Taro12-イノベ-ション経営研究会
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14 DRAM M DRAM DRAM DRAM DRAM DRAM DRAM 55 (45 ) LSI ,000 9,000 ( ) nm 11 SoC ASPLA(Advanced SoC Platform Corp.) 315 NEC 90nm NEC NEC
15 DRAM DRAM (7) DRAM 2000 DRAM IDC Japan 5/2001 DRAM DRAM DRAM 1970 DRAM PMOS(P-channel Metal Oxide Semiconductor) TI 1 1 DRAM DRAM TI DRAM 16 DRAM DRAM DRAM DRAM
16 DRAM PMOS NMOS(N-channel Metal Oxide Semiconductor) E D E/D NMOS CMOS(Complementary Metal Oxide Semiconductor) DRAM TI 1970 DRAM DRAM k DRAM TI 16 DRAM DRAM 64 DRAM DRAM DRAM DRAM TI 3 DRAM k DRAM NEC 256k DRAM 1 1M DRAM NMOS CMOS DRAM 1DRAM 1985 DRAM M DRAM ( )
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18 DRAM DRAM DRAM DRAM ( ) DRAM
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20 25 5 DRAM DRAM WSTS DRAM DRAM DRAM TI
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23 NEC MOS LSI MOS LSI QT-8D MOS LSI 1970 ROM WD-3000 PROM(Programmable Read Only pp
24 Memory) PROM PROM PROM PROM PROM ROM ROM ROM NMOS IQ ROM NMOS 64 CMOS CMOS NMOS NMOS 64 ROM 3 ROM (Serial-parallel ROM cell structure) ROM IQ CMOS 256 ROM IQ-5000 ROM ROM ROM ROM S. Kamuro, et al., 64k DSA ROM, IEEE Journal of Solid-State Circuits, Vol.SC-15, No.2, pp , April S. Kamuro, et al., High Density CMOS Read Only Memories for a Handheld Electronics Language Translator, IEEE Transaction on Consumer Electronics, Vol.CE-27, No.4, pp , November S. Kamuro, et al., A 256k ROM Fabricated Using n-well CMOS Process Technology, IEEE Journal of Solid-State Circuits, Vol.SC-17, No.4, pp , August
25 DVD LSI TV LSI LSI LSI( ) 128 CPU LSI LSI LSI LSI NMOS 64 ROM CMOS 128 ROM a ()
26 NEC PC98 NEC PC98 PC98 PC
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28 SEMATEC
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30 15% GDP 3.4% 0.6% 4.2%0.9% (ITE- ) ( ITS) PC 2 PC Analog wavefirst digital wavesecond digital wave 3 TV VCRPCDigital consumernetwork IC 1 OS Wintel 2 MPU (SOC)
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47 IC 1 FAB 2 SMICGSMC
48 21 DVD SeleteStarc
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50 SEMATEC
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52 - 47 -
53 - 48 -
54 3 1 90nm
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61 60 NPI BTO/CTO ( EMSSCM IT
62 EMS EMS EMS / A DSL,FTTH) D WDM) GPSS PDA EMS
63 EMS Market EMS Market EMS EMS EMS EMS EMS Top Priority Core EMS Outsource Gap EMS EMS
64 DRAM,ASIC,Flash,LaserFiber Test/ HDD OS DataBase EMS Outsource CoreCompetency A. R&D EMS B. C. VCR,CD,DVD,HDD D. C EMS 1980, AMDHDD SeagateMaxtorWestern Digital DRAM Dell, Compaq, IBM Sun Micro Cisco Impact Motolora, Lucent, Nortel, Nokia, Ericsson EMS EMS EMS
65 EMS EMS EMS NPI SI EMS BTO/CTO EMS -EMS - EMS - -Risk - - NPI - - EMS NPI BTO/CTO
66 EMS 1. Q/C/D 2. R&D EMS IBM, ) 2) 3) Asset EMS EMS EMS IT
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68 DRAM Mos Memory MOS ( CPU )
69 3 1 2 LSI LSI System-in-package EETIMS System-on-chip LSI LSI System-in-package LSI LSI CPU IP LSI LSI Technologies integrated on a chip LSI 20 (DRAM) FeRAM IC
70 Chemical sensors Issues in System-on-Chip IP 1 IP LSI Silicon MEMS microphon MEMS 0.1m LSI SoC vs SiP EETIMS System in a Package 3D System Integration Ezampl North Corporation LSI LSI LSI LSI
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72 LSI LSI LSI TI LSI LSI LSI In LSI DRAM ( ) IP( )
73 LSI 3 LSI
74 System LSI System-in-Package
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76 21 ( ) ( 110) LSI (3 )LSI SEMATECH CRPFocus Center Research Program Si
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78 0.5V Si3N4 5V Flash (TFT)
79 600 LSI (110) (111) LSI O2 (100)Balanced CMOS (110) CMOS LSI CMOS 5 NANDNOR CMOS LSI LSI LSI
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81 21 LSI (2 )
82 LSI 200mm m 1000 (100) MOS 910 MOS 1 25 kwh t CO2 ( ) (600 ) LSI ( 13 ) (
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84 DRAM
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94 SEMATEC
95 1990 ( 10 ) WINTEL MPUDRAM 2000 ( ) i IT IT IT IP I ( ) ( )
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