PCB [40] [44] 6 EMC [45], [46] 7 PCB [47] [49] 8 PCB [50], [51] [52] GND GND EMC FDTD [3] 379

3 2013/4 Vol. J96 B No PCB GND 2(a) (Single Model) w / CM/ DM (a) (a) Model board (b) CM/DM (b) CM/DM FDTD 2(b) GND CM w=10 mm DM 10% ( 20 db) 1 GND 2(c) 1 GND CM GND GND PCB w GND 60 db PCB 3. 2 SI CM 3 2(a) w=10 mm CM GND DM CM r=3 m (1) [37] h (c) (c) Current density distribution on ground surface (calculation) 2 [36] Fig. 2 Common mode current when ground width changed. 3 w=10 mm CM [34] Fig. 3 CM current distribution for w=10 mm. 380

4 EMC (a) PCB Single Model (a) Single Model 4 CM (10 MHz) [37] Fig. 4 Change of CM current when termination resistance changed (10 MHz). E DM(f) = πμ0f 2 2hltĪDM(f) (1) c 0r E CM(f) = ωμ0 (l + lc)īcm(f) 4πr w=10 mm CM PCB PCB PCB EMC 5 PCB (a) 2(a) Trace (b) PCB2 Trace2 Interconnected Model (c) GND GND GND Connection Model (d) PCB1 Trace2 s Trace1 PCB2 (Coupling Model) (b) Interconnected PCBs Model: PCB 1 PCB2 2 (b) Interconnected PCBs Model (c) GND PCB (c) Ground-Connection Model (d) (d) Coupling Model 5 PCB [43], [44] Fig. 5 PCB model with interconnected line. 6 (b) (c) CM 0dBm GND CM GND CM 20 db PCB 7 (d) Coupling Model CM s Single 381

5 電子情報通信学会論文誌 2013/4 Vol. J96 B No. 4 (a) 単一 PCB モデル (285 MHz) (a) Single Model (285 MHz) 図6 相互接続ケーブルを流れる CM 電流周波数特性 [44] Fig. 6 Frequency characteristics of CM current on interconnection cable. (b) Interconnected PCBs 線路 Model (285 MHz) (b) Interconnected PCBs Model (285 MHz) 図 7 Coupling Model の CM 電流周波数特性 [43] Fig. 7 Frequency characteristics of CM current for the Coupling Model. しの PCB1 枚図 2 (a) であり Interconnection は結合した二つの PCB の場合である Single に対し (c) GND 接続 PCB モデル (285 MHz) (c) Ground-Connection Model (285 MHz) Coupling Model は結合させると共振周波数が下がり低周波での CM 電流が増加するものの s の依存性は少ない共振周波数における GND 面の電流密度分布を計算によって求めて各モデルの比較をしたものが図 8 である単一 PCB モデルは図 2 (c) と同じものであるが給電線のないモデルであるので線路の延長の左右の基板端に節が発生するまた給電ケーブルに大きな CM 成分が生じ基板端には定在波様の分布が発生するこの分布は共振周波数と一致する (b) は信号が PCB2 まで延長されているので Trace 2 に信号電流が流れそれに対応して帰還電流 (d) カップリング検討モデル (145 MHz) (d) Coupling Model (145 MHz) 図 8 グランド面の電流密度分布計算 [43], [44] Fig. 8 Current density distribution on ground surface (calculated). の GND 上の分布が大きい (c) では GND のみ接続しているので PCB2 の GND には電流分布はほとんどないものの基板端には若干の電流が集中しているきく Trace 2 に大きな電流が流れる CM 電流は s (d) は図 5 (d) の Coupling Model で s = 2.8 mm 依存性があまりないにおける第 1 共振周波数のグランド面電流密度分布図 9 ではそれぞれのモデルについての 3 m 遠方を計算したものである PCB2 へのクロストークは大での放射電界強度を測定と計算で示した (a) では 382

6 EMC (a) Signle, Interconnection, GND Connection (a) Single, Interconnection and GND Connection model 10 Coupling [43] Fig. 10 Measured and calculated results of electrical field on Coupling Model. (b) Coupling (b) Coupling Model 9 3m [43], [44] Fig. 9 Electrical field calculated and measured at 3m. (a) (a) Model for experiment Single Interconnection GND Connection (b) Coupling CM 1GHz CM 1GHz CM DM [36] 10 1GHz CM GND CM PCB1 PCB2 (b) S 21 0, 2, 4 mm (b) Frequency characteristics of S 21 (line length 0, 2, 4 mm) Fig. 11 (c) 6 GHz S 21 (c) S 21 by length (6 GHz) 11 Examples on influence of trace discontinuity. 383

