Microsoft PowerPoint MPSoC-KojiInoue-web.pptx

Size: px
Start display at page:

Download "Microsoft PowerPoint MPSoC-KojiInoue-web.pptx"

Transcription

1 Adaptive Execution on 3D Microprocessors Koji Inoue Kyushu University 1

2 Outline Why 3D? Will 3D always work well? work well? Support Adaptive Execution! Memory Hierarchy Run time Optimization Conclusions 2

3 Outline Why 3D? Will 3D always work well? work well? Support Adaptive Execution! Memory Hierarchy Run time Optimization Conclusions 3

4 From 2D to 3D! (not only TV) only Stack Multiple Dies Connect Dies with Through Silicon Vias Multi Level 3D IC Sensor IO Analog DRAM Processor 4

5 Chip Implementation Examples from ISSCC 09 Image Sensors SRAM for SoCs DRAM Multi core core + SRAM connected with wireless TSVs wireless U. Kang et al., 8Gb DDR3 DRAM Using Through Silicon Via Technology, ISSCC 09. H. Saito et al., A Chip Stacked Memory for On Chip SRAM Rich SoCs and Processors, ISSCC 09. V. Suntharalingam et al., A 4 Side Tileable Back Illuminated 3D Integrated Mpixel CMOS Image Sensor, ISSCC 09. K. Niitsu et al., An Inductive Coupling Link for 3D Integration of a 90nm CMOS Processor and a 65nm CMOS SRAM, ISSCC 09. 5

6 Why 3D? (1/2) Wire Length Reduction Replace long, high capacitance wires by TSVs g p Low Latency, Low Energy Small footprint llf t 6

7 Why 3D? (2/2) Integration From Off Chip to On Chip p Improved Communication Low Latency, High Bandwidth, and Low EnergyLatency and Heterogeneous Integration E.g. Emerging DevicesE i 7

8 Outline Why 3D? Will 3D always work well? work well? Support Adaptive Execution! Memory Hierarchy Run time Optimization Conclusions 8

9 Importance of On Chip Caches Memory Wall Problem Memory bandwidth does not scale with the # of cores does not scale with the of cores Growing speed gap between processor cores and DRAMs So, Becomes more serious Let s increase on chip cache capacity, but Requires large chip area 9

10 Will 3D always work well? Stacking a DRAM Cache L1 Hit Time L1 Miss Rate L2 Hit Time L2 Miss Rate Main Memory Access Time AMAT Ave. Memory Acc. Time MemoryAcc Impact of DRAM Stacking L1 L1 L 2 L 2 HT MR HT MR? MMAT 32MB DRAM Cache 10

11 Cache Size Sensitivity Varies among Programs! Sensitivity among L2 2 Miss Rat tes [%] Ocean 10 Barnes Raytrace 0 LU Cholesky WaterSpatial Sensitive! FFT Sensitive! Sensitive! FMM Insensitive! Insensitive! Insensitive! 2MB 4MB 8MB 16MB 32MB 64MB 128MB L2 Size 11

12 Profit Better 3D 32MB DRAM Cache 2D vs. 3D 172.mgrid LU 171.swim FMM Ocean 181.mcf 256.bzip2 WaterSpatial Cholesky ammp 0 0 2D 2MB SRAM Cache Barnes MRL2_REDUTION[points] 200 FFT 179.art 300.twolf 301.apsi HTL2_OVERHEAD[cc] Profit MR L2 _ REDUCTION HT L2_ OVERHEAD MMAT

13 Appropriate Cache Size Varies within Programs! The lower, the better 350 2MB(12cc) 32MB(60cc) Ocean 300 Miss [cc] L Time Interval (100K L2 Accesses / Interval) 13

14 Outline Why 3D? Will 3D always work well? work well? Adaptive Execution! Memory Hierarchy Run time Optimization Conclusions 14

15 Will 3D always work well? Stacking a DRAM Cache L1 Hit Time L1 Miss Rate L2 Hit Time L2 Miss Rate Main Memory Access Time AMAT Ave. Memory Acc. Time MemoryAcc Impact of DRAM Stacking L1 L1 L 2 L 2 HT MR HT MR? MMAT 32MB DRAM Cache 15

16 SRAM/DRAM Hybrid Cache Architecture Architecture Support Two Operation Modes High Speed, Small Cache Mode (or SRAM Cache Mode) Low Speed, Large Cache Mode (or DRAM Cache Mode) Adapt to variation of application behaviorto of application 32MB DRAM Cache 32MB DRAM Cache (Power Gated) DRAM Cache Mode Mode SRAM Cache Mode 16

17 Microarchitecture (1/2) Tag Way 0 Way 1 Tag Way 0 Way 1 2way set associative SRAM Cache 32MB DRAM Cache 2way set associative associative DRAM Cache 17

18 Microarchitecture (2/2) SARM(Size : Cs, Block : Ls, Asso. Ws) Tag field 58 - ID 64b physical address 58 - IS I IS Offset Index Assume Ld==Ls==64B ID DARM(Size : d Block : Ld, Asso. Wd) IS LS LS 58 - I S C D LS W lg CS L D W S D ID 58 - IS 58 - IS I I D S MUX L LS CS lg L S W C D lg L D W S D Data (SRAM) = = MUX Hit/Miss (SRAM) 58 - ID 58 - ID = = ID Hit/Miss (DRAM) L D L D MUX Data (DRAM) L D 18

19 How to Adapt 50 Static Approach 40 Optimizes at program level Does not change it during i 10 execution 0 Needs a static analysis Dynamic Approach Optimizes at interval level (or phase level) Needs a run time profiling [%] L2 Cach he Miss Rates L1 Miss Pena alty [cc] FFT FMM Barnes 2MB 4MB 8MB 16MB 32MB 64MB 128MB L2 Cache Size 2MB(12cc) 32MB(60cc) Ocean Interval 19

20 if Run Time Mode Selection Divide Program Execution into epochs, e.g. 200K L2 Misses Predict an Appropriate Operation Mode for Next Epoch On SRAM mode, a small tag RAM which stores sampled tags is used to predict DRAM mode miss rates Hardware Support for Measurement MR L2SRAM HT L 2 DRAM HT L 2 SRAM AveOverhead MRL2DRAM MMAT then transit from SRAM mode to DRAM mode! epoch N 1 N N+1 N+2 Operation Mode 32MB DRAM Cache (Power Gated) 32MB DRAM Cache (Power Gated) 32MB DRAM Cache (Power Gated) 32MB DRAM Cache SRAM Cache Mode DRAM Cache Mode 20

