目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. 招待講演 5 6. パネルディスカッション 6 7. ポスターセッション 6 8. オーサーズコーナー 6 9. イブニングセッション 商業展示 コマーシャルセッショ

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1 目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. 招待講演 5 6. パネルディスカッション 6 7. ポスターセッション 6 8. オーサーズコーナー 6 9. イブニングセッション 商業展示 コマーシャルセッション 参加費 参加申込要領 キャンセル規定 宿泊施設のご案内 最新情報 シンポジウム企画運営委員会 ナノテスティング学会事務局 講演プログラム 9 11 月 8 日 (水) 午前 9 11 月 8 日 (水) 午後 月 9 日 (木) 午前 月 9 日 (木) 午後 月 10 日 (金) 午前 月 10 日 (金) 午後 著者索引 商業展示 賛助会員一覧 22 1

2 2 5F Tel: ( ) 6F 2-1-D-1 Tel:

3 3 5F 6F ( ) 17:00 18:00 Leo Lorenz [Senior Principal Infineon Techn.(Technology Advisor), President of the Board of ECPE, IEEE Fellow] Topics on power devices and their applications ( ) 13:15 14:15 SiC () () ( ) 13:10 14:10 () (, ) ( ) 15:35 17:35 5F ( ) Current Visualization ( ) 13:00 14:00 6F (1 ) 11:25 11:40 5F () ( ) A 10 (6 ) (2, 3 ) (2 ) ( ) Web Web Web PDF 5 6 7

4 ( ) Web ( ) 17:00 10% 100% 14 5 Web 15 Web 16 () ( ) () ( ) () ( ) () ( ) ( ) () ( FEI) (NGR) Tel/Fax: / NANOTS@ist.osaka-u.ac.jp Web: ( ) :00 10: Process Evaluation Techiques: Metrology and Inspection 8 ( ) a.m. (1) 10:10 (a, (a, (c / a), b), c) (2) 10:35 (3) 11:00 (a, (b, (a / a), b) SEM (a, (a, (b, (b / a), b) Poster Short Presentation 8 ( ) a.m. 11:25 Postre Short Presentation Poster Session 1 11:40 Poster Session :40 12: :00 13: Poster Session 11 8 ( ) 8 ( ) p.m :00 14:00 6F (4),, / (5),, / (6),,, / (7) AES ( 2),, /

5 (8) Arbiter PUF (Physical Unclonable Function) NBTI/PBTI,, / (9) p-bits,, / (10) LSI PUF,, / (11),,,, / (12) STEM,, / Fault Localization (13) 14:00 (14) 14:25 (15) 14:50 8 ( ) p.m. Magneto-Optical Frequency Mapping (MOFM) (a, (a, (a, (a, (b, (b, (b / a), b) 18 (SOBIRCH) (a, (b / a) 18, b) / :15 15:35 & Panel Discussion 15:35 17:35 (P0) (P1) (P2) (P3) (P4) (P5) (P6) (P7) Current Visualization / 8 ( ) p.m. / / / / / / FEI / : / Magneto-Optical Frequency Mapping / nt / : SOBIRCH / 18 Current imaging using SQUID and GMR sensors for failure analysis (a, A. Orozco (b / a) LCD Gr., b) Neocera LLC,, / EBIRCH / Materials & Structural Analysis OBIRCH / (16) 9:00 (17) 9:25 (18) 9: ( ) Electron Optics & Applications 9 ( ) a.m. Denoising of noisy electron hologram by using a wavelet-based hidden markov model Y. Midoh, K. Nakamae / Osaka Univ. Grad. Sch. Information Science and Technology Hole free phase plate imaging for electron tomography M. Hayashida (a, M. Malac (a, N. Jehanathan (b, C. Pawlowicz (b, S. Motoki (c, M. Kawasaki (d, Y. Konyuba (c / a) National Research Council Canada NRC-Nano, b) TechInsights, c) JEOL, d) JEOL USA,,,, / :15 10:35 & Commercial Session (C1) 10:35 (C2) 10:42 (C3) 10:49 (C4) 10:56 (C5) 11:03 9 ( ) a.m. X () / Bni / IC MP101 (a, (a, (b, (c / a), b), c) CAD AZSA ( ),,, / Gr LAVIS-plus 3 / TOOL EDA

6 (C6) 11:10 (C7) 11:17 (C8) 11:24 (C9) 11:31 (C10) 11:38 (C11) 11:45 (C12) 11:52 (C13) 11:59 (C14) 12:06 EO,, / 7nm nprober III / Materials & Structural Analysis FE-SEM: JSM-7900F, / SM SM / & (a, (b / a), b) (b, (a / a) 2, b) 3 2 FIB (a, M. Surendra (b / a) FEI, b) X. Lin, M. Williamson / ( FEI) PERET / () :13 12: :15 13: Invited Talk (I1) 13: ( ) : SiC MOS / :15 14: Power Device Analysis I (19) 14:35 (20) 15:00 (21) 15:25 IGBT (a, (a, (a, (b, (b, (b, (b / a) &, b) SiC MOSFET (a, (a, (b / a), b) SPM GaN-HEMT,, / :50 16:10 & Power Device Analysis II (22) 16:10 (23) 16:35 (a, (b, (b, (b, (c / a) &, b), c),, / :00 17:20 & Special Invited Talk (S1) 17:20 Special invited talk: Topics on power devices and their applications L. Lorenz / Senior Principal Infineon Techn.(Technology Advisor), President of the Board of ECPE, IEEE Fellow :20 18: Evening Session 18:50 20:50 (24) 9:00 (25) 9:25 ISPSD 2017 ( ) EIPBN 2017 ( ) IOLTS 2017 ( ) MNE 2017 ( ) Physical Analysis I ( ) 10 ( ) a.m. X (a, (b, (b, (c, (d / a) &, b) &, c) & IC, d) & SEM/FIB ifast in-situ /

