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1 LSI ( ) ( ) ( ) ( ) ( ) ( )
2 2 5F Tel: ( ) 6F 2-1-D-1 Tel: Dr. Mario Paniccia Intel Fellow, Director Photonics Technology Lab., Corporate Technology Group, Intel Corporation Silicon Photonics Enabling optical for every computing device :35 17:35 4 I & II SiC 11 9 ( ) 5 9:00 9:30 9 : SEM 10 : 11 : :15 15:45 6F LSI 2 10 ( ) A 4 5 6
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4 ( ) :00 9: ( ) a.m. (T1) SEM 9:05 / :30 9: (1) 9:40 (2) 10:00 (3) 10:20 (4) 10:30 (5) 10:40 9 ( ) a.m. 200 kv SEM LSI (a, (a, (b, (b / a), b) (a, H. Mito (a, S. Shinoda (b, Y. Toyoda (b / a) Hitachi High-Technologies Corp. Semiconductor Process Control System Design Div., b) Hitachi Research Laboratory CD 3 AFM (a, (a, R. Yoo (b / a), b) Park Systems Corp. SEM (II),, / X, / X :00 11: (6) 11:10 (7) 11:20 (8) 11:40 (9) 12:00 9 ( ) a.m. Wavelet SEM,, / L&S (a, (a, (a, (b / a), b) (a, (b, (b, (b, Y. Jeong (c, Y. Yang (c, S. Cho (d / a), b) ER-Center, c), d) VLSI (a, (a, (b, (b, (b, (a / a), b) :10 13:10 (30 ) ( ) I & 9 ( ) p.m. (10) 13:10 (11) 13:25 (12) 13:40 MOSFET /, / & MOSFET, / (13) 13:55, / :10 14: (14) 14:20 (15) 14:35 (16) 14:50 (17) 15:05 (18) 15:20 FIB, /, / / DCG IGBT 3 CT (a, (a, (b / a), b) 3 Non-destructive failure analysis of IGBTs using X-ray microscopy J. Gelb (a, R. Estrada (a, Y. Goto (b, A. Kawauchi (c, S. Aoki (c, W. Yun (a / a) Xradia, Inc., b) Toyota Motor Corp., c) Canon Marketing Japan :35 15: II SiC 9 ( ) p.m. (19) 15:55 (20) 16:15 (21) 16:35 (22) 16:55 (23) 17:15 SiC / / (FUPET) SiC MOSFET,, / SiC SiC (a, (a, (b, (a, (c, (c / a), b), c) SiC MOS,,,, / SiC /
5 (24) 17:35 Investigation of Al distribution as a dopant in a SiC-based diode M. Schuhmacher, A. Merkulov, P. Peres / CAMECA R&D 9 ( ) p.m :15 15:45 6F (25) Si,,,,, / (26) (a, (a, (b, (c, (c, (a / a), b), c) & (27) Site-specific physical failure analysis of 3D systems using plasma FIB P.D. Carleson (a, R.J. Young (a, R. Routh (a, C. Rue (a, G. Franz (b, L.F.T. Kwakman (b / a) FEI Company, b) FEI Electron Optics (28) Full thickness silicon trenching technique for advanced backside circuit edit (a, (a, M. Antolik (b, R. Cumming (b, R. Jain (b / a) DCG, b) DCG Systems Inc. (29) 3D FIB-SEM,,,,,, / (30) FIB-SEM LSI (a, (a, (a, (a, (b, (a, (c, (c, (d, (d, (d / a), b), c), d) ( ) 10 ( ) a.m. (T2) 9:00 / :30 9: (C1) 9:45 (C2) 9:51 (C3) 9:57 (C4) 10:03 (C5) 10:09 (C6) 10:15 (C7) 10:21 (C8) 10:27 (C9) 10:33 10 ( ) a.m.,, / TAQS () G. Anderson (a, (b, (b / a), b) Control Laser,, / CAD AZSA ( ),,, / HOTSCOPE / DFM Knights CAD /FIBable / LAVIS 3D-IC (a, (b / a) TOOL EDA, b) TOOL EDA FIB SMI4050,,,,,, / BT DualBeam Helios450s, 600,, / 14 (C10) 10:39 (C11) 10:45 (C12) 10:51 (C13) 10:57 (C14) 11:03 (C17) 11:09 (C15) 11:15 SEM JSM-7800F (a, (b, (b / a), b) SM SD Centurio JEM-2800 (a, (b, (b, (b, (b, (b / a), b) EM FE-SEM SU9000 (a, (a, (a, (a, (b, (a / a), b) X CT / 2 SEM / /,,, / (C16) Semiconductor devices analysis by atom probe 11:21 tomography D. Larson (a, D. Lawrence (a, D. Olson (a, T. Prosa (a, W. Lefebvre (b, R. Ulfig (a, P. Clifton (a, T. Kelly (a / a), b) :27 13: ( ) IC (31) 13:00 (32) 13:20 10 ( ) p.m. (a, (a, (b, (b, (a, (a / a) &, b) Tr-Z, / 15