7 2013/4 Vol. J96 B No IC PCB 11 (S 21) (b), (c) 6GHz 9mm 6dB 0.7 db/mm IC SI (a) [23] (a) Model PCB with mounted resistor (b) 1 (b) Resistor 1 and near magnetic field distribution 4. EMC PCB EMC PCB PCB PCB PCB EMC 4. 1 PCB 12 (a) (51 Ω) 1GHz (b) (c) 90 mm 51 mm 70 mm 50 Ω 4mm x-y (c) 2 (c) Resistor 2 and near magnetic field distribution 12 Fig. 12 Measured magnetic field distribution on mounted resisters. 0dBm 1GHz CP-2S NEC PCB EMC 4. 2 PCB 13 PCB 384

8 EMC (a) 50 mm (a) 50 mm width 13 PCB [48] Fig. 13 Measurement system for the influence of conductor placed on PCB. (b) 100 mm (b) 100 mm width 16 PCB (500 MHz ) Fig. 16 PCB cross sectional view of magnetic field distribution (500 MHz, calculated). 14 Fig. 14 [48] Impedance change by the spacing of conductor and trace. 15 [48] Fig. 15 Magnetic Shield Effectiveness at the center of the conductor. 35 μm 14 8mm db 16 x PCB PCB 4. 3 EMC PCB EMC mm 3 1mm mm mm 2 18 PCB PCB

9 2013/4 Vol. J96 B No. 4 PCB [51] Fig. 17 Near magnetic field measurement at the aperture model chassis. 18 PCB [51] Fig. 18 PCB sample used chassis inside. (a) PCB (a) PCB put perpendicular to aperture 19 Fig. 19 (b) PCB (b) PCB put parallel to aperture PCB (200 MHz) [50] Difference of the electric field by the rotation of PCB put in chassis. PCB COM PCB EMC PCB 19 PCB (a) (b) PCB PCB PCB GND PCB EMC EMC EMI PCB PCB EMC [1] EMC [2] EMC B vol.j90-b, no.11, pp , Nov [3] EMI B vol.j88-b, no.4, pp , April [4] B vol.j86-b, no.7, pp , July [5] T. Watanabe, H. Fujihara, O. Wada, R. Koga, and Y. Kami, A prediction method of common-mode excitation on a printed circuit board having a signal trace near the ground edge, IEICE Trans. Commun., 386

10 EMC vol.e87-b, no.8, pp , Aug [6] IC B vol.j88-b, no.10, pp , Oct [7] Y. Fu and T. Hubing, Analysis of radiated emissions from a printed circuit board using expert system algorightm, IEEE Trans. Electromagn. Compat., vol.49, no.1, pp.68 75, Feb [8] B vol.j90-b, no.2, pp , Feb [9] B vol.j90-b, no.11, pp , Nov [10] B vol.j90-b, no.11, pp , Nov [11] / EBG B vol.j90-b, no.11, pp , Nov [12] EMI B vol.j92-b, no.1, pp , Jan [13] EMI B vol.j93-b, no.2, pp , Feb [14] EMC ACCUFIELD vol.83, no.11, pp , Nov [15] B vol.j89- B, no.8, pp , Aug [16] O. Makino, F. Xiao, and Y. Kami, Characteristics of electrically long two-conductor lines with Inhomogeneous media, IEICE Trans. Commun., vol.e88-b, no.7, pp , July [17] EMC B vol.j90-b, no.11, pp , Nov [18] B vol.j88-b, no.2, pp , Feb [19] B vol.j91-b, no.8, pp , Aug [20] B vol.j91-b, no.12, pp , Dec [21] B vol.j92-b, no.1, pp , Jan [22] H. Inoue and K. Takahashi, A study on transmission characteristic of signal line with solder-mount on a PCB, Proc. 50th IEEE Holm Conference on Electrical Contacts and The 22nd ICEC, 6.4, pp , Seattle, USA, Sept [23] T. Kasuga, A. Ito, and H. Inoue, Experimental study for near magnetic field radiation from resistors mounted on PCB, IEICE Trans. Commun., vol.e90- B, no.6, pp , June [24] Y. Kayano and H. Inoue, A study on electromagnetic coupling between transmission line on model chip, Proc. IEEE Int. Symp. EMC, THU-AM-2-4, Detroit, Aug [25] Y. Kayano and H. Inoue, Transmission and coupling characteristics of transmission line in IC chip, Proc. Int. Symp. EMC, pp , Kyoto Japan, July [26] Y. Kayano, R. Yanagisawa, and H. Inoue, Negative group delay circuit fabricated in an integrated circuit chip, Proc Asia-Pacific Int. Symp. EMC, pp , Beijing China, April [27] R. Yanagisawa, Y. Kayano, and H. Inoue, Left hand mode transmission line characteristics made by F- SIR on PCB, IEICE Trans. Commun., vol.e93-b, no.7, pp , July [28] PCB FDTD C vol.j85-c, no.4, pp , April [29] T. Kasuga and H. Inoue, Estimation for wideband electromagnetic field distribution from printed circuit board with switching transistor, IEICE Trans. Electron., vol.e86-c, no.6, pp , June [30] Y. Kayano, G. Feng, J. Fan, and H. Inoue, Physicsbased equivalent circuit model for predicting EM radiation from stripline structure with one gapped reference plane (Part 2), EMCJ /MW , Oct [31] EMD , March [32] Y. Kayano, M. Tanaka, J.L. Drewniak, and H. Inoue, Common-mode current due to a trace near a PCB edge and its suppression by a guard band, IEEE Trans. Electromagn. Compat., vol.46, no.1, pp.46 53, Feb [33] Y. Kayano, M. Tanaka, and H. Inoue, Identifying the frequency response of common-mode current on a cable attached to a PCB, IEICE Trans. Electron., vol.e87-c, no.8, pp , Aug [34] Y. Kayano, M. Tanaka, and H. Inoue, Radiated emission from a PCB with an attached cable resulting from a nonzero ground plane impedance, Proc. IEEE Int. Symp. EMC, Chicago, IL, pp , Aug [35] Y. Kayano, M. Tanaka, and H. Inoue, PCB struc- 387