7 (26) 9:50 (a, G. Loechelt (b, P. Burke (c / a) R&D, b) MOSFET, c) R&D :15 10:35 & Physical Analysis II (27) 10:35 (28) 11:00 (29) 11:25 10 ( ) a.m. DLTS SiO 2 /SiC, / DLTS, / Describing buried interface roughness by wavelet transforms M. Malac (b, M. Hayashida (a, D. Homeniuk (a / a) Nanotechnology Research Centre National Research Council, b) Department of Physics University of Alberta :50 12: :10 13: Invited Talk (I2) 13: ( ) 10 ( ) p.m. Individual and group behavior in physics -ab initio calculation method in quantum few-body problem /, :10 14: Physical Analysis III (30) 14:30 (31) 14:55 (32) 15:20 10 ( ) p.m. Zero defect GOI / Corporate R&D Wafer Process Development FE-SEM/EDS,,,,, / STEM 2 2,,, / EM :45 16:05 & Physical Analysis IV 10 ( ) p.m. (33) () Quantitative doping concentration using scanning microwave impedance microscopy on a cross-section silicon power device O. Amster, S. Friedman, Y. Yang, F. Stanke / PrimeNano, Inc. Advanced Testing Equipment and Systems (34) 16:05 (35) 16:30,,,,, / (a, (b, (b / a) LSI, b) :55 17: C Burke, P Hayashida, M. 17, 29 Homeniuk, D Jehanathan, N Kawasaki, M Konyuba, Y Lin, X C13 Loechelt, G Lorenz, L S1 Malac, M , 29 Midoh, Y Motoki, S Nakamae, K Orozco, A P4 Pawlowicz, C Surendra, M.... C12 Williamson, M.. C C , C , 22, C C P C C C , 22, C , C , P C C C C , C , P , P P2..4, 5, 7, 8, 9, 10, 12, C4. 13, 22, C C P0, P I , C C , 14, P3, 19, 22, , P1... 7, 8, 10. 4, 5, 9, P6, C C I C C C ,

8 ( ) 10 ( ) 10:00 17:00 6F () C 1. : : 3. ATE : DI Lab System (Teseda V550), (CTS-01A) 4. : C3 MP101, 5. : 6. : C7,C12,C13 FIB/SEM/TEM 7. : AFM NX-Hivac 8. : C8,C10 9. : SEM/FIB,, 10. : C4 CAD-Navigation System AZSA : 12. : C6 13. TOOL : C5 LAVIS-plus 14. : 15. RKD Engineering Corp, Inc (Shining Technology Corporation): The Industry Leader in Semiconductor Sample Preparation Equipment 16. : C9 Neocera SQUID Magma, ZEISS FE-SEM GeminiSEM300/500, ZEISS FIB-SEM Crossbeam340/550, Keysight SMM 17. : AP : (EOP/EOFM) 19. : & 3 X (X CT) : C1 X Y.Cheetah HD 21. Zurich Instruments: Lock-in amplifiers for advanced failure analysis testing up to 600 MHz 22. : 23. : C : 25. : C2 Bni 26. : C14 TEM CSMOS ( Rio ) / ( PERET) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ATE ( ) ( ) ( )NGR ( ) ( ) TOOL( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) MultiProbe Inc. Shining Technology Corporation Zurich Instruments 22 ( )

目次 1. 会場 1 2. フロアマップ 1 3. 特別招待講演 1 4. 招待講演 2 5. パネルディスカッション 2 6. ポスターセッション 2 7. オーサーズコーナー 2 8. イブニングセッション 3 9. 商業展示 コマーシャルセッション Luncheon Seminar

目次 1. 会場 1 2. フロアマップ 1 3. 特別招待講演 1 4. 招待講演 2 5. パネルディスカッション 2 6. ポスターセッション 2 7. オーサーズコーナー 2 8. イブニングセッション 3 9. 商業展示 コマーシャルセッション Luncheon Seminar 目次 1. 会場 1 2. フロアマップ 1 3. 特別招待講演 1 4. 招待講演 2 5. パネルディスカッション 2 6. ポスターセッション 2 7. オーサーズコーナー 2 8. イブニングセッション 3 9. 商業展示 コマーシャルセッション 3 10. Luncheon Seminar 3 11. 参加費 3 12. 参加申込要領 4 13. キャンセル規定 5 14. 宿泊施設のご案内

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目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. ポスターセッション 5 6. オーサーズコーナー 6 7. イブニングセッション 6 8. 商業展示 コマーシャルセッション 6 9. Luncheon Seminar 6 10 目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. ポスターセッション 5 6. オーサーズコーナー 6 7. イブニングセッション 6 8. 商業展示 コマーシャルセッション 6 9. Luncheon Seminar 6 10. 参加費 6 11. 参加申込要領 7 12. キャンセル規定 8 13. 宿泊施設のご案内 8 14.

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