6 (33) 13:30 Scan chain (a, (b, (a, (a, (a / a), b) (34) (35) 13:50 SQUID LTEM (a, (a, (b, (c, (a, (a / a), b), c) (36) Ultimate Functional BOST 14:00 REL-FDT SDL (Soft Defect Localization) (a, (a, (a, (b, (c, (d, (d / a) MCU, b) MCU, c), d) :20 14: (37) 14:45 (38) 15:05 (39) 15:15 (40) 15:25 10 ( ) p.m. (a, (a, (b / a), b) LSI THz (II) (a, (b, (c, (a, (a / a), b), c), / (a, (b, (a, (a, (a / a), b) (41) 15:35,,, / (42) IR-OBIRCH 15:45, / :05 16:35 (30 )..... (S1) 16:35 10 ( ) p.m. Silicon photonics enabling optical for every computing device M. Paniccia / Intel Corp. Corporate Technology Group, Director Photonics Technology Lab. 18:00 20:30 (T3) 9: ( ) 10 ( ) p.m. 11 ( ) a.m. / (43) 9:30 (44) 9:50 (45) 10:10 11 ( ) a.m. SDL (a, (a, (a, (a, (a, (a, (b, (b, (b / a) MCU, b) MCU Expanding CMOS VLSI analysis techniques by time resolved imaging P. Perdu (a, G. Bascoul (a, (b, (b / a) CNES Lab. and Expertise Dept., b) 3 18 (a, (a, (a, (a, (a, (b, (b, (b / a), b) :30 10: (46) 10:45 (47) 11:05 (48) 11:25 11 ( ) a.m. IGBT (a, (a, (b, (b / a) DCG, b) 3 3D,, / 18 (a, (b, (c, (d / a) DCG, b) DCG, c), d)
7 (49) 11:45 (a, (b, (c, (d / a) &, b) &, c), d) :05 13:10 (30 )..... I (50) 13:10 (51) 13:30 (52) 13:50 (53) 14: ( ) 11 ( ) p.m. CoC,, / S&S SIL (a, (a, (a, (a, (a, (a, (a, (a, (b / a), b) MONOS Vth, / SSRM (Scanning Spreading Resistance Microscopy) (a, (a, (a, (b, (c, (d, (a, (a / a) &, b), c), d) & :30 14: II (54) 14:45 11 ( ) p.m. STEM-CBED STEM-EELS MOS,,,,,, / 19 (55) 15:05 (56) 15:25 (a, (a, (a, (b, (b / a) EM, b) SDD,,,,,, / EM (57) 15:45,,, / :55 16:25 (30 ) C Anderson, G..... C2 Antolik, M Aoki, S Bascoul, G Carleson, P.D Cho, S Clifton, P C16 Cumming, R Estrada, R Franz, G Gelb, J Goto, Y Jain, R Jeong, Y Kawauchi, A Kelly, T C16 Kwakman, L.F.T.. 27 Larson, D C16 Lawrence, D.... C16 Lefebvre, W.... C16 Merkulov, A Mito, H Olson, D C16 Paniccia, M S1 Perdu, P Peres, P Prosa, T C16 Routh, R Rue, C Schuhmacher, M.. 24 Shinoda, S Toyoda, Y Ulfig, R C16 Yang, Y Yoo, R Young, R.J Yun, W C , C C4.... C , C C C C C C11, 55, , C C C C C C C11, 55, C C3.. 49, , C C , , , C T C T , C C C , C C , C C13, C C C , C C C , T C C , 6, 9, 35, 38, 51, C , 45, , , , , , C , , 50, C7. 44, 45, , , C , C C11, 55, , 37, C , , 6, 35, 38, C ,
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目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. ポスターセッション 5 6. オーサーズコーナー 6 7. イブニングセッション 6 8. 商業展示 コマーシャルセッション 6 9. Luncheon Seminar 6 10
目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. ポスターセッション 5 6. オーサーズコーナー 6 7. イブニングセッション 6 8. 商業展示 コマーシャルセッション 6 9. Luncheon Seminar 6 10. 参加費 6 11. 参加申込要領 7 12. キャンセル規定 8 13. 宿泊施設のご案内 8 14.
目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. 招待講演 5 6. パネルディスカッション 6 7. ポスターセッション 6 8. オーサーズコーナー 6 9. イブニングセッション 商業展示 コマーシャルセッショ
目次 1 タイムテーブル 1. タイムテーブル 1 2. 会場 4 3. フロアマップ 5 4. 特別招待講演 5 5. 招待講演 5 6. パネルディスカッション 6 7. ポスターセッション 6 8. オーサーズコーナー 6 9. イブニングセッション 6 10. 商業展示 コマーシャルセッション 6 11. 参加費 7 12. 参加申込要領 8 13. キャンセル規定 8 14. 宿泊施設のご案内
目次 1. 会場 1 2. フロアマップ 1 3. 特別招待講演 1 4. 招待講演 2 5. パネルディスカッション 2 6. ポスターセッション 2 7. オーサーズコーナー 2 8. イブニングセッション 3 9. 商業展示 コマーシャルセッション Luncheon Seminar
目次 1. 会場 1 2. フロアマップ 1 3. 特別招待講演 1 4. 招待講演 2 5. パネルディスカッション 2 6. ポスターセッション 2 7. オーサーズコーナー 2 8. イブニングセッション 3 9. 商業展示 コマーシャルセッション 3 10. Luncheon Seminar 3 11. 参加費 3 12. 参加申込要領 4 13. キャンセル規定 5 14. 宿泊施設のご案内
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