21 Experimental Set Up Processor: In Order Benchmarks: SPEC CPU 2000, Splash2 SRAM Cache Mode DRAM Cache Mode Core L1 Cache Size:32KB Access Time : 2clock cycles Core L1 Cache L2 Cache Size : 2MB Access Time : 6clock cycles Size : 32MB Access Time : 28clock cycles L2 Cache Main Memory Access Time 181clock cycles Main Memory 21

22 Results D SRAM DRAM STACK HYBRID IDEALIDEAL HYBRID ed AMAT Normaliz ammp art bzip2 mcf mgrid swim twolf Cholesky FFT FMM LU Ocean Benchmark Program 22

23 Results ed AMAT Normaliz HYBRID 2D SRAM DRAM STACK HYBRID IDEAL 1 IDEAL HYBRID Accu uracy of Mo ode Selecti ion mgrid swim twolf ammp art bzip2 mcf mgrid swim twolf Cholesky FFT FMM LU Ocean Benchmark Program 23

24 Results 2 ed AMAT Normaliz HYBRID 2D SRAM DRAM STACK HYBRID IDEALIDEAL HYBRID on Accurac cy of Mod de Selecti bzip2 ammp art bzip2 mcf mgrid swim twolf Cholesky FFT FMM LU Ocean Benchmark Program Cholesky 24

25 Conclusions The 3D solution is one of the most promising ways to achieve High performance Low energy It does not ALWAYS work well! Run time adaptive execution by considering memoryaccess memory access behavior 25

26 Acknowledgement This research was supported in part by New Energy and Industrial Technology Development Organization 26

DRAM L2 L2 DRAM L2 DRAM L2 RAM DRAM 3 DRAM 3. 1 DRAM SRAM/DRAM 2. SRAM/DRAM DRAM LLC Last Level Cache 2 2) DRAM 1(A) (B) LLC L2 DRAM DRAM L2 SRAM DRAM

DRAM L2 L2 DRAM L2 DRAM L2 RAM DRAM 3 DRAM 3. 1 DRAM SRAM/DRAM 2. SRAM/DRAM DRAM LLC Last Level Cache 2 2) DRAM 1(A) (B) LLC L2 DRAM DRAM L2 SRAM DRAM SRAM/DRAM 1 1 2 2 3 DRAM DRAM 2 SRAM/DRAM 1) 1) L2 3.01 1.17 Run-time Operation-Mode Management on SRAM/DRAM Hybrid Cache SHINYA HASHIGUCHI, 1 NAOTO FUKUMOTO, 1 KOJI INOUE 2 and KAZUAKI MURAKAMI 2 3D stacked

More information

Vol.-ARC-8 No.8 Vol.-OS- No.8 // DRAM DRAM DRAM DRAM ) DRAM. DRAM. ) DRAM DRAM DRAM DRAM DRAM SRAM DRAM MB B MB DRAM SRAM.. DRAM DRAM SRAM DRAM SRAM C

Vol.-ARC-8 No.8 Vol.-OS- No.8 // DRAM DRAM DRAM DRAM ) DRAM. DRAM. ) DRAM DRAM DRAM DRAM DRAM SRAM DRAM MB B MB DRAM SRAM.. DRAM DRAM SRAM DRAM SRAM C IPSJ SIG Technical Report Vol.-ARC-8 No.8 Vol.-OS- No.8 // DRAM- DRAM DRAM DRAM % % On-Chip Memory Architecture for DRAM Stacking Microprocessors SHINYA HASHIGUCHI, TAKATSUGU ONO, KOJI INOUE and KAZUAKI

More information

Microsoft PowerPoint - ARC2009HashiguchiSlides.pptx

Microsoft PowerPoint - ARC2009HashiguchiSlides.pptx 3 次元 DRAM プロセッサ積層実装を 対象としたオンチップ メモリ アーキテクチャの提案と評価 橋口慎哉 小野貴継 ( 現 ) 井上弘士 村上和彰 九州大学大学院システム情報科学府 九州大学大学院システム情報科学研究院 発表手順 研究背景 研究目的 ハイブリッド キャッシュ アーキテクチャ 評価実験 まとめと今後の課題 2 3 次元実装技術 研究背景 グローバル配線長の削減 チップ面積縮小 異なるプロセスを経て製造されたダイ同士の積層

More information

16.16%

16.16% 2017 (411824) 16.16% Abstract Multi-core processor is common technique for high computing performance. In many multi-core processor architectures, all processors share L2 and last level cache memory. Thus,

More information

4.1 % 7.5 %

4.1 % 7.5 % 2018 (412837) 4.1 % 7.5 % Abstract Recently, various methods for improving computial performance have been proposed. One of these various methods is Multi-core. Multi-core can execute processes in parallel

More information

FabHetero FabHetero FabHetero FabCache FabCache SPEC2000INT IPC FabCache 0.076%

FabHetero FabHetero FabHetero FabCache FabCache SPEC2000INT IPC FabCache 0.076% 2013 (409812) FabHetero FabHetero FabHetero FabCache FabCache SPEC2000INT 6 1000 IPC FabCache 0.076% Abstract Single-ISA heterogeneous multi-core processors are increasing importance in the processor architecture.

More information

untitled

untitled 3 inoue@ait.kyushu u.ac.jp 1 3D 3? 2 2D 3D! Through Silicon Via:TSV Wire bonding (WB) 3D stacking (System in Package or SiP) TSV Package on Package (POP) 3D stacking Source: Yuan Zie, 3D IC Design/Architecture,

More information

mobicom.dvi

mobicom.dvi 13Dynamic Voltage Scaling on a Low-Power Microprocessor Johan Pouwelse 5 Koen Langendoen Henk Sips Faculty of Information Technology and Systems Delft University of Technology, The Netherlands 1 78724

More information

,4) 1 P% P%P=2.5 5%!%! (1) = (2) l l Figure 1 A compilation flow of the proposing sampling based architecture simulation

,4) 1 P% P%P=2.5 5%!%! (1) = (2) l l Figure 1 A compilation flow of the proposing sampling based architecture simulation 1 1 1 1 SPEC CPU 2000 EQUAKE 1.6 50 500 A Parallelizing Compiler Cooperative Multicore Architecture Simulator with Changeover Mechanism of Simulation Modes GAKUHO TAGUCHI 1 YOUICHI ABE 1 KEIJI KIMURA 1