11 2013/4 Vol. J96 B No. 4 ture with a guard band for suppressing electromagnetic radiation, IEICE Trans. Commun., vol.e88-b, no.8, pp , Aug [36] Y. Kayano, M. Tanaka, and H. Inoue, Correspondence of common- and differential-mode components on EM radiation from surface microstrip line structure, IEICE Trans. Electron., vol.e88-c, no.8, pp , Aug [37] Y. Kayano and H. Inoue, Prediction of EM radiation from a PCB driven by a connected feed cable, IEICE Trans. Commun., vol.e92-b, no.6, pp , June [38] Y. Kayano and H. Inoue, A study on characteristics of EM radiation from strip line structure, Radio Science, vol.46, RS0F06, Oct [39] T. Kasuga, M. Tanaka, and H. Inoue, Estimation of spatial distribution of wideband electromagnetic noise around a printed circuit board, IEICE Trans. Commun., vol.e86-b, no.7, pp , July [40] K. Takahashi, T. Kasuga, and H. Inoue, A study on transmission characteristics and EM field distributions on the transmission lines with difference of structure IEICE Trans. Electron., vol.e87-c, no.8, pp , Aug [41] Y. Kayano, M. Tanaka, and H. Inoue, Electromagnetic radiation resulting from two signal traces on a printed circuit board, IEICE Trans. Electron., vol.e89-c, no.8, pp , Aug [42] T. Kasuga, K. Takahashi, and H. Inoue, Transmission characteristics and radiated noise of the parallel transmission lines with angled pattern, IEICE Trans. Electron., vol.e89-c, no.8, pp , Aug [43] Y. Kayano and H. Inoue, EMI resulting from interconnected printed circuit boards by a coaxial cable, Proc. IEEE Int. Symp. EMC, WE-AH-7-2, Honolulu, July [44] Y. Kayano and H. Inoue, EM radiation from interconnected surface-microstrip line structures by a coaxial cable, Proc. IEEE Int. Symp. EMC, WE- AM-2-4, Austin, Aug [45] Y. Kayano and H. Inoue, Identifying EM radiation from a printed circuit board driven by differentialsignaling, Trans. JIEP, vol.3, no.1, pp.24 30, Dec [46] Y. Kayano, K. Mimura, and H. Inoue, Evaluation of imbalance component and EM radiation generated by an asymmetrical differential-paired lines structure, Trans. JIEP, vol.4, no.1, pp.6 16, Dec [47] M. Tanaka, H. Takita, H. Inoue, Y. Maeda, M. Umehara, and M. Tsunashima, An experimental study on new Ag coated fabrics as shielding material for electromagnetic radiation from PCB, IEICE Trans. Electron., vol.e86-c, no.6, pp , June [48] M. Tanaka, H. Takita, and H. Inoue, Effect of conductive sheet placed over PCB on electromagnetic noise shielding IEICE Trans. Commun., vol.e86-b, no.3, pp , March [49] M. Tanaka, H. Takita, and H. Inoue, A study on the effect of grounded conductive sheet placed over PCB for electromagnetic noise shielding, IEICE Trans. Electron., vol.e89-c, no.1, pp.77 79, Jan [50] S. Miyata, Y. Kayano, and H. Inoue, EM radiation through aperture of metallic enclosure with a PCB inside, Proc Asia-Pacific Symposium EMC, pp , Singapore, May [51] EMC no.261, pp.67 79, [52] D.M. Pozer, Microwave Engineering, John Wiley & Sons, New York, EMC IEEE EMC IEEE 388

5b_08.dvi

5b_08.dvi , Circularly Polarized Patch Antennas Combining Different Shaped Linealy Polarized Elements Takanori NORO,, Yasuhiro KAZAMA, Masaharu TAKAHASHI, and Koichi ITO 1. GPS LAN 10% [1] Graduate School of Science