More information

Microsoft PowerPoint - MATE2010Inoue.pptx

Microsoft PowerPoint - MATE2010Inoue.pptx 3 次元積層が可能にする 次世代マイクロプロセッサ アーキテクチャ 九州大学井上こうじ (inoue@ait.kyushu u.a.jp) 1 More Than Moore を目指して なぜ 3 次元積層なのか? 2 半導体も 2D から 3D の世界へ! 複数のダイを同一パッケージに集積 ダイ間を貫通ビア (Through Silion Via:TSV) で接続 Wire bonding (WB)

More information

IPSJ SIG Technical Report Vol.2013-ARC-203 No /2/1 SMYLE OpenCL (NEDO) IT FPGA SMYLEref SMYLE OpenCL SMYLE OpenCL FPGA 1

IPSJ SIG Technical Report Vol.2013-ARC-203 No /2/1 SMYLE OpenCL (NEDO) IT FPGA SMYLEref SMYLE OpenCL SMYLE OpenCL FPGA 1 SMYLE OpenCL 128 1 1 1 1 1 2 2 3 3 3 (NEDO) IT FPGA SMYLEref SMYLE OpenCL SMYLE OpenCL FPGA 128 SMYLEref SMYLE OpenCL SMYLE OpenCL Implementation and Evaluations on 128 Cores Takuji Hieda 1 Noriko Etani

More information

5 7 3AS40AS 33 38 45 54 3 4 5 4 9 9 34 5 5 38 6 8 5 8 39 8 78 0 9 0 4 3 6 4 8 3 4 5 9 5 6 44 5 38 55 4 4 4 4 5 33 3 3 43 6 6 5 6 7 3 6 0 8 3 34 37 /78903 4 0 0 4 04 6 06 8 08 /7 AM 9:3 5 05 7 07 AM 9

More information

2

2 8 23 32A950S 30 38 43 52 2 3 23 40 10 33 33 11 52 4 52 7 28 26 7 8 8 18 5 6 7 9 8 17 7 7 7 38 10 12 9 23 22 22 8 53 8 8 8 8 1 2 3 17 11 52 52 19 23 29 71 29 41 55 22 22 22 22 22 55 8 18 31 9 9 54 71 44

More information

ABSTRACT The movement to increase the adult literacy rate in Nepal has been growing since democratization in 1990. In recent years, about 300,000 peop

ABSTRACT The movement to increase the adult literacy rate in Nepal has been growing since democratization in 1990. In recent years, about 300,000 peop Case Study Adult Literacy Education as an Entry Point for Community Empowerment The Evolution of Self-Help Group Activities in Rural Nepal Chizu SATO Masamine JIMBA, MD, PhD, MPH Izumi MURAKAMI, MPH Massachusetts

More information

23 Fig. 2: hwmodulev2 3. Reconfigurable HPC 3.1 hw/sw hw/sw hw/sw FPGA PC FPGA PC FPGA HPC FPGA FPGA hw/sw hw/sw hw- Module FPGA hwmodule hw/sw FPGA h

23 Fig. 2: hwmodulev2 3. Reconfigurable HPC 3.1 hw/sw hw/sw hw/sw FPGA PC FPGA PC FPGA HPC FPGA FPGA hw/sw hw/sw hw- Module FPGA hwmodule hw/sw FPGA h 23 FPGA CUDA Performance Comparison of FPGA Array with CUDA on Poisson Equation (lijiang@sekine-lab.ei.tuat.ac.jp), (kazuki@sekine-lab.ei.tuat.ac.jp), (takahashi@sekine-lab.ei.tuat.ac.jp), (tamukoh@cc.tuat.ac.jp),

More information

はじめに

はじめに IT 1 NPO (IPEC) 55.7 29.5 Web TOEIC Nice to meet you. How are you doing? 1 type (2002 5 )66 15 1 IT Java (IZUMA, Tsuyuki) James Robinson James James James Oh, YOU are Tsuyuki! Finally, huh? What's going

More information

2

2 8 23 26A800032A8000 31 37 42 51 2 3 23 37 10 11 51 4 26 7 28 7 8 7 9 8 5 6 7 9 8 17 7 7 7 37 10 13 12 23 21 21 8 53 8 8 8 8 1 2 3 17 11 51 51 18 23 29 69 30 39 22 22 22 22 21 56 8 9 12 53 12 56 43 35 27

More information

2

2 8 22 19A800022A8000 30 37 42 49 2 3 22 37 10 11 49 4 24 27 7 49 7 8 7 9 8 5 6 7 9 8 16 7 7 7 37 10 11 20 22 20 20 8 51 8 8 9 17 1 2 3 16 11 49 49 17 22 28 48 29 33 21 21 21 21 20 8 10 9 28 9 53 37 36 25

More information

19_22_26R9000操作編ブック.indb

19_22_26R9000操作編ブック.indb 8 19R900022R900026R9000 25 34 44 57 67 2 3 4 10 37 45 45 18 11 67 25 34 39 26 32 43 7 67 7 8 7 9 8 5 7 9 21 18 19 8 8 70 8 19 7 7 7 45 10 47 47 12 47 11 47 36 47 47 36 47 47 24 35 8 8 23 12 25 23 OPEN

More information

2

2 L C -24K 9 L C -22K 9 2 3 4 5 6 7 8 9 10 11 12 11 03 AM 04 05 0 PM 1 06 1 PM 07 00 00 08 2 PM 00 4 PM 011 011 021 041 061 081 051 071 1 2 4 6 8 5 7 00 00 00 00 00 00 00 00 30 00 09 00 15 10 3 PM 45 00

More information

L C -6D Z3 L C -0D Z3 3 4 5 6 7 8 9 10 11 1 13 14 15 16 17 OIL CLINIC BAR 18 19 POWER TIMER SENSOR 0 3 1 3 1 POWER TIMER SENSOR 3 4 1 POWER TIMER SENSOR 5 11 00 6 7 1 3 4 5 8 9 30 1 3 31 1 3 1 011 1

More information

GPGPU

GPGPU GPGPU 2013 1008 2015 1 23 Abstract In recent years, with the advance of microscope technology, the alive cells have been able to observe. On the other hand, from the standpoint of image processing, the

More information

Sport and the Media: The Close Relationship between Sport and Broadcasting SUDO, Haruo1) Abstract This report tries to demonstrate the relationship be

Sport and the Media: The Close Relationship between Sport and Broadcasting SUDO, Haruo1) Abstract This report tries to demonstrate the relationship be Sport and the Media: The Close Relationship between Sport and Broadcasting SUDO, Haruo1) Abstract This report tries to demonstrate the relationship between broadcasting and sport (major sport and professional

More information

26 FPGA 11 05340 1 FPGA (Field Programmable Gate Array) ASIC (Application Specific Integrated Circuit) FPGA FPGA FPGA FPGA Linux FreeDOS skewed way L1

26 FPGA 11 05340 1 FPGA (Field Programmable Gate Array) ASIC (Application Specific Integrated Circuit) FPGA FPGA FPGA FPGA Linux FreeDOS skewed way L1 FPGA 272 11 05340 26 FPGA 11 05340 1 FPGA (Field Programmable Gate Array) ASIC (Application Specific Integrated Circuit) FPGA FPGA FPGA FPGA Linux FreeDOS skewed way L1 FPGA skewed L2 FPGA skewed Linux

More information

2

2 8 24 32C800037C800042C8000 32 40 45 54 2 3 24 40 10 11 54 4 7 54 30 26 7 9 8 5 6 7 9 8 18 7 7 7 40 10 13 12 24 22 22 8 55 8 8 8 8 1 2 3 18 11 54 54 19 24 30 69 31 40 57 23 23 22 23 22 57 8 9 30 12 12 56

More information

Microsoft PowerPoint IEEE関西3D(ハンドアウト).pptx

Microsoft PowerPoint IEEE関西3D(ハンドアウト).pptx 3 次元積層マイクロプロセッサ 解決すべき課題と将来展望 九州 学井上こうじ (inoue@ait.kyushu-u.ac.jp) 1 世の中いたる所で 3D なぜ 3 次元積層なのか? 2 半導体も 2D から 3D の世界へ! 複数のダイを同 パッケージに集積 ダイ間を貫通ビア (Through Silicon Via:TSV) で接続 Wire-bonding (WB) 3D stacking

More information

<95DB8C9288E397C389C88A E696E6462>

<95DB8C9288E397C389C88A E696E6462> 2011 Vol.60 No.2 p.138 147 Performance of the Japanese long-term care benefit: An International comparison based on OECD health data Mie MORIKAWA[1] Takako TSUTSUI[2] [1]National Institute of Public Health,

More information

Express5800/R110a-1Hユーザーズガイド

Express5800/R110a-1Hユーザーズガイド 4 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Xeon Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0B60: DIMM group #1 has been disabled. : Press to resume, to

More information

Microsoft Word - PrivateAccess_UM.docx

Microsoft Word - PrivateAccess_UM.docx `````````````````SIRE Page 1 English 3 日本語 7 Page 2 Introduction Welcome to! is a fast, simple way to store and protect critical and sensitive files on any ixpand Wireless Charger. Create a private vault

More information

Chip Size and Performance Evaluations of Shared Cache for On-chip Multiprocessor Takahiro SASAKI, Tomohiro INOUE, Nobuhiko OMORI, Tetsuo HIRONAKA, Han

Chip Size and Performance Evaluations of Shared Cache for On-chip Multiprocessor Takahiro SASAKI, Tomohiro INOUE, Nobuhiko OMORI, Tetsuo HIRONAKA, Han Chip Size and Performance Evaluations of Shared Cache for On-chip Multiprocessor Takahiro SASAKI, Tomohiro INOUE, Nobuhiko OMORI, Tetsuo HIRONAKA, Hans J. MATTAUSCH, and Tetsushi KOIDE 1 1 2 0.5 µm CMOS

More information

5 30 B36B3 4 5 56 6 7 3 4 39 4 69 5 56 56 60 5 8 3 33 38 45 45 7 8 4 33 5 6 8 8 8 57 60 8 3 3 45 45 8 9 4 4 43 43 43 43 4 3 43 8 3 3 7 6 8 33 43 7 8 43 40 3 4 5 9 6 4 5 56 34 6 6 6 6 7 3 3 3 55 40 55

More information

6 50G5S 3 34 47 56 63 http://toshibadirect.jp/room048/ 74 8 9 3 4 5 6 3446 4755 566 76373 7 37 3 8 8 3 3 74 74 79 8 30 75 0 0 4 4 0 7 63 50 50 3 3 6 3 5 4 4 47 7 48 48 48 48 7 36 48 48 3 36 37 6 3 3 37

More information

H8000操作編

H8000操作編 8 26 35 32H800037H800042H8000 49 55 60 72 2 3 4 48 7 72 32 28 7 8 9 5 7 9 22 43 20 8 8 8 8 73 8 13 7 7 7 55 10 49 49 13 37 49 49 49 49 49 49 12 50 11 76 8 24 26 24 24 6 1 2 3 18 42 72 72 20 26 32 80 34

More information

Kyushu Communication Studies 第2号

Kyushu Communication Studies 第2号 Kyushu Communication Studies. 2004. 2:1-11 2004 How College Students Use and Perceive Pictographs in Cell Phone E-mail Messages IGARASHI Noriko (Niigata University of Health and Welfare) ITOI Emi (Bunkyo

More information

6 3 34 50G5 47 56 63 74 8 9 3 4 5 6 3446 4755 566 76373 7 37 3 8 8 3 3 74 74 79 8 30 75 0 0 4 4 0 7 63 50 50 3 3 6 3 5 4 4 47 7 48 48 48 48 7 36 48 48 3 36 37 6 3 3 37 9 00 5 45 3 4 5 5 80 8 8 74 60 39

More information

VLSI工学

VLSI工学 2008//5/ () 2008//5/ () 2 () http://ssc.pe.titech.ac.jp 2008//5/ () 3!! A (WCDMA/GSM) DD DoCoMo 905iP905i 2008//5/ () 4 minisd P900i SemiConsult SDRAM, MPEG4 UIMIrDA LCD/ AF ADC/DAC IC CCD C-CPUA-CPU DSPSRAM

More information

N Express5800/R320a-E4 N Express5800/R320a-M4 ユーザーズガイド

N Express5800/R320a-E4  N Express5800/R320a-M4  ユーザーズガイド 7 7 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Pentium III Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0212: Keybord Controller Failed. : Press to resume, to setup

More information

Express5800/R320a-E4, Express5800/R320b-M4ユーザーズガイド

Express5800/R320a-E4, Express5800/R320b-M4ユーザーズガイド 7 7 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Pentium III Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0212: Keybord Controller Failed. : Press to resume, to setup

More information

6 4 4 9RERE6RE 5 5 6 7 8 9 4 5 6 4 4 5 6 8 4 46 5 7 54 58 60 6 69 7 8 0 9 9 79 0 4 0 0 4 4 60 6 9 4 6 46 5 4 4 5 4 4 7 44 44 6 44 8 44 46 44 44 4 44 0 4 4 5 4 8 6 0 4 0 4 4 5 45 4 5 50 4 58 60 57 54

More information

Express5800/320Fa-L/320Fa-LR

Express5800/320Fa-L/320Fa-LR 7 7 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Pentium III Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0212: Keybord Controller Failed. : Press to resume, to setup

More information

DRAM SRAM SDRAM (Synchronous DRAM) DDR SDRAM (Double Data Rate SDRAM) DRAM 4 C Wikipedia 1.8 SRAM DRAM DRAM SRAM DRAM SRAM (256M 1G bit) (32 64M bit)

DRAM SRAM SDRAM (Synchronous DRAM) DDR SDRAM (Double Data Rate SDRAM) DRAM 4 C Wikipedia 1.8 SRAM DRAM DRAM SRAM DRAM SRAM (256M 1G bit) (32 64M bit) 2016.4.1 II ( ) 1 1.1 DRAM RAM DRAM DRAM SRAM RAM SRAM SRAM SRAM SRAM DRAM SRAM SRAM DRAM SRAM 1.2 (DRAM, Dynamic RAM) (SRAM, Static RAM) (RAM Random Access Memory ) DRAM 1 1 1 1 SRAM 4 1 2 DRAM 4 DRAM

More information

1 142

1 142 7 1 2 3 4 5 6 7 8 1 142 PhoenixBIOS Setup Utility MainSystem DevicesSecurityPowerOthersBootExit System Time: [XX:XX:XX] Item Specific Help System Date: [XX/XX/XXXX] Floppy Drive: 1.44MB, 3 1 / 2" Hard

More information

Express5800/320Fc-MR

Express5800/320Fc-MR 7 7 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Pentium III Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0212: Keybord Controller Failed. : Press to resume, to setup

More information

Introduction Purpose This training course demonstrates the use of the High-performance Embedded Workshop (HEW), a key tool for developing software for

Introduction Purpose This training course demonstrates the use of the High-performance Embedded Workshop (HEW), a key tool for developing software for Introduction Purpose This training course demonstrates the use of the High-performance Embedded Workshop (HEW), a key tool for developing software for embedded systems that use microcontrollers (MCUs)

More information

6 4 45 7ZS 5 59 7 8 94 05 4 5 6 4 5 5 6 8 8 40 45 48 56 60 64 66 66 68 7 78 80 8 7 8 0 0 0 90 0 57 64 69 66 66 69 0 4 4 4 4 4 0 7 48 5 4 4 5 4 4 4 7 46 46 6 46 8 46 48 46 46 4 46 46 4 4 5 4 6 4 9 9 0

More information

技術研究報告第26号

技術研究報告第26号 1) 2) 3) 250Hz 500Hz RESEARCH ON THE PHYSICAL VOLUME OF THE DYNAMIC VIBRATION RESPONSE AND THE REDUCTION OF THE FLOOR IMPACT SOUND LEVEL IN FLOORS OF RESIDENTIAL HOUSING Hideo WATANABE *1 This study was

More information

Express5800/R320a-E4/Express5800/R320b-M4ユーザーズガイド

Express5800/R320a-E4/Express5800/R320b-M4ユーザーズガイド 7 7 障害箇所の切り分け 万一 障害が発生した場合は ESMPRO/ServerManagerを使って障害の発生箇所を確認し 障害がハー ドウェアによるものかソフトウェアによるものかを判断します 障害発生個所や内容の確認ができたら 故障した部品の交換やシステム復旧などの処置を行います 障害がハードウェア要因によるものかソフトウェア要因によるものかを判断するには E S M P R O / ServerManagerが便利です

More information

2 3 12 13 6 7

2 3 12 13 6 7 2 8 17 42ZH700046ZH700052ZH7000 28 43 54 63 74 89 2 3 12 13 6 7 3 4 11 21 34 63 65 8 17 4 11 4 55 12 12 10 77 56 12 43 43 13 30 43 43 43 43 10 45 14 25 9 23 74 23 19 24 43 8 26 8 9 9 4 8 30 42 82 18 43

More information

設計現場からの課題抽出と提言 なぜ開発は遅れるか?その解決策は?

設計現場からの課題抽出と提言 なぜ開発は遅れるか?その解決策は? Work in Progress - Do not publish STRJ WS: March 4, 2004, WG1 1 WG1: NEC STARC STARC Work in Progress - Do not publish STRJ WS: March 4, 2004, WG1 2 WG1 ITRS Design System Drivers SoC EDA Work in Progress

More information

2 1997 1M SRAM 1 25 ns 1 100 250 1,000 DRAM 60 120 ns 50 5 10 50 10 20 ms 5,000,000 0.1 0.2 1

2 1997 1M SRAM 1 25 ns 1 100 250 1,000 DRAM 60 120 ns 50 5 10 50 10 20 ms 5,000,000 0.1 0.2 1 1 2 1997 1M SRAM 1 25 ns 1 100 250 1,000 DRAM 60 120 ns 50 5 10 50 10 20 ms 5,000,000 0.1 0.2 1 CPU 1 1 2 2 n CPU SRAM DRAM CPU 3 4 5 6 7 N+ N+ P SRAM DRAM 8 Computer Architecture 9 DRAM 3 4 10 11 Ta 2

More information

Z7000操作編_本文.indb

Z7000操作編_本文.indb 2 8 17 37Z700042Z7000 46Z7000 28 42 52 61 72 87 2 3 12 13 6 7 3 4 11 21 34 61 8 17 4 11 4 53 12 12 10 75 18 12 42 42 13 30 42 42 42 42 10 62 66 44 55 14 25 9 62 65 23 72 23 19 24 42 8 26 8 9 9 4 11 18

More information

橡最終原稿.PDF

橡最終原稿.PDF GIS Simulation analysis of disseminate of disaster information using GIS * ** *** Toshitaka KATADAJunsaku ASADA and Noriyuki KUWASAWA GIS GIS AbstractWe have developed the simulation model expressing the

More information

6 4 45 ZS7ZS4ZS 5 59 7 8 94 05 4 5 6 4 5 5 6 8 8 40 45 48 56 60 64 66 66 68 7 78 80 8 7 8 0 0 0 90 0 0 4 4 4 4 6 57 64 69 66 66 66 69 4 0 7 48 5 4 4 5 4 4 4 7 46 46 6 46 8 46 48 46 46 4 46 46 4 4 5 4

More information

Core1 FabScalar VerilogHDL Cache Cache FabScalar 1 CoreConnect[2] Wishbone[3] AMBA[4] AMBA 1 AMBA ARM L2 AMBA2.0 AMBA2.0 FabScalar AHB APB AHB AMBA2.0

Core1 FabScalar VerilogHDL Cache Cache FabScalar 1 CoreConnect[2] Wishbone[3] AMBA[4] AMBA 1 AMBA ARM L2 AMBA2.0 AMBA2.0 FabScalar AHB APB AHB AMBA2.0 AMBA 1 1 1 1 FabScalar FabScalar AMBA AMBA FutureBus Improvement of AMBA Bus Frame-work for Heterogeneos Multi-processor Seto Yusuke 1 Takahiro Sasaki 1 Kazuhiko Ohno 1 Toshio Kondo 1 Abstract: The demand

More information

cpu2007lectureno2.ppt

cpu2007lectureno2.ppt Cache Cache Cache cache cache 17.10.2007 1 17.10.2007 2 Cache Register:FF circuits Cache:Bipolar,CMOS SRAM Main Storage:SRAM,DRAM Disk Cache:DRAM 17.10.2007 3 SRAM Cell Structure (1 bit) 17.10.2007 4 temporal

More information

1 2 3

1 2 3 INFORMATION FOR THE USER DRILL SELECTION CHART CARBIDE DRILLS NEXUS DRILLS DIAMOND DRILLS VP-GOLD DRILLS TDXL DRILLS EX-GOLD DRILLS V-GOLD DRILLS STEEL FRAME DRILLS HARD DRILLS V-SELECT DRILLS SPECIAL

More information

2

2 L C -60W 7 2 3 4 5 6 7 8 9 0 2 3 OIL CLINIC BAR 4 5 6 7 8 9 2 3 20 2 2 XXXX 2 2 22 23 2 3 4 5 2 2 24 2 2 25 2 3 26 2 3 6 0 2 3 4 5 6 7 8 9 2 3 0 2 02 4 04 6 06 8 08 5 05 2 3 4 27 2 3 4 28 2 3 4 5 2 2

More information

202

202 201 Presenteeism 202 203 204 Table 1. Name Elements of Work Productivity Targeted Populations Measurement items of Presenteeism (Number of Items) Reliability Validity α α 205 α ä 206 Table 2. Factors of

More information

2 3 12 13 6 7

2 3 12 13 6 7 02 08 22AV55026AV550 17 25 32 22AV550 26AV550 39 50 2 3 12 13 6 7 3 4 11 8 8 9 9 8 9 23 8 9 17 4 11 4 33 12 12 11 24 18 12 10 21 39 21 4 18 18 45 45 11 5 6 7 76 39 32 12 14 18 8 1 2 32 55 1 2 32 12 54

More information

テストコスト抑制のための技術課題-DFTとATEの観点から

テストコスト抑制のための技術課題-DFTとATEの観点から 2 -at -talk -talk -drop 3 4 5 6 7 Year of Production 2003 2004 2005 2006 2007 2008 Embedded Cores Standardization of core Standard format Standard format Standard format Extension to Extension to test

More information

PCI Express Graphics Products

PCI Express Graphics Products PCI Express Graphics Products This graphics card uses the PCI Express hardware interconnect standard. It is designed to work using your PCI Express x16 I/O slot. PCI Express is the successor to the PCI,

More information

untitled

untitled Corporate Development Division Semiconductor Company Matsushita Electric Industrial Co.,Ltd. http://www.panasonic.co.jp/semicon/ DebugFactory Builder for MN101C PanaX IDE IBM PC/AT CPU Intel Pentium 450MHz

More information

DTN DTN DTN DTN i

DTN DTN DTN DTN i 28 DTN Proposal of the Aggregation Message Ferrying for Evacuee s Data Delivery in DTN Environment 1170302 2017 2 28 DTN DTN DTN DTN i Abstract Proposal of the Aggregation Message Ferrying for Evacuee

More information

1 Table 1: Identification by color of voxel Voxel Mode of expression Nothing Other 1 Orange 2 Blue 3 Yellow 4 SSL Humanoid SSL-Vision 3 3 [, 21] 8 325

1 Table 1: Identification by color of voxel Voxel Mode of expression Nothing Other 1 Orange 2 Blue 3 Yellow 4 SSL Humanoid SSL-Vision 3 3 [, 21] 8 325 社団法人人工知能学会 Japanese Society for Artificial Intelligence 人工知能学会研究会資料 JSAI Technical Report SIG-Challenge-B3 (5/5) RoboCup SSL Humanoid A Proposal and its Application of Color Voxel Server for RoboCup SSL

More information

Express5800/320Fa-L/320Fa-LR/320Fa-M/320Fa-MR

Express5800/320Fa-L/320Fa-LR/320Fa-M/320Fa-MR 7 7 Phoenix BIOS 4.0 Release 6.0.XXXX : CPU=Pentium III Processor XXX MHz 0640K System RAM Passed 0127M Extended RAM Passed WARNING 0212: Keybord Controller Failed. : Press to resume, to setup

More information

TH-42PAS10 TH-37PAS10 TQBA0286

TH-42PAS10 TH-37PAS10 TQBA0286 TH-42PAS10 TH-37PAS10 TQBA0286 2 4 8 10 11 17 18 20 21 22 23 24 25 26 27 28 29 30 31 32 33 38 42 44 46 50 51 52 53 54 3 4 5 6 7 8 3 4 1 2 9 5 6 1 4 2 3 5 6 10 11 1 2 3 4 12 13 14 TH-42PAS10 TH-42PAS10

More information

A Responsive Processor for Parallel/Distributed Real-time Processing

A Responsive Processor for Parallel/Distributed Real-time Processing E-mail: yamasaki@{ics.keio.ac.jp, etl.go.jp} http://www.ny.ics.keio.ac.jp etc. CPU) I/O I/O or Home Automation, Factory Automation, (SPARC) (SDRAM I/F, DMAC, PCI, USB, Timers/Counters, SIO, PIO, )

More information

1 138

1 138 5 1 2 3 4 5 6 7 8 1 138 BIOS Setup Utility MainAdvancedSecurityPowerExit Setup Warning Item Specific Help Setting items on this menu to incorrect values may cause your system to malfunction. Select 'Yes'

More information

メモリ階層構造を考慮した大規模グラフ処理の高速化

メモリ階層構造を考慮した大規模グラフ処理の高速化 , CREST ERATO 0.. (, CREST) ERATO / 8 Outline NETAL (NETwork Analysis Library) NUMA BFS raph500, reenraph500 Kronecker raph Level Synchronized parallel BFS Hybrid Algorithm for Parallel BFS NUMA Hybrid

More information

32C2100操作編ブック.indb

32C2100操作編ブック.indb 02 08 32C2100 18 24 31 37 2 3 12 13 6 7 68 67 41 42 33 34 3 4 11 8 18 4 11 4 22 13 23 11 23 12 13 14 15 10 18 19 20 20 10 9 20 18 23 22 8 8 22 9 9 4 30 10 10 11 5 13 13 16 15 26 24 37 40 39 6 7 8 1 2 29

More information

Thesis.dvi

Thesis.dvi 25 (412M528) 1 2 1 50% 75% 18% 2 18% (ED ) 34% 3 Abstract Increasing power consumption has been becoming a major concern not only for mobile computing but also high-performance computing, and processors

More information

2017 (413812)

2017 (413812) 2017 (413812) Deep Learning ( NN) 2012 Google ASIC(Application Specific Integrated Circuit: IC) 10 ASIC Deep Learning TPU(Tensor Processing Unit) NN 12 20 30 Abstract Multi-layered neural network(nn) has

More information

fx-9860G Manager PLUS_J

fx-9860G Manager PLUS_J fx-9860g J fx-9860g Manager PLUS http://edu.casio.jp k 1 k III 2 3 1. 2. 4 3. 4. 5 1. 2. 3. 4. 5. 1. 6 7 k 8 k 9 k 10 k 11 k k k 12 k k k 1 2 3 4 5 6 1 2 3 4 5 6 13 k 1 2 3 1 2 3 1 2 3 1 2 3 14 k a j.+-(),m1

More information

短距離スプリントドリルが大学生野球選手の短距離走速度向上に与える効果

短距離スプリントドリルが大学生野球選手の短距離走速度向上に与える効果 The Effect of Sprint Drills for Improving Short Sprinting Ability of University Baseball Players AKAIKE, Kohei The ability to generate speed during short sprints is one of the most important abilities

More information

RTM RTM Risk terrain terrain RTM RTM 48

RTM RTM Risk terrain terrain RTM RTM 48 Risk Terrain Model I Risk Terrain Model RTM,,, 47 RTM RTM Risk terrain terrain RTM RTM 48 II, RTM CSV,,, RTM Caplan and Kennedy RTM Risk Terrain Modeling Diagnostics RTMDx RTMDx RTMDx III 49 - SNS 50 0

More information

組込みシステムシンポジウム2011 Embedded Systems Symposium 2011 ESS /10/20 FPGA Android Android Java FPGA Java FPGA Dalvik VM Intel Atom FPGA PCI Express DM

組込みシステムシンポジウム2011 Embedded Systems Symposium 2011 ESS /10/20 FPGA Android Android Java FPGA Java FPGA Dalvik VM Intel Atom FPGA PCI Express DM Android Android Java Java Dalvik VM Intel Atom PCI Express DMA 1.25 Gbps Atom Android Java Acceleration with an Accelerator in an Android Mobile Terminal Keisuke Koike, Atsushi Ohta, Kohta Ohshima, Kaori

More information

C C C - J TH-D TH-D TH-D C C C C C - J TH-D TH-D TH-D C - J TH-D TH-D TH-D C C C C

C C C - J TH-D TH-D TH-D C C C C C - J TH-D TH-D TH-D C - J TH-D TH-D TH-D C C C C C Matsushita Electric Industrial Co., Ltd. - J TH-D TH-D TH-D C C C C - J TH-D TH-D TH-D C C C C C - J TH-D TH-D TH-D C - J TH-D TH-D TH-D C C C C - J FGIH FGIH FG IH FGIH F G FGIH - J c c c c c c C C

More information

On the Wireless Beam of Short Electric Waves. (VII) (A New Electric Wave Projector.) By S. UDA, Member (Tohoku Imperial University.) Abstract. A new e

On the Wireless Beam of Short Electric Waves. (VII) (A New Electric Wave Projector.) By S. UDA, Member (Tohoku Imperial University.) Abstract. A new e On the Wireless Beam of Short Electric Waves. (VII) (A New Electric Wave Projector.) By S. UDA, Member (Tohoku Imperial University.) Abstract. A new electric wave projector is proposed in this paper. The

More information

F9222L_Datasheet.pdf

F9222L_Datasheet.pdf Introduction Fuji Smart power device M-POWER2 for Multi-oscillated current resonant type power supply Summary System: The ideal and Fuji s original system It includes many functions(soft-switching,stand-by).

More information

003村江.indd

003村江.indd *1 Study on Room ressure Control at Cleanroom art 1 Experiments on Room ressure Fluctuation with Door Operation and Local Ventilation Operation Yukitada MURAE *1 Tamio IWAMURA *2 Hiroyuki NAGAI *3 Shigeru

More information

LAN LAN LAN LAN LAN LAN,, i

LAN LAN LAN LAN LAN LAN,, i 22 A secure wireless communication system using virtualization technologies 1115139 2011 3 4 LAN LAN LAN LAN LAN LAN,, i Abstract A secure wireless communication system using virtualization technologies

More information

17 Proposal of an Algorithm of Image Extraction and Research on Improvement of a Man-machine Interface of Food Intake Measuring System

17 Proposal of an Algorithm of Image Extraction and Research on Improvement of a Man-machine Interface of Food Intake Measuring System 1. (1) ( MMI ) 2. 3. MMI Personal Computer(PC) MMI PC 1 1 2 (%) (%) 100.0 95.2 100.0 80.1 2 % 31.3% 2 PC (3 ) (2) MMI 2 ( ),,,, 49,,p531-532,2005 ( ),,,,,2005,p66-p67,2005 17 Proposal of an Algorithm of

More information

H2000操作編ブック.indb

H2000操作編ブック.indb 02 08 18 32H200037H200042H2000 26 37 46 53 2 3 12 13 6 7 37 29 40 42 38 78 79 3 4 11 40 29 42 9 9 8 8 10 18 27 27 38 38 38 20 19 39 13 13 11 48 12 13 38 38 14 43 8 4 11 25 24 4 38 22 24 10 9 18 24 4 36

More information

〈論文〉組織改革の成果に関する予備的調査--社内カンパニー制導入が財務的業績に与える影響

〈論文〉組織改革の成果に関する予備的調査--社内カンパニー制導入が財務的業績に与える影響 Abstract Under the pressure of 10-year long economic decline, Japanese firms are struggling to improve their profitability. As one of the ways to do it, Japanese large firms have begun to reorganize their

More information

2

2 8 26 38 37Z800042Z800047Z8000 54 65 72 83 101 2 3 4 7 101 53 27 33 7 8 9 5 7 9 22 47 72 8 8 8 8 102 8 13 7 7 7 65 10 67 67 13 71 40 67 67 67 67 43 67 12 55 55 11 104 8 24 26 24 20 25 6 1 2 3 18 46 101

More information

日本看護管理学会誌15-2

日本看護管理学会誌15-2 The Journal of the Japan Academy of Nursing Administration and Policies Vol. 15, No. 2, PP 135-146, 2011 Differences between Expectations and Experiences of Experienced Nurses Entering a New Work Environment

More information

単位、情報量、デジタルデータ、CPUと高速化 ~ICT用語集~

単位、情報量、デジタルデータ、CPUと高速化  ~ICT用語集~ CPU ICT mizutani@ic.daito.ac.jp 2014 SI: Systèm International d Unités SI SI 10 1 da 10 1 d 10 2 h 10 2 c 10 3 k 10 3 m 10 6 M 10 6 µ 10 9 G 10 9 n 10 12 T 10 12 p 10 15 P 10 15 f 10 18 E 10 18 a 10 21

More information

Introduction Purpose This training course describes the configuration and session features of the High-performance Embedded Workshop (HEW), a key tool

Introduction Purpose This training course describes the configuration and session features of the High-performance Embedded Workshop (HEW), a key tool Introduction Purpose This training course describes the configuration and session features of the High-performance Embedded Workshop (HEW), a key tool for developing software for embedded systems that

More information

The social image of Muay Thai in Thailand Hishida yoshifumi Abstract Muay Thai is a martial art which is a root of Japanese Kick Boxing and K-1. It has become a famous sport among Thai as a martial art.

More information

02 08 32C700037C700042C7000 17 25 32 39 50 2 3 12 13 6 7 3 4 11 8 8 9 9 8 9 23 8 9 17 4 11 4 33 12 12 11 24 18 12 10 21 39 21 4 11 18 45 5 6 7 76 39 32 12 14 18 8 1 2 31 55 1 2 31 12 54 54 9 1 2 1 2 10

More information

Hiroshi OSAWA A Study of Nutrition and Behavior With Particular Reference to Functional Hypoglycemia In order to understand causes of various kinds of problem behavior in the present time, it is assumed

More information

Microsoft Word - Meta70_Preferences.doc

Microsoft Word - Meta70_Preferences.doc Image Windows Preferences Edit, Preferences MetaMorph, MetaVue Image Windows Preferences Edit, Preferences Image Windows Preferences 1. Windows Image Placement: Acquire Overlay at Top Left Corner: 1 Acquire

More information

Building a Culture of Self- Access Learning at a Japanese University An Action Research Project Clair Taylor Gerald Talandis Jr. Michael Stout Keiko Omura Problem Action Research English Central Spring,

More information

Influence of Material and Thickness of the Specimen to Stress Separation of an Infrared Stress Image Kenji MACHIDA The thickness dependency of the temperature image obtained by an infrared thermography

More information

The Evaluation on Impact Strength of Structural Elements by Means of Drop Weight Test Elastic Response and Elastic Limit by Hiroshi Maenaka, Member Sh

The Evaluation on Impact Strength of Structural Elements by Means of Drop Weight Test Elastic Response and Elastic Limit by Hiroshi Maenaka, Member Sh The Evaluation on Impact Strength of Structural Elements by Means of Drop Weight Test Elastic Response and Elastic Limit by Hiroshi Maenaka, Member Shigeru Kitamura, Member Masaaki Sakuma Genya Aoki, Member

More information

28 Docker Design and Implementation of Program Evaluation System Using Docker Virtualized Environment

28 Docker Design and Implementation of Program Evaluation System Using Docker Virtualized Environment 28 Docker Design and Implementation of Program Evaluation System Using Docker Virtualized Environment 1170288 2017 2 28 Docker,.,,.,,.,,.,. Docker.,..,., Web, Web.,.,.,, CPU,,. i ., OS..,, OS, VirtualBox,.,

More information

SUMMARY This paper evaluates the livelihood recovery programs in the affected area of the Great East Japan Earthquake disasters, conducted by NPO/NGOs, private companies and governments. This was the first

More information

デジタルカメラ用ISP:Milbeaut

デジタルカメラ用ISP:Milbeaut ISP Milbeaut Image Signal Processor: Milbeaut あらまし MilbeautISP Image Signal Processor 20 Mpixel Milbeaut6 MB91696AM MB91696AM Abstract Milbeaut is an image signal processor (ISP) that realizes a digital

More information

Mikio Yamamoto: Dynamical Measurement of the E-effect in Iron-Cobalt Alloys. The AE-effect (change in Young's modulus of elasticity with magnetization

Mikio Yamamoto: Dynamical Measurement of the E-effect in Iron-Cobalt Alloys. The AE-effect (change in Young's modulus of elasticity with magnetization Mikio Yamamoto: Dynamical Measurement of the E-effect in Iron-Cobalt Alloys. The AE-effect (change in Young's modulus of elasticity with magnetization) in the annealed state of iron-cobalt alloys has been